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    • 121. 发明申请
    • Flash memory device and manufacturing method thereof
    • 闪存装置及其制造方法
    • US20060131635A1
    • 2006-06-22
    • US11018536
    • 2004-12-20
    • Erh-Kun LaiHang-Ting LueYen-Hao ShihChia-Hua Ho
    • Erh-Kun LaiHang-Ting LueYen-Hao ShihChia-Hua Ho
    • H01L29/788H01L21/336
    • H01L27/115H01L21/28114H01L27/11521H01L29/42376
    • A method of manufacturing a flash memory device is provided. Multiple stack structures each comprising a tunneling oxide layer and a first conductive layer are formed over a substrate. Thereafter, multiple embedded doping regions is formed in the substrate between the stack structures. A dielectric layer is formed over the substrate to cover the stack structures and then the dielectric layer is etched back and a portion of dielectric layer is remained on the stack structures. Using a portion of the remaining dielectric layer as a mask, a portion of the first conductive layer is removed. An inter-layer dielectric layer and a second conductive layer are sequentially formed over the first conductive layer. Because a self-aligned process is used to define the floating gate and the floating gate has a narrow-top/wide-bottom configuration, the fabrication process is simplified and the coupling ratio of the stack gate is increased.
    • 提供一种制造闪速存储器件的方法。 在衬底上形成各自包括隧穿氧化物层和第一导电层的堆叠结构。 此后,在堆叠结构之间的衬底中形成多个嵌入的掺杂区域。 介电层形成在衬底上以覆盖堆叠结构,然后电介质层被回蚀刻,并且介电层的一部分保留在堆叠结构上。 使用剩余电介质层的一部分作为掩模,去除第一导电层的一部分。 在第一导电层上依次形成层间电介质层和第二导电层。 由于使用自对准工艺来定义浮动栅极,并且浮栅具有窄顶/宽底部配置,因此简化了制造工艺,并且增加了堆叠栅极的耦合比。
    • 122. 发明申请
    • Charge trapping memory device with two separated non-conductive charge trapping inserts and method for making the same
    • 具有两个分离的非导电电荷捕获插入物的电荷俘获存储器件及其制造方法
    • US20060001075A1
    • 2006-01-05
    • US10884483
    • 2004-07-01
    • Yen-Hao Shih
    • Yen-Hao Shih
    • H01L29/768H01L21/8238
    • H01L29/66833H01L21/28282H01L29/7923
    • A charge trapping memory device with two separated non-conductive charge trapping inserts is disclosed. The charge trapping memory device has a silicon substrate with two junctions. A gate oxide (GOX) is formed on top of the silicon substrate and between the two junctions. A polysilicon gate is defined over the GOX. A layer of bottom oxide (BOX) is grown on top of the silicon substrate and a conformal layer of top oxide (TOX) is grown along the bottom and the sidewalls of the polysilicon gate. Two charge trapping inserts are located beside the GOX and between the BOX and the TOX. The polysilicon gate needs to be at least partially over each of the two charge trapping inserts. The charge trapping inserts are made from a non-conductive charge trapping material. A method for fabricating such a device is also described.
    • 公开了具有两个分开的非导电电荷捕获插入物的电荷捕获存储器件。 电荷捕获存储器件具有带有两个结的硅衬底。 在硅衬底的顶部和两个结之间形成栅极氧化物(GOX)。 在GOX上定义了多晶硅栅极。 在硅衬底的顶部上生长一层底部氧化物(BOX),沿多晶硅栅极的底部和侧壁生长顶部氧化物(TOX)的共形层。 两个充电陷阱插件位于GOX旁边和BOX和TOX之间。 多晶硅栅极需要至少部分地在两个电荷捕获插入物中的每一个上。 电荷捕获插入物由非导电电荷捕获材料制成。 还描述了制造这种装置的方法。
    • 123. 发明申请
    • QUANTUM-WELL MEMORY DEVICE AND METHOD FOR MAKING THE SAME
    • 量子阱存储器件及其制造方法
    • US20050236613A1
    • 2005-10-27
    • US10831431
    • 2004-04-23
    • Yen-Hao Shih
    • Yen-Hao Shih
    • H01L21/28H01L29/06H01L29/423H01L29/788
    • B82Y10/00H01L21/28273H01L29/42332H01L29/7887
    • A quantum-well memory device and method is provided. The quantum-well memory device includes a substrate with two junctions. A sandwiched gate insulator is formed on top of the substrate and extended in length between the two junctions. The sandwiched gate insulator has a top layer, a middle layer, and a bottom layer. The middle layer is more soluble to an acid etch than the top and the bottom layer of the gate insulator. Polysilicon inserts are defined at the undercuts formed by selectively and self-limitedly etching the sidewalls of the middle layer of the gate insulator. The polysilicon inserts are positioned beside the middle layer and between the top layer and the bottom layer of the gate insulator. A method for fabricating such a device is also described.
    • 提供量子阱存储器件和方法。 量子阱存储器件包括具有两个结的衬底。 夹层栅极绝缘体形成在衬底的顶部并且在两个结之间的长度上延伸。 夹层绝缘体具有顶层,中间层和底层。 中间层比栅极绝缘体的顶层和底层更易溶于酸蚀刻。 多晶硅插入件限定在通过选择性地且自限制地蚀刻栅极绝缘体的中间层的侧壁形成的切口。 多晶硅插入件位于中间层的旁边,并且位于栅极绝缘体的顶层和底层之间。 还描述了制造这种装置的方法。
    • 125. 发明授权
    • Non-volatile memory and non-volatile memory cell having asymmetrical doped structure
    • 具有非对称掺杂结构的非易失性存储器和非易失性存储单元
    • US08847299B2
    • 2014-09-30
    • US12017064
    • 2008-01-21
    • Tzu-Hsuan HsuYen-Hao Shih
    • Tzu-Hsuan HsuYen-Hao Shih
    • H01L29/76H01L27/115H01L29/792
    • H01L27/11568H01L27/115H01L29/792
    • A non-volatile memory cell comprising a substrate, a charge-trapping layer, a control gate, a first conductive state of source and drain, a lightly doped region and a second conductive state of pocket-doped region. The charge-trapping layer and the control gate are disposed over the substrate. A dielectric layer is disposed between the substrate, the charge-trapping layer and the control gate. The source and drain are disposed in the substrate on each side of the charge-trapping layer. The lightly doped region is disposed on the substrate surface between the source and the charge-trapping layer. The pocket-doped region is disposed within the substrate between the drain and the charge-trapping layer. Because there are asymmetrical configuration and different doped conductive states of implant structures, the programming speed of the memory cell is increased, the neighboring cell disturb issue is prevented, and the area occupation of the bit line selection transistor is reduced.
    • 一种非易失性存储单元,包括衬底,电荷俘获层,控制栅极,源极和漏极的第一导电状态,轻掺杂区域和第二导电状态的袋掺杂区域。 电荷捕获层和控制栅极设置在衬底上。 电介质层设置在基板,电荷俘获层和控制栅极之间。 源极和漏极设置在电荷俘获层的每一侧上的衬底中。 轻掺杂区域设置在源极和电荷捕获层之间的衬底表面上。 掺杂阱区域设置在漏极和电荷捕获层之间的衬底内。 由于存在不对称配置和掺杂导体状态的不同,存储单元的编程速度增加,从而防止了相邻单元的干扰问题,并减少了位线选择晶体管的占用面积。
    • 129. 发明申请
    • MEMORY AND MANUFACTURING METHOD THEREOF
    • 内存及其制造方法
    • US20110089480A1
    • 2011-04-21
    • US12974093
    • 2010-12-21
    • Erh-Kun LaiYen-Hao ShihLing-Wu YangChun-Min Cheng
    • Erh-Kun LaiYen-Hao ShihLing-Wu YangChun-Min Cheng
    • H01L29/792
    • H01L21/28282H01L27/11568H01L29/66545H01L29/66583H01L29/7923
    • A memory having isolated dual memory cells is provided. A first isolation wall and a second isolation wall are separately disposed between a source and a drain on a substrate. An isolation bottom layer and a polysilicon layer are orderly disposed on the substrate between the first and the second isolation walls. A first charge storage structure and a first gate are orderly disposed on the substrate between the first isolation wall and the source. A second charge storage structure and a second gate are orderly disposed on the substrate between the second isolation wall and the drain. A word line disposed on the polysilicon layer, the first gate, the second gate, the first isolation wall and the second isolation wall is electrically connected to the first gate, the second gate and the polysilicon layer.
    • 提供具有隔离双存储单元的存储器。 第一隔离壁和第二隔离壁分别设置在基板上的源极和漏极之间。 隔离底层和多晶硅层有序地设置在第一和第二隔离壁之间的衬底上。 第一电荷存储结构和第一栅极有序地设置在第一隔离壁和源极之间的衬底上。 第二电荷存储结构和第二栅极有序地设置在第二隔离壁和漏极之间的衬底上。 布置在多晶硅层上的字线,第一栅极,第二栅极,第一隔离壁和第二隔离壁电连接到第一栅极,第二栅极和多晶硅层。