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121. 发明公开

EP1340251A2 METHOD OF INSPECTING AN ANISOTROPIC ETCH IN A MICROSTRUCTURE 有权
标题翻译：程序对各向异性蚀刻所述的微结构
公开(公告)号：EP1340251A2
公开(公告)日：2003-09-03
申请号：EP01996882.5
申请日：2001-11-15
申请人： DALSA Semiconductor Inc.
发明人： ANTAKI, Robert , YAN, Riopel
IPC分类号： H01L21/66
CPC分类号： H01L22/12
摘要： A method is disclosed for evaluating an anisotropic etch in a microstructure. First a film is formed on a substrate. Next a series of holes of progressively different area and having specific geometric shapes are formed through the film. An anisotropic etch is carried out in the microstructure through the holes by relying on different etch rates in different crystal planes under known and reproducible conditions. Finally, the microstructure is inspected through the holes after the anisotropic etch to compare results from holes of different area. The method is useful in the determination of etch depth.

122. 发明公开

EP1312949A2 Fabrication method for mirrors for integrated optical devices 有权
标题翻译： HerstellungsverfahrenfürSpiegelfürKomponenten der integrierten Optik
公开(公告)号：EP1312949A2
公开(公告)日：2003-05-21
申请号：EP02102600.0
申请日：2002-11-18
申请人： Dalsa Semiconductor Inc.
发明人： Quellet, Luc , Tremblay, Yves
IPC分类号： G02B6/124
CPC分类号： G02B5/0891 , G02B5/0808 , G02B6/29326 , G02B6/29328
摘要： A method of making highly reflective mirrors on a wafer in the manufacture of photonic devices involves preheating a wafer to remove adsorbed volatile contaminants at a temperature between about 300 and 600°C. The wafer surface is etched at a temperature between about 300 and 600°C to remove absorbed and chemically absorbed contaminants in the presence of a plasma to prevent poisoning. The wafer surface is thoroughly cooled so as to as reduce the surface mobility of the impinging atoms during the subsequent metallic deposition. A deposition is then carried out on the cooled wafer of a gettering layer for gettering hydrogen, oxygen and nitrogen. A metallic reflective layer is then deposited in a deposition chamber, and finally the wafer is removed from the deposition chamber to prevent excessive bulk oxidation.
摘要翻译：在光子器件制造中在晶片上制造高反射镜的方法包括预热晶片以在约300-600℃之间的温度下去除吸附的挥发性污染物。晶片表面在约300-600℃的温度下蚀刻以在存在等离子体的情况下除去吸收和化学吸收的污染物，以防止中毒。晶片表面被彻底冷却，以便在随后的金属沉积期间降低冲击原子的表面迁移率。然后在吸气层的冷却晶片上进行沉积，以吸除氢气，氧气和氮气。然后在沉积室中沉积金属反射层，最后将晶片从沉积室移除以防止过度的体积氧化。

123. 发明公开

EP1285879A2 Method of aligning structures on opposite sides of a wafer 有权
标题翻译： Verfahren um Strukturen a gegenseitigen Teilen eines Wafers zu justieren
公开(公告)号：EP1285879A2
公开(公告)日：2003-02-26
申请号：EP02102078.9
申请日：2002-07-31
申请人： Dalsa Semiconductor Inc.
发明人： Ouellet, Luc
IPC分类号： B81C1/00
CPC分类号： B81C99/007 , B81C1/00396 , B81C1/00404 , Y10S438/975
摘要： A method is disclosed for aligning structures on first and second opposite sides of a wafer. First one or more transparent islands are formed on the first side of the wafer at an alignment location. The transparent islands have an exposed front side and a rear side embedded in the wafer. At least one alignment mark is formed on the front side of the transparent island. An anisotropic etch is performed through the second side of said the to form an opening substantially reaching the back side of the transparent island. A precise alignment is then carried out on the alignment mark through the opening and the transparent island. In this way a very precise alignment can be carried out on the back side of the wafer for manufacturing MEMS structures.
摘要翻译：公开了一种用于对准晶片的第一和第二相对侧上的结构的方法。在对准位置处，在晶片的第一侧上形成第一个或多个透明岛。透明岛具有暴露的前侧和嵌入在晶片中的后侧。在透明岛的前侧形成至少一个对准标记。通过所述第二侧进行各向异性蚀刻，以形成基本上到达透明岛的背面的开口。然后通过开口和透明岛在对准标记上进行精确对准。以这种方式，可以在用于制造MEMS结构的晶片的背面上执行非常精确的对准。

124. 发明授权

EP2554510B1 A method of making a microfluidic device 失效转让
标题翻译：一种制造微流体装置的方法
公开(公告)号：EP2554510B1
公开(公告)日：2018-01-10
申请号：EP12177755.1
申请日：2012-07-25
申请人： Teledyne Dalsa Semiconductor Inc.
发明人： Johnstone, Robert , Martel, Stéphane
IPC分类号： B81C1/00
CPC分类号： B81C1/00182 , B81B2201/054 , B81C2201/019 , B81C2203/0735
摘要： A microfabricated device is fabricated by depositing a first metal layer on a substrate to provide a first electrode of an electrostatic actuator, depositing a first structural polymer layer over the first metal layer, depositing a second metal layer over said first structural polymer layer to form a second electrode of the electrostatic actuator, depositing an insulating layer over said first structural polymer layer, planarizing the insulating layer, etching the first structural polymer layer through the insulating layer and the second metal layer to undercut the second metal layer, providing additional pre-formed structural polymer layers, at least one of which has been previously patterned, and finally bonding the additional structural layers in the form of a stack over the planarized second insulating layer to one or more microfluidic channels. The technique can also be used to make cross over channels in devices without electrostatic actuators, in which case the metal layers can be omitted.

125. 发明公开

EP2554847A3 An integrated microfluidic check valve and device including such a check valve 审中-公开
标题翻译：集成微流体的单向阀装置和与所述单向阀
公开(公告)号：EP2554847A3
公开(公告)日：2013-05-22
申请号：EP12177760.1
申请日：2012-07-25
申请人： Teledyne Dalsa Semiconductor Inc.
发明人： Johnstone, Robert , Martel, Stéphane
IPC分类号： F04B53/10 , F04B43/02 , F16K15/14 , F16K99/00
CPC分类号： F16K99/0057 , F04B43/02 , F04B53/1062 , F16K99/0015 , F16K2099/008 , F16K2099/0094 , Y10T29/49405 , Y10T137/2224 , Y10T137/7837
摘要： A microfluidic check valve has a first chamber (62) divided by a barrier (66) into first and second subchambers (62a,62b) having respectively an inlet port (68) and an outlet port (70). A membrane (56) forms a wall of the first chamber and co-operates with the barrier (66) to selectively permit and prevent fluid flow between the inlet and outlet ports (68,70). A second chamber (54) adjoining the first chamber (62) has a wall formed by the membrane (56). A microfluidic channel (72) establishes fluid communication between the second chamber (54) and the first subchamber (62a). The membrane (56) deflects to permit fluid flow around the barrier (66) when the pressure in the first subchamber (62a) is lower than the pressure in the second subchamber (62b). A microfluidic diaphragm pump comprising two of such check valves is also disclosed.

126. 发明公开

EP2554847A2 An integrated microfluidic check valve and device including such a check valve 审中-公开
标题翻译：一种集成的微流体止回阀和包括这种止回阀的装置
公开(公告)号：EP2554847A2
公开(公告)日：2013-02-06
申请号：EP12177760.1
申请日：2012-07-25
申请人： Teledyne Dalsa Semiconductor Inc.
发明人： Johnstone, Robert , Martel, Stéphane
IPC分类号： F04B53/10 , F16K15/14 , F04B43/02
CPC分类号： F16K99/0057 , F04B43/02 , F04B53/1062 , F16K99/0015 , F16K2099/008 , F16K2099/0094 , Y10T29/49405 , Y10T137/2224 , Y10T137/7837
摘要： A microfluidic check valve has a first chamber (62) divided by a barrier (66) into first and second subchambers (62a,62b) having respectively an inlet port (68) and an outlet port (70). A membrane (56) forms a wall of the first chamber and co-operates with the barrier (66) to selectively permit and prevent fluid flow between the inlet and outlet ports (68,70). A second chamber (54) adjoining the first chamber (62) has a wall formed by the membrane (56). A microfluidic channel (72) establishes fluid communication between the second chamber (54) and the first subchamber (62a). The membrane (56) deflects to permit fluid flow around the barrier (66) when the pressure in the first subchamber (62a) is lower than the pressure in the second subchamber (62b). A microfluidic diaphragm pump comprising two of such check valves is also disclosed.
摘要翻译：微流体止回阀具有由障壁（66）分隔成分别具有入口端口（68）和出口端口（70）的第一和第二子腔室（62a，62b）的第一腔室（62）。隔膜（56）形成第一腔室的壁并且与隔板（66）配合以选择性地允许和防止入口和出口端口（68,70）之间的流体流动。邻接第一室（62）的第二室（54）具有由膜（56）形成的壁。微流体通道（72）建立第二室（54）和第一子室（62a）之间的流体连通。当第一子腔室（62a）中的压力低于第二子腔室（62b）中的压力时，隔膜（56）偏转以允许流体在隔板（66）周围流动。还公开了包括两个这种止回阀的微流体隔膜泵。

127. 发明公开

EP2554843A2 An integrated microfluidic device with actuator 审中-公开
标题翻译： Integrierte mikrofluidische Vorrichtung mitBetätiger
公开(公告)号：EP2554843A2
公开(公告)日：2013-02-06
申请号：EP12177826.0
申请日：2012-07-25
申请人： Teledyne Dalsa Semiconductor Inc.
发明人： Johnstone, Robert , Martel, Stéphane
IPC分类号： F04B19/00 , F04B43/073
CPC分类号： F04B19/006 , F04B43/073 , Y10T137/0318
摘要： A microfluidic device has at least one active element (114), e.g. a membrane, which is driven by pneumatic signals consisting in either compressed air or vacuum. At least one electrostatic actuator (112;116) integrated in the microfluidic device controls the operation of the active element (114) by opening or closing the passage which connects the microfluidic device with an external supply of pressure or vacuum. In an alternative embodiment the pneumatic signals may be generated internally using an integrated pump.
摘要翻译：微流体装置具有至少一个有源元件（114），例如，一个膜，由压缩空气或真空中的气动信号驱动。集成在微流体装置中的至少一个静电致动器（112; 116）通过打开或关闭连接微流体装置的通道与外部的压力或真空供应来控制活动元件（114）的操作。在替代实施例中，可以使用集成泵在内部产生气动信号。

128. 发明公开

EP2554510A2 A method of making a microfluidic device 失效转让
标题翻译： Verfahren zum Herstellen einer mikrofluidischen Vorrichtung
公开(公告)号：EP2554510A2
公开(公告)日：2013-02-06
申请号：EP12177755.1
申请日：2012-07-25
申请人： Teledyne Dalsa Semiconductor Inc.
发明人： Johnstone, Robert , Martel, Stéphane
IPC分类号： B81C1/00
CPC分类号： B81C1/00182 , B81B2201/054 , B81C2201/019 , B81C2203/0735
摘要： A microfabricated device is fabricated by depositing a first metal layer on a substrate to provide a first electrode of an electrostatic actuator, depositing a first structural polymer layer over the first metal layer, depositing a second metal layer over said first structural polymer layer to form a second electrode of the electrostatic actuator, depositing an insulating layer over said first structural polymer layer, planarizing the insulating layer, etching the first structural polymer layer through the insulating layer and the second metal layer to undercut the second metal layer, providing additional pre-formed structural polymer layers, at least one of which has been previously patterned, and finally bonding the additional structural layers in the form of a stack over the planarized second insulating layer to one or more microfluidic channels. The technique can also be used to make cross over channels in devices without electrostatic actuators, in which case the metal layers can be omitted.
摘要翻译：通过在衬底上沉积第一金属层以提供静电致动器的第一电极，在第一金属层上方沉积第一结构聚合物层，在第一结构聚合物层上方沉积第二金属层以形成微结构聚合物层静电致动器的第二电极，在所述第一结构聚合物层上沉积绝缘层，平坦化绝缘层，通过绝缘层和第二金属层蚀刻第一结构聚合物层以切割第二金属层，提供额外的预形成结构聚合物层，其中至少一个已经被预先图案化，并且最后将平坦化的第二绝缘层上的堆叠形式的附加结构层结合到一个或多个微流体通道。该技术还可以用于在没有静电致动器的装置中跨越通道，在这种情况下可以省略金属层。

129. 发明公开

EP1837305A3 Protection capsule for MEMS devices 有权转让
标题翻译：保护胶囊MEMS器件
公开(公告)号：EP1837305A3
公开(公告)日：2011-05-04
申请号：EP07104525.6
申请日：2007-03-20
申请人： Dalsa Semiconductor Inc.
发明人： Ouellet, Luc , Giard, Veronique , Archambault, Sylvie , Igantiuk, Paul
IPC分类号： B81C1/00
CPC分类号： B81C1/00269 , B81C2203/0127 , B81C2203/019 , B81C2203/036
摘要： A method of making a MEMS device is disclosed wherein anhydrous HF exposed silicon nitride is used as a temporary adhesion layer to permit the transfer of a layer from a carrier substrate to a receiving substrate.

130. 发明公开

EP2105952A3 Deep reactive ion etching 审中-公开
标题翻译：深反应离子蚀刻
公开(公告)号：EP2105952A3
公开(公告)日：2010-10-20
申请号：EP09156284.3
申请日：2009-03-26
申请人： Dalsa Semiconductor Inc.
发明人： Beaudry, Richard
IPC分类号： H01L21/3065
CPC分类号： H01L21/30655
摘要： In a method of performing an anisotropic etch on a substrate in an inductively coupled plasma etch chamber, at least three cycles of a procedure consisting essentially of the four following steps are performed:
a. depositing a protective polymer on a patterned substrate;
b. performing a first low pressure etch to partially remove the deposited protective polymer at a pressure less than 40 mTorr;
c. performing a high pressure etch at a pressure between 40 mTorr and 1000 mTorr to form a portion of a trench in the substrate; and
d. performing a second low pressure etch at a pressure less than 40 mTorr to reduce surface roughness.
This method permits the fabrication of deep trenches with reduced surface roughness.

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