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121. 发明授权

US08558252B2 White LEDs with emission wavelength correction 有权
标题翻译：发光波长校正的白色LED
公开(公告)号：US08558252B2
公开(公告)日：2013-10-15
申请号：US13219486
申请日：2011-08-26
申请人： James Ibbetson , Bernd Keller , Ronan Letoquin , Matthew Donofrio , Michael Bergmann
发明人： James Ibbetson , Bernd Keller , Ronan Letoquin , Matthew Donofrio , Michael Bergmann
IPC分类号： H01L29/18 , H01L29/205 , H01L33/00 , H01L21/00
CPC分类号： H01L33/504 , H01L33/0095 , H01L2933/0041
摘要： Methods for fabricating semiconductor devices such as LED chips with emission wavelength correction and devices fabricated using these methods. Different embodiments include sequential coating methods that provide two or more coatings or layers of conversion material over LEDs, which can be done at the wafer level. The methods are particularly applicable to fabricating LED chips that emit a warm white light, which typically requires covering LEDs with one or more wavelength conversion materials such as phosphors. In one embodiment, a base wavelength conversion material is applied to the semiconductor devices. A portion of the base conversion material is removed. At least two different tuning wavelength conversion materials are also applied to the semiconductor devices, either before or after the application of the base conversion material.
摘要翻译：用于制造具有发射波长校正的LED芯片的半导体器件的方法以及使用这些方法制造的器件。不同的实施方案包括在LED上提供两个或更多个转化材料的涂层或多层的顺序涂覆方法，其可以在晶片级完成。该方法特别适用于制造发出暖白光的LED芯片，其通常需要用一种或多种波长转换材料如磷光体覆盖LED。在一个实施例中，将基础波长转换材料施加到半导体器件。一部分碱转换材料被去除。在应用基底转换材料之前或之后，至少两种不同的调谐波长转换材料也被应用于半导体器件。

122. 发明授权

US08390016B2 Method for coating semiconductor device using droplet deposition 有权
公开(公告)号：US08390016B2
公开(公告)日：2013-03-05
申请号：US13237789
申请日：2011-09-20
申请人： Bernd Keller , Ban P. Loh
发明人： Bernd Keller , Ban P. Loh
IPC分类号： H01L33/00
CPC分类号： B41J3/407 , H01L21/6715 , H01L33/505 , H01L2224/48463 , H01L2224/73265 , H01L2224/8592 , H01L2933/0041
摘要： Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.

123. 发明授权

US08378374B2 Semiconductor light emitting device packages including submounts 有权
标题翻译：半导体发光器件封装包括底座
公开(公告)号：US08378374B2
公开(公告)日：2013-02-19
申请号：US12685883
申请日：2010-01-12
申请人： Ban P. Loh , Nicholas Medendorp, Jr. , Bernd Keller
发明人： Ban P. Loh , Nicholas Medendorp, Jr. , Bernd Keller
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/19107 , H01L2924/00014
摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
摘要翻译：一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫，接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域并且延伸到所述支撑构件的第二侧表面的延伸区域。第二电接合板的管芯安装区域可以被配置为接收电子设备。底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

124. 发明授权

US08217412B2 Solid state lighting component 有权
标题翻译：固态照明组件
公开(公告)号：US08217412B2
公开(公告)日：2012-07-10
申请号：US12883979
申请日：2010-09-16
申请人： Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
发明人： Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/58 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/181 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
摘要翻译：一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

125. 发明授权

US07999283B2 Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes 有权
标题翻译：具有散射体的封装剂以调节发光二极管中的空间发射图案和颜色均匀性
公开(公告)号：US07999283B2
公开(公告)日：2011-08-16
申请号：US11818818
申请日：2007-06-14
申请人： Arpan Chakraborty , Bernd Keller
发明人： Arpan Chakraborty , Bernd Keller
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L25/0753 , H01L33/54 , H01L2924/0002 , H01L2933/0091 , Y10T428/2982 , H01L2924/00
摘要： A light emitting device having an encapsulant with scattering features to tailor the spatial emission pattern and color temperature uniformity of the output profile. The encapsulant is formed with materials having light scattering properties. The concentration of these light scatterers is varied spatially within the encapsulant and/or on the surface of the encapsulant. The regions having a high density of scatterers are arranged in the encapsulant to interact with light entering the encapsulant over a desired range of source emission angles. By increasing the probability that light from a particular range of emission angles will experience at least one scattering event, both the intensity and color temperature profiles of the output light beam can be tuned.
摘要翻译：一种发光器件，其具有具有散射特征的密封剂，以调整输出分布图的空间发射图案和色温均匀性。密封剂由具有光散射性质的材料形成。这些光散射体的浓度在密封剂内和/或密封剂的表面上在空间上变化。具有高密度散射体的区域被布置在密封剂中以与在源发射角的期望范围内进入密封剂的光相互作用。通过增加来自特定发射角范围的光将经历至少一个散射事件的概率，可以调节输出光束的强度和色温分布。

126. 发明授权

US07791092B2 Multiple component solid state white light 有权
标题翻译：多组分固态白光
公开(公告)号：US07791092B2
公开(公告)日：2010-09-07
申请号：US11347645
申请日：2006-02-02
申请人： Eric Joseph Tarsa , Michael Dunn , Bernd Keller
发明人： Eric Joseph Tarsa , Michael Dunn , Bernd Keller
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/50 , H01L2924/0002 , H01L2933/0091 , Y10S362/80 , H01L2924/00
摘要： A white light emitting lamp is disclosed comprising a solid state ultra violet (UV) emitter that emits light in the UV wavelength spectrum. A conversion material is arranged to absorb at least some of the light emitting from the UV emitter and re-emit light at one or more different wavelengths of light. One or more complimentary solid state emitters are included that emit at different wavelengths of light than the UV emitter and the conversion material. The lamp emits a white light combination of light emitted from the complimentary emitters and from the conversion material, with the white light having high efficacy and good color rendering. Other embodiments of white light emitting lamp according to the present invention comprises a solid state laser instead of a UV emitter. A high flux white emitting lamp embodiment according to the invention comprises a large area light emitting diode (LED) that emits light at a first wavelength spectrum and includes a conversion material. A plurality of complimentary solid state emitters surround the large area LED, with each emitter emitting light in a spectrum different from the large area LED and conversion material such that the lamp emits a balanced white light. Scattering particles can be included in each of the embodiments to scatter the light from the emitters, conversion material and complimentary emitters to provide a more uniform emission.
摘要翻译：公开了一种白光发射灯，其包括在UV波长光谱中发射光的固态紫外（UV）发射器。转换材料被布置成吸收从UV发射器发射的光中的至少一些，并且在一个或多个不同波长的光下重新发射光。包括一个或多个互补固态发射器，其发射在不同于UV发射器和转换材料的波长的光。灯发出从互补发射器和转换材料发出的光的白光组合，白光具有高效率和良好的显色性。根据本发明的白光发射灯的其它实施例包括固态激光器而不是UV发射器。根据本发明的高通量白光发光灯实施例包括发射第一波长光谱的光并包括转换材料的大面积发光二极管（LED）。多个互补固态发射器围绕大面积的LED，每个发射器发射的光与大面积的LED和转换材料不同，使得灯发出平衡的白光。可以在每个实施例中包括散射颗粒以散射来自发射器，转换材料和互补发射体的光，以提供更均匀的发射。

127. 发明申请

US20100127283A1 ARRAY LAYOUT FOR COLOR MIXING 有权
标题翻译：颜色混合的阵列布局
公开(公告)号：US20100127283A1
公开(公告)日：2010-05-27
申请号：US12629735
申请日：2009-12-02
申请人： Antony P. van de Ven , Gerald Negley , Thomas Yuan , Bernd Keller , Ted Lowes
发明人： Antony P. van de Ven , Gerald Negley , Thomas Yuan , Bernd Keller , Ted Lowes
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L25/167 , H01L33/58 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.
摘要翻译：公开了具有多个分立光源的固态照明组件，其光组合以提供期望的发射特性。根据本发明的LED部件的一个实施例包括矩形基座。第一组蓝移LED（BSY）LED芯片，第二组BSY LED芯片和一组红色LED芯片安装在底座上。多个触点沿着副安装座的边缘之一布置，并且可从组件的一侧接近以将电信号施加到LED芯片组。

128. 发明授权

US07646035B2 Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices 有权
标题翻译：封装的发光器件包括多个折射率透镜和用于封装的发光器件的多个折射率透镜
公开(公告)号：US07646035B2
公开(公告)日：2010-01-12
申请号：US11443741
申请日：2006-05-31
申请人： Ban P. Loh , Nicholas W. Medendorp, Jr. , Bernd Keller
发明人： Ban P. Loh , Nicholas W. Medendorp, Jr. , Bernd Keller
IPC分类号： H01L29/16
CPC分类号： H01L33/58 , B29C45/14655 , B29C45/1671 , B29L2011/0016 , G02B19/0028 , G02B19/0052 , G02B19/0071 , H01L33/54 , Y10T156/10
摘要： A packaged light emitting device includes a substrate, a solid state light emitting device on the substrate, a first generally toroidal lens on the substrate and defining a cavity relative to the solid state light emitting device and having a first index of refraction, and a second lens at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction. The second index of refraction may be higher than the first index of refraction. The lenses may be mounted on the substrate and/or may formed by dispensing and curing liquid encapsulant materials.
摘要翻译：封装的发光器件包括衬底，在衬底上的固态发光器件，在衬底上的第一大致环形透镜，并且相对于固态发光器件限定空腔并具有第一折射率，第二透镜至少部分地在由第一透镜形成的空腔内，并且具有不同于第一折射率的第二折射率。第二折射率可能高于第一折射率。透镜可以安装在基板上和/或可以通过分配和固化液体密封剂材料而形成。

129. 发明申请

US20090173958A1 LIGHT EMITTING DEVICES WITH HIGH EFFICIENCY PHOSPOR STRUCTURES 审中-公开
标题翻译：具有高效液相结构的发光装置
公开(公告)号：US20090173958A1
公开(公告)日：2009-07-09
申请号：US11969508
申请日：2008-01-04
申请人： Arpan Chakraborty , Bernd Keller
发明人： Arpan Chakraborty , Bernd Keller
IPC分类号： H01L33/00
CPC分类号： H01L33/501 , H01L33/502 , H01L33/58 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A light emitting device includes a light emitting die configured to emit light having a first dominant wavelength, and an index matched wavelength conversion structure configured to receive light emitted by the light emitting die. The index matched wavelength conversion structure includes wavelength converting particles having a first index of refraction embedded in a matrix material. The matrix material has a second index of refraction that may be substantially matched to the first index of refraction. The light emitting device may include a graded index layer having an index of refraction that is continuously graded from a first index of refraction in a first region of the graded index layer near the light emitting die to a second index of refraction in the graded index layer away from the light emitting die.
摘要翻译：发光器件包括配置为发射具有第一主波长的光的发光管芯和被配置为接收由发光管芯发射的光的折射率匹配波长转换结构。折射率匹配波长转换结构包括具有嵌入在基质材料中的第一折射率的波长转换粒子。基质材料具有可以基本上与第一折射率匹配的第二折射率。发光器件可以包括具有折射率的渐变折射率层，所述折射率折射率在发光管芯附近的渐变折射率层的第一区域中从折射率的第一折射率的第一折射率连续分级到渐变折射率层中的第二折射率远离发光模具。

130. 外观设计

USD594827S1 Lamp package 有权
公开(公告)号：USD594827S1
公开(公告)日：2009-06-23
申请号：US29250973
申请日：2006-12-07
申请人： Ban Loh , Nicholas W. Medendorp, Jr. , Bernd Keller , Eric Tarsa
设计人： Ban Loh , Nicholas W. Medendorp, Jr. , Bernd Keller , Eric Tarsa

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