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111. 发明授权

US08657609B2 Seal structure for electronic control device 有权
标题翻译：电子控制装置的密封结构
公开(公告)号：US08657609B2
公开(公告)日：2014-02-25
申请号：US13609555
申请日：2012-09-11
申请人： Yuichi Yanagisawa , Yoshio Kawai , Hironori Ohhashi
发明人： Yuichi Yanagisawa , Yoshio Kawai , Hironori Ohhashi
IPC分类号： H01R12/00
CPC分类号： F16J15/14 , H05K5/0056 , H05K5/0082 , H05K5/062
摘要： Seal structure for electronic control device having a seal portion formed between an outer peripheral surface of a connector and an inner peripheral surface of a housing, and provided with a seal groove and a protruding line. The seal portion has a deep bottom portion having a seal groove, a shallow bottom portion whose seal groove is shallower than that of the deep bottom portion, and a connecting portion connecting these deep and shallow bottom portions. Width of the seal groove of the shallow bottom portion is set to be larger than the deep bottom portion As a position of a seal groove of the connecting portion gets closer to the deep bottom portion from the shallow bottom portion, depth of the seal groove of the connecting portion is set to be gradually larger, and width of the seal groove of the connecting portion is set to be gradually smaller.
摘要翻译：电子控制装置的密封结构具有形成在连接器的外周面和壳体的内周面之间的密封部，并且设置有密封槽和突出线。密封部分具有深的底部，其具有密封槽，密封槽比深底部浅的浅底部，以及连接这些深浅底部的连接部。浅底部的密封槽的宽度被设定为大于深底部。由于连接部的密封槽的位置比浅底部更靠近深底部，所以密封槽的深度连接部被设定为逐渐变大，连接部的密封槽的宽度逐渐变小。

112. 发明申请

US20130120944A1 Housing for an Electric Circuit for a Fuel Pump 有权
标题翻译：燃油泵电路的外壳
公开(公告)号：US20130120944A1
公开(公告)日：2013-05-16
申请号：US13809643
申请日：2011-07-07
申请人： Rolf Graf
发明人： Rolf Graf
IPC分类号： H05K5/00
CPC分类号： H05K5/0004 , F02M37/08 , H05K5/0056 , H05K5/0082
摘要： A housing for an electronic circuit for a fuel pump includes a base and a cover which is connected to the base, a printed circuit board and, disposed on one side of the latter, electric and/or electronic components. Disposed on either side of the printed circuit board in each case is a cover in such a way that each component is arranged in a region covered by a cover.
摘要翻译：一种用于燃料泵的电子电路的壳体包括基座和连接到基座的盖，印刷电路板，并在其一侧设置有电气和/或电子部件。在每种情况下，布置在印刷电路板的任一侧上的是这样的盖子，即每个部件布置在被盖子覆盖的区域中。

113. 发明授权

US06265840B1 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US06265840B1
公开(公告)日：2001-07-24
申请号：US09464607
申请日：1999-12-15
申请人： Hans-Werner Wiezorek , Barbara Wolf
发明人： Hans-Werner Wiezorek , Barbara Wolf
IPC分类号： H02P700
CPC分类号： B60R16/0239 , H05K5/0056 , H05K7/20854
摘要： An electronic device for a motor vehicle, having an electronics unit designed for switching high currents in a two-part housing, a capacitor unit being arranged in the housing to suppress the interference signals produced by said high currents. In an electronic device which is easy to manufacture and in which the heat produced by the electronic circuits has no further effect on the operation of the electronic circuit, the capacitor unit, which is designed to have a large surface area, is thermally connected to a first housing part (1), and the electronics unit (8, 9) is thermally connected to a second housing part (2).
摘要翻译：一种用于机动车辆的电子设备，具有设计用于切换两部分壳体中的高电流的电子单元，电容器单元布置在壳体中，以抑制由所述高电流产生的干扰信号。在容易的电子设备中为了制造电子电路产生的热量对电子电路的运转没有进一步的影响，被设计成具有大表面积的电容器单元热连接到第一壳体部分（1），并且电子单元（8,9）热连接到第二壳体部分（2）。

114. 发明授权

US5657203A Electronic device having a plurality of circuit boards arranged therein 失效
标题翻译：具有布置在其中的多个电路板的电子设备
公开(公告)号：US5657203A
公开(公告)日：1997-08-12
申请号：US400258
申请日：1995-03-06
申请人： Yasunobu Hirao , Takashi Nagasaka , Hidekazu Katsuyama , Makoto Koyama , Yuji Motoyama , Mamoru Urushizaki , Yukihiro Maeda
发明人： Yasunobu Hirao , Takashi Nagasaka , Hidekazu Katsuyama , Makoto Koyama , Yuji Motoyama , Mamoru Urushizaki , Yukihiro Maeda
IPC分类号： H01L25/00 , H01L21/48 , H01L23/498 , H01L23/50 , H01L25/04 , H01L25/07 , H01L25/16 , H01L25/18 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H05K5/0043 , H05K5/0056 , H05K5/064 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/1627 , H01L2924/181 , H01L2924/19041
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
摘要翻译：为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。

115. 发明授权

US5646827A Electronic device having a plurality of circuit boards arranged therein 失效
公开(公告)号：US5646827A
公开(公告)日：1997-07-08
申请号：US400241
申请日：1995-03-06
申请人： Yasunobu Hirao , Takashi Nagasaka , Yuji Motoyama , Yukihiro Maeda
发明人： Yasunobu Hirao , Takashi Nagasaka , Yuji Motoyama , Yukihiro Maeda
IPC分类号： H01L23/498 , H01L25/16 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H05K5/064 , H01L23/49811 , H01L23/49861 , H01L25/162 , H01L25/165 , H05K5/0043 , H05K5/0056 , H01L2224/48091 , H01L2924/13091 , H01L2924/1627 , H05K1/144
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

116. 发明授权

US5408383A Container for electronic devices having a plurality of circuit boards 失效
标题翻译：具有多个电路板的电子设备的容器
公开(公告)号：US5408383A
公开(公告)日：1995-04-18
申请号：US118785
申请日：1993-09-10
申请人： Takashi Nagasaka , Yuji Motoyama , Yasunobu Hirao , Makoto Koyama , Mamoru Urushizaki , Hidekazu Katsuyama , Yukihiro Maeda
发明人： Takashi Nagasaka , Yuji Motoyama , Yasunobu Hirao , Makoto Koyama , Mamoru Urushizaki , Hidekazu Katsuyama , Yukihiro Maeda
IPC分类号： H01L21/48 , H01L23/498 , H01L25/16 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H05K5/064 , H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H01L25/165 , H05K1/144 , H05K5/0043 , H05K5/0056 , H05K5/0069 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19041
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
摘要翻译：为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。

117. 发明授权

EP2695499B1 GEHÄUSESEITIGE TRENNSCHICHT ZUR STRESSENTKOPPLUNG VON VERGOSSENEN ELEKTRONIKEN 有权转让
公开(公告)号：EP2695499B1
公开(公告)日：2018-08-15
申请号：EP12714640.5
申请日：2012-04-04
申请人： Continental Teves AG & Co. oHG
发明人： HUBER, Dietmar , SCHILLINGER, Jakob , THEOBALD, Dirk
IPC分类号： H05K5/06 , H05K5/00
CPC分类号： H05K7/14 , H05K5/0056 , H05K5/064

118. 发明授权

EP2549842B1 Vibration damper for circuit board of automotive control unit 有权转让
公开(公告)号：EP2549842B1
公开(公告)日：2018-06-13
申请号：EP11464008.9
申请日：2011-07-20
申请人： Continental Automotive GmbH
发明人： Tarnovetchi, Marius
IPC分类号： H05K5/00 , F16F15/00
CPC分类号： H05K5/0056 , F16F15/005
摘要： Arrangement (100), comprising a circuit board (102) for an automotive application in a vibrating environment, and a vibration damper (104) mechanically coupled to the circuit board (102) and configured for providing a counterforce for damping a vibration of the circuit board (102) in the vibrating environment.

119. 发明公开

EP3114911A4 MULTI-PART FLEXIBLE ENCAPSULATION HOUSING FOR ELECTRONIC DEVICES 有权转让
公开(公告)号：EP3114911A4
公开(公告)日：2017-11-22
申请号：EP15758971
申请日：2015-03-04
申请人： MC10 INC
发明人： GARLOCK DAVE , GAUDETTE HARRY , FASTERT STEVEN , STANDLEY ADAM , ELOLAMPI BRIAN , HSU YUNG-YU
IPC分类号： H01L21/00 , H01L23/29 , H01L23/498 , H01L29/82 , H05K1/18 , H05K3/28
CPC分类号： H05K5/0034 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/32 , H05K5/0056 , H05K5/006 , H05K5/065 , H05K2201/09063 , H05K2201/09872 , H05K2201/10151 , H05K2203/1311 , H05K2203/1316
摘要： Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

120. 发明公开

EP2916635A4 ELECTRONIC CONTROL DEVICE 有权转让
公开(公告)号：EP2916635A4
公开(公告)日：2016-06-29
申请号：EP13850717
申请日：2013-10-25
申请人： HITACHI AUTOMOTIVE SYSTEMS LTD
发明人： WAKANA YOSHINORI , KAMOSHIDA MASARU , KAMESHIRO YASURO , HATTORI TAKASHI , IGARASHI TAKESHI
IPC分类号： H05K7/20 , H05K5/00 , H05K7/14
CPC分类号： H05K5/006 , H05K5/0056 , H05K7/20454 , H05K7/20854
摘要： The invention provides an electronic control device having a high-grade heat sink that: does not require tight control at the time of manufacturing; does not restrict the range of electronic components that can be used; is structurally simple; can be produced at a higher production rate; and is cost-effective. In this device, when a circuit board 14 having an electronic component 13 thereon is placed in a non-metal (resin) housing having: a housing base 11 integrally comprising via a partition wall 11a a connector inserting section 18 used for electrical connection with an external mating connector (not illustrated); and a housing cover 12 attached to the housing base 11, part of the board 14 is inserted into an insertion hole provided in the partition wall 11a so that it is exposed inside the connector inserting section 16. A pair of elastic metal parts 15, a heat sink, is provided in the housing, connected to the circuit board 14 at particular positions on its top and bottom surfaces with the use of a connecting material 17 (solder or adhesive), and has an arch-shaped cross section as viewed from a lateral direction. The heat of the component 13 is transferred to the housing to dissipate it to the outside by the board 14 being supported from the top and bottom sides in the housing.

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