会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 123. 发明专利
    • FORMATION OF THIN FILM
    • JPS6311670A
    • 1988-01-19
    • JP21750586
    • 1986-09-16
    • TOSHIBA CORP
    • MATSUDA TETSURO
    • H01L21/285C23C8/24C23C16/04C23C16/12C23C16/34C23C16/44C23C16/455H01L21/28
    • PURPOSE:To form a good-quality high melting point metallic film on the surface of substrates to be treated by preliminarily forming a metal nitride film on the inside wall of a reaction vessel and the surface of members except the substrates to be treated thereby preventing the decrease in the deposition speed and selectively arising from the high melting point metallic film sticking to the above-mentioned inside wall, etc., in the previous stage. CONSTITUTION:After a quartz boat 10 supporting plural sheets of the substrates 9 to be treated is disposed in a reaction tube 1, the inside of the furnace is heated to a prescribed temp. The inside of the tube 1 is evacuated 8 and thereafter, gaseous WF6 and gaseous H2 are respectively supplied 3, 4 into the tube 1 to grow a W film in a vapor phase onto the substrates 9 to a prescribed thickness. The inside of the tube 1 is thereafter evacuated to a reduced pressure and the inside of the tube 1 is heated to a prescribed temp. Gaseous NH3 is introduced 6 into the tube 1 to form a W2N film 22 on the surface of the W film 15 sticking the inside wall of the tube 1 and the surface of the boat 10. Another substrates 9 to be treated are then disposed again into the boat 10 subjected to a nitriding treatment and after the substrates are disposed in the tube 1, a series of the above-mentioned stages for forming the W film and W2N film are repeated.
    • 127. 发明专利
    • FORMATION OF METALLIC THIN FILM
    • JPS57158371A
    • 1982-09-30
    • JP4221181
    • 1981-03-23
    • FUJITSU LTD
    • ITOU TAKASHI
    • C23C16/12H01L21/28H01L21/285
    • PURPOSE:To form a uniform thin Al film even on a substrate with a large step without causing breaking by dissociating AlX3 (X is halogen) in a gaseous plasma atmosphere and depositing the formed metallic Al on the surface of the substrate at a specified temp. CONSTITUTION:AlX3 9 as starting material in a container 8 is sublimed by heating with a heating furnace 10. Gaseous H2 is introduced as a carrier gas from an inlet 11. the internal pressure of a reactive tube 1 is suitably kept by evacuation from an exhaust port 7 and the introduction of H2 or an inert gas from an inlet 12. A susceptor 3 is heated to a temp. below the m.p. of Al and above the sublimation temp. of AlX3 with a high frequency coil 2. At the same time, plasma is generated in the gaseous H2 contg. AlX3 in the tube 1, the AlX3 is dissociated, and a thin Al film is formed on the surface of an si wafer 4. Even in case of a substrate with a step obtd. by forming an SiO2 pattern on the wafer 4, Al is deposited on the surface of the substrate and the surface of the SiO2 wall in the almost same thickness.