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121. 发明申请

US20070056421A1 Punch blade 审中-公开
标题翻译：冲压刀片
公开(公告)号：US20070056421A1
公开(公告)日：2007-03-15
申请号：US11513600
申请日：2006-08-31
申请人： Fumio Shimizu
发明人： Fumio Shimizu
IPC分类号： B26D5/08 , B26D1/14
CPC分类号： B26F1/14 , B26F1/36 , B26F2001/4436 , Y10T83/8759 , Y10T83/9416
摘要： This invention provides a punch blade formed with a burr inwardly projecting from an outer peripheral edge of a blade tip portion, wherein a film made of a coating liquid is formed inside a tip portion of the punch blade, a portion of the coating liquid forms a coating accumulation at the burr, and the film and the coating accumulation can form the inside of the outer peripheral edge and a periphery of the burr into smooth surfaces, so that a punch residue cut by the punch blade and the lower blade slides on the smooth surface of the film and a surface of the coating accumulation covering the burr, and falls downward, thereby providing the punch blade in which the punch residue does not remain in the blade tip portion with a simple structure.
摘要翻译：本发明提供了一种形成有从刀尖部的外周边缘向内突出的毛刺的冲头刀片，其中，在冲压刀片的前端部内形成由涂液形成的膜，一部分涂布液形成毛刺上的涂层积累，并且膜和涂层积聚可以形成外周边缘的内侧和毛刺的周边平滑的表面，使得由冲头刀片和下刀片切割的冲头残留物在光滑的膜的表面和覆盖毛边的涂层积累的表面，并且向下倾斜，由此提供具有简单结构的冲头残留物不残留在叶片尖端部分中的冲头刀片。

122. 发明授权

US07096770B2 Optical recording medium-manufacturing apparatus 失效
标题翻译：光记录介质制造装置
公开(公告)号：US07096770B2
公开(公告)日：2006-08-29
申请号：US10762305
申请日：2004-01-23
申请人： Junichi Ide , Haruhiko Yamaguchi , Takeshi Umega , Futoshi Kobayashi , Tsuyoshi Itoh , Yoshimi Yodogawa , Mamoru Usami
发明人： Junichi Ide , Haruhiko Yamaguchi , Takeshi Umega , Futoshi Kobayashi , Tsuyoshi Itoh , Yoshimi Yodogawa , Mamoru Usami
IPC分类号： B26D5/08 , B26D7/01 , G11B7/26
CPC分类号： G11B7/265 , Y10S425/81 , Y10T83/0207 , Y10T83/2066 , Y10T83/9416 , Y10T83/9418 , Y10T83/97
摘要： There is provided an optical recording medium-manufacturing apparatus that is capable of accurately transferring a disk-shaped apparatus during a manufacturing process, and at the same time occupies a small installation area. A control section causes a cut-forming machine installed at a cut-forming location to form a cut in a resin layer of a disk-shaped substrate, then causes an indexing mechanism to rotate a transfer stage to thereby transfer the disk-shaped substrate formed with the cut to a central hole-forming location, and then causes a punching machine to punch a central hole.
摘要翻译：提供了一种能够在制造过程中精确地传送盘形装置的同时具有小的安装面积的光学记录介质制造装置。控制部分使得安装在切割位置处的切割成型机在盘形基板的树脂层中形成切口，然后使转印机构转动转印台，从而转印形成的盘状基板切割成中心孔形成位置，然后使冲孔机冲孔中心孔。

123. 发明授权

US07055719B2 Separable laminated container and associated technology 失效
标题翻译：可分离的层压容器及相关技术
公开(公告)号：US07055719B2
公开(公告)日：2006-06-06
申请号：US10728957
申请日：2003-12-08
申请人： Tsugio Nomoto , Takayuki Goto , Masashi Yoneyama , Yoshio Shibano , Yoshio Akiyama
发明人： Tsugio Nomoto , Takayuki Goto , Masashi Yoneyama , Yoshio Shibano , Yoshio Akiyama
IPC分类号： B65D35/28
CPC分类号： B65D1/0215 , B05B11/00412 , B05B11/3047 , B29C49/04 , B29C49/22 , B29C2793/0045 , B29C2793/0054 , B29C2793/009 , B29L2009/00 , B29L2009/001 , B29L2031/7158 , B65D83/0055 , G01F11/028 , Y10S83/914 , Y10T83/9416
摘要： A separable laminated container (A) of the present invention comprises an outer layer (1) made of synthetic resin and having an air suction hole (10) and an inner layer (2) made of synthetic resin and separably laminated on the inside of the outer layer, the inner layer having a portion previously separated from the outer layer just around the air suction hole. The air suction hole can be formed by driving a punch into the outer layer at a neck (4) of the separable laminated container from the outside, and punching just the outer layer leaving the inner layer behind. The portion of the inner layer previously separated from the outer layer may be left in the inwardly extended state. The inner layer is preferably made of synthetic resin having flextural modules of less than 10,000 kg/cm2.
摘要翻译：本发明的可分离层压容器（A）包括由合成树脂制成的外层（1），具有吸气孔（10）和由合成树脂制成的内层（2），并且可分离地层压在外层，内层具有预先与空气抽吸孔周围的外层隔开的部分。空气吸入孔可以通过在外侧的可分离层压容器的颈部（4）处将冲头驱动到外层中，并且仅将离开内层的外层冲压而形成。预先从外层分离的内层的部分可以保持在向内延伸的状态。内层优选由具有小于10,000kg / cm 2的挠曲模块的合成树脂制成。

124. 发明申请

US20060027312A1 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame 失效
公开(公告)号：US20060027312A1
公开(公告)日：2006-02-09
申请号：US11241992
申请日：2005-10-04
申请人： Yoshiyuki Tanabe , Yoshihiro Nomura , Hiroshi Kirihara , Youichi Hosokawa , Shinji Iioka , Satoru Yanagisawa
发明人： Yoshiyuki Tanabe , Yoshihiro Nomura , Hiroshi Kirihara , Youichi Hosokawa , Shinji Iioka , Satoru Yanagisawa
IPC分类号： B32B37/00 , B29C65/00
CPC分类号： H01L24/32 , H01L23/4951 , H01L23/544 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2223/54473 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73253 , H01L2224/83101 , H01L2224/83192 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , Y10S428/901 , Y10T83/155 , Y10T83/543 , Y10T83/9416 , Y10T156/1056 , Y10T156/1062 , Y10T156/1084 , Y10T428/24273 , Y10T428/24322 , Y10T428/28 , Y10T428/2852 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

125. 发明申请

US20050150338A1 Slug pulling preventing tooling die 有权
标题翻译：插头拉拔防止工具模具
公开(公告)号：US20050150338A1
公开(公告)日：2005-07-14
申请号：US10755999
申请日：2004-01-13
申请人： Morris Elynuik
发明人： Morris Elynuik
IPC分类号： B21D28/34 , B26D1/00 , B26D3/00 , B26F1/14
CPC分类号： B21D28/34 , B21D28/145 , Y10T83/04 , Y10T83/2218 , Y10T83/9416 , Y10T83/9423 , Y10T83/9425 , Y10T83/9437
摘要： A punch and die tooling apparatus commonly used by metal fabricators for creating holes, passages and cavities in metal plate, the die having a unique internal bore which relieves the problem of slug pulling to ensure that a slug punched out of a metal sheet is not retained on the punch face to interfere with further operation of the apparatus. The die is provided with a substantially horizontal ridge and a corresponding horizontal land and relief space formed within the bore to facilitate tipping of the slug relative to the punch and thereby break any attachment between the slug and the punch face which causes slug pulling.
摘要翻译：金属制造商通常使用的冲压和模具加工设备，用于在金属板中形成孔，通道和空腔，该模具具有独特的内孔，其减轻了塞子拉拔的问题，以确保不保留从金属板冲出的块塞在冲头表面上干扰装置的进一步操作。模具设置有基本上水平的脊部和形成在孔内的相应的水平平台和浮雕空间，以便于相对于冲头的突出部分的倾斜，从而破坏塞子和冲头面之间的任何附接，从而引起塞子拉动。

126. 发明申请

US20050061131A1 Perforator for imaging apparatus, and paper handler provided therewith 有权
标题翻译：用于成像设备的穿孔器和与其一起提供的纸张处理器
公开(公告)号：US20050061131A1
公开(公告)日：2005-03-24
申请号：US10901049
申请日：2004-07-29
申请人： Masahiro Tamura , Nobuyoshi Suzuki
发明人： Masahiro Tamura , Nobuyoshi Suzuki
IPC分类号： B26D7/18 , B26F1/02 , B26F1/08 , B26F1/14 , B26D5/00 , B26D7/06
CPC分类号： B26D7/18 , B26D2007/0018 , B26F1/02 , Y10T83/2174 , Y10T83/2179 , Y10T83/2216 , Y10T83/222 , Y10T83/9416 , Y10T83/9423 , Y10T83/944
摘要： A perforator wherein chad is prevented from falling or scattering into the apparatus and is reliably stored in the operating side of the main body front surface, erroneous detection or malfunctioning is prevented, a favorable appearance, small size, and superior operability are ensured, and high quality imaging and finishing are performed; and a finisher and an imaging apparatus equipped with the perforator. The perforator has a perforating device for perforating a transferred medium delivered by a delivery device, a chad recovery/delivery device for delivering the chad to the operating side of the main body front surface, a detachable chad storage device for storing the chad that separates from a curved part of the chad recovery/delivery device, a chad guide for guiding and delivering the chad to the chad storage device, and a chad delivery channel shielding member for shielding the guiding delivery channel for the chad of the chad guide when the chad storage device is opened to be attached or removed.
摘要翻译：一种穿孔器，其中防止乍得落入或散射到装置中，并可靠地存储在主体前表面的操作侧，防止错误检测或故障，确保良好的外观，小尺寸和优异的操作性，并且高进行质量成像和精加工; 以及配备有穿孔器的整理器和成像装置。穿孔器具有用于对由输送装置输送的转印介质进行穿孔的穿孔装置，用于将ch for输送到主体前表面的操作侧的ch回收/输送装置，用于储存乍得 ch ad recovery recovery recovery delivery a a a a ch ch ch ch ch ch ch ch ch storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage storage 打开设备以附接或移除。

127. 发明授权

US06523446B1 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame 失效
标题翻译：用于半导体的冲压胶带，用胶带制造引线框架的方法，带有胶带的引线框架以及包括引线框架的半导体器件
公开(公告)号：US06523446B1
公开(公告)日：2003-02-25
申请号：US09462943
申请日：2000-01-18
申请人： Yoshiyuki Tanabe , Yoshihiro Nomura , Hiroshi Kirihara , Youichi Hosokawa , Shinji Iioka , Satoru Yanagisawa
发明人： Yoshiyuki Tanabe , Yoshihiro Nomura , Hiroshi Kirihara , Youichi Hosokawa , Shinji Iioka , Satoru Yanagisawa
IPC分类号： B26D538
CPC分类号： H01L24/32 , H01L23/4951 , H01L23/544 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2223/54473 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73253 , H01L2224/83101 , H01L2224/83192 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , Y10S428/901 , Y10T83/155 , Y10T83/543 , Y10T83/9416 , Y10T156/1056 , Y10T156/1062 , Y10T156/1084 , Y10T428/24273 , Y10T428/24322 , Y10T428/28 , Y10T428/2852 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.
摘要翻译：一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

128. 发明授权

US5458717A Method of shearing thin metal sheet 失效
标题翻译：剪切薄金属片的方法
公开(公告)号：US5458717A
公开(公告)日：1995-10-17
申请号：US171457
申请日：1993-12-22
申请人： Mikiya Kurita
发明人： Mikiya Kurita
IPC分类号： B21D28/02 , B21D28/16 , B21D28/24 , B21D33/00 , B26D1/00 , B26D7/08 , B32B31/18 , B26D3/00 , B26F1/14
CPC分类号： B26D1/0006 , B21D28/16 , B26D7/08 , B26D2001/0053 , B26D2001/0066 , Y10T156/1052 , Y10T156/1057 , Y10T29/30 , Y10T29/301 , Y10T83/0486 , Y10T83/06 , Y10T83/9416 , Y10T83/9425 , Y10T83/9428 , Y10T83/9437
摘要： A method of shearing a thin metal sheet having a thickness of approximately 0.1 mm or less so as to be separated into a product and scrap by a pair of dies. A chamfer or a round having a size of approximately from 5 to 10 times greater than the thickness of the thin metal sheet is arranged at the lip of a first die which presses one portion of the thin metal sheet which is to be scrap. A chamfer or a round is not substantially arranged at the lip of a second die which presses the other portion of the thin metal sheet which is to be a product. A backing material and the thin metal sheet are overlapped so as to be a laminate. The backing material has a thickness of approximately 2 times or more greater than that of the thin metal sheet and is formed of a flexible material having a very small elongation and is soft enough not to substantially prevent the thin metal sheet from being sheared, such as, for example, paper. The laminate is arranged such that the backing material faces the pressing surface of the first die and that the thin metal sheet faces the pressing surface of the second die. Then, the thin metal sheet and the backing material are sheared concurrently. Thus, the thin metal sheet can be sheared, by methods such as blanking and piercing, while inhibiting burring, without requiring any special type of device or blanking die.
摘要翻译：一种剪切厚度为约0.1mm或更小的薄金属片以便通过一对模具分离成产品和废料的方法。在第一模具的唇缘处设置有比金属片厚度大约5至10倍的倒角或圆形，该第一模具的一部分压制要被废料的薄金属片的一部分。倒角或圆形基本上不布置在第二模具的唇部处，该第二模具挤压作为产品的金属薄片的另一部分。背衬材料和薄金属片材重叠成层压体。背衬材料的厚度大约为薄金属片的2倍或更大，并且由具有非常小伸长率的柔性材料形成，并且足够软而不能基本上防止薄金属片材被剪切，例如，例如纸。层压体被布置成使得背衬材料面向第一模具的按压表面，并且金属薄片面对第二模具的按压表面。然后，薄金属片和背衬材料同时剪切。因此，可以通过诸如冲裁和穿孔的方法来剪切薄金属片，同时抑制翻边，而不需要任何特殊类型的装置或冲裁模具。

129. 发明授权

US5105697A Multiple stage shaving die 失效
标题翻译：多级剃须刀
公开(公告)号：US5105697A
公开(公告)日：1992-04-21
申请号：US613379
申请日：1990-11-15
申请人： Siegfried F. Gruber
发明人： Siegfried F. Gruber
IPC分类号： B23D79/12 , B21D53/28 , B23F21/26
CPC分类号： B23F21/268 , B21D53/28 , Y10T409/109381 , Y10T409/4056 , Y10T83/2066 , Y10T83/2216 , Y10T83/6484 , Y10T83/9416 , Y10T83/9437
摘要： First and second shaving dies are mounted one above the other and are respectively provided with continuous shaving edges disposed adjacent to contoured annular facial surfaces which draw the shaved material away from the work piece as the shavings are removed by the associated shaving edge. An air nozzle mounted in proximity to the first die directs a jet of air across the contoured facial surface of the first die to blow the removed material away from the first die to prevent its interfering with the operation of the second die. The second die is located directly below the first die and is provided with a plurality of angularly spaced troughs lying immediately adjacent to and below annular facial surfaces on the second die for carrying the shavings from the shaving edges of the second die to a sump located below the second die.
摘要翻译：第一和第二剃须刀片一个被安装在另一个之上，并且分别设置有连续的剃须边缘，其设置成与轮廓的环形面部表面相邻，当剃刮件通过相关联的剃刮边缘移除时，剃须刀片将剃光材料从工件上拉出。安装在第一模具附近的空气喷嘴引导空气射流穿过第一模具的轮廓面部表面以将去除的材料吹离第一模具以防止其干扰第二模具的操作。第二模具位于第一模具的正下方并且设置有多个角度间隔开的槽，其位于第二模具的紧邻和低于环形面部表面的下方，用于将来自第二模具的剃须边缘的刮屑运送到位于下方的凹槽第二个死亡

130. 发明授权

US3166968A Steel rule lined blank and pierce die and method of making same 失效
标题翻译：钢管内衬空白和穿孔模具及其制作方法
公开(公告)号：US3166968A
公开(公告)日：1965-01-26
申请号：US13551961
申请日：1961-09-01
申请人： KRO DIE INC
发明人： KROUSKOP RICHARD M
IPC分类号： B21D37/20
CPC分类号： B21D37/205 , Y10T83/9416 , Y10T83/9425 , Y10T83/9476

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