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    • 112. 发明授权
    • Stitching prevention in multibeam imaging for exposing printing plates
    • 用于曝光印版的多光束成像中的缝合防止
    • US07193641B2
    • 2007-03-20
    • US11022576
    • 2004-12-22
    • Thomas KleinWolfgang Sievers
    • Thomas KleinWolfgang Sievers
    • B41J2/447
    • G03F7/24B41C1/05G03F7/2055G06K2215/111
    • A method of exposing imaging data onto a sensitized medium including exposing K sets of N of tracks on to the medium according to a corresponding part of imaging data, each successive set being a pixel distance apart in a fast scan direction. The method further includes exposing L sets of N tracks onto the medium with an offset of M pixels in a slow scan direction substantially perpendicular to the fast scan direction, according to a second corresponding part of imaging data. The method includes repeating alternately exposing K sets and L sets of N tracks until the complete medium is exposed along the fast scan direction. During or after the alternately exposing K sets and L sets, there is progression in the slow scan direction such that after exposing the complete length of N tracks of exposed pixels, the next N tracks match along the medium at the start of the next N tracks.
    • 一种将成像数据曝光到敏化介质上的方法,包括根据成像数据的相应部分将K组N个磁道曝光到介质上,每个连续的组是在快速扫描方向上分开的像素距离。 该方法还包括根据成像数据的第二对应部分,将基于垂直于快速扫描方向的慢扫描方向的M个像素的偏移量的L组N个轨迹曝光到介质上。 该方法包括重复交替地暴露K组和L组N个磁道,直到完整的介质沿着快速扫描方向曝光。 在交替曝光K组和L组之间或之后,在慢扫描方向上有进展,使得在暴露出曝光的像素的N个磁迹的完整长度之后,下一个N个磁道在下一个N个磁迹的开始处沿着介质匹配 。
    • 114. 发明授权
    • Cloning and copying on surfaces
    • 克隆和复制表面
    • US06534271B2
    • 2003-03-18
    • US09866513
    • 2001-05-25
    • Jens Peter FürsteSven KlussmannThomas KleinGünter Von Kiedrowski
    • Jens Peter FürsteSven KlussmannThomas KleinGünter Von Kiedrowski
    • C12Q168
    • C12N15/10C12Q1/686Y10S977/902C12Q2565/543C12Q2565/515C12Q2565/125
    • The present invention provides for amplification methods for cloning and copying genetic material on surfaces as well as copying biological material insofar as, in a broader sense, it can be classified as a ligand-receptor system. The invention therefore relates in particular to a method for propagating ligands and receptors on at least two surfaces, comprising (a) immobilizing a first ligand on a first surface of a substantially solid phase; (b) adding a solution of receptors and binding complementary receptors to the first ligand; (c) transferring the receptor to a second surface and immobilizing the receptor at that location; (d) attaching an additional ligand to the immobilized receptor; and (e) transferring the additional ligand to the first surface and immobilizing it at that location, wherein the steps set forth above may be repeated,multiple times.
    • 本发明提供了用于在表面上克隆和复制遗传物质以及复制生物材料的扩增方法,只要在更广泛的意义上它可以分类为配体 - 受体系统。 因此,本发明具体涉及用于在至少两个表面上传播配体和受体的方法,其包括(a)将第一配体固定在基本固相的第一表面上; (b)加入受体的溶液并将互补受体结合到第一配体上; (c)将受体转移到第二表面并将受体固定在该位置处; (d)将另外的配体连接到固定的受体上; 和(e)将另外的配体转移到第一表面并将其固定在该位置,其中上述步骤可以重复多次。
    • 116. 发明授权
    • Method of manufacturing Si gate MOS integrated circuit
    • Si栅极MOS集成电路的制造方法
    • US4151631A
    • 1979-05-01
    • US798215
    • 1977-05-18
    • Thomas Klein
    • Thomas Klein
    • H01L21/033H01L21/336B01J17/00
    • H01L29/66575H01L21/033H01L29/41783Y10S148/113Y10S148/114Y10S148/141Y10S438/981
    • An IC manufacturing method that eliminates the need for separate pad area and allows polysilicon MOS transistor gates to be contacted directly. Present silicon gate process techniques are utilized up to and including the formation of the gate oxide layer, with areas etched through to the substrate. Then polysilicon and silicon nitride are deposited preferably in the same deposition equipment. The polysilicon interconnect and gate pattern is selectively etched for both silicon nitride and polysilicon. Next, the gate oxide exposed by the previous step is removed and phosphorous is diffused into the exposed silicon substrate surfaces. The initial nitride thickness is chosen such that after phosphorous predeposition and subsequent removal of phosphorous glass, a thin layer of silicon nitride is left. A silicon oxide protective layer is then grown over the exposed silicon substrate surfaces. The remaining silicon nitride is removed and a phosphosilicate glass is deposited over the entire surface. Contact cuts are made through the phosphosilicate glass through which metal contacts are established.
    • 一种IC制造方法,其不需要单独的焊盘区域并允许多晶硅MOS晶体管栅极直接接触。 现有的硅栅极工艺技术被利用直到并包括形成栅极氧化物层,区域被蚀刻到衬底上。 然后多晶硅和氮化硅优选沉积在相同的沉积设备中。 对于氮化硅和多晶硅都选择性地蚀刻多晶硅互连和栅极图案。 接下来,去除通过前一步骤曝光的栅极氧化物,并且磷扩散到暴露的硅衬底表面中。 选择初始氮化物厚度,使得在磷预沉积和随后除去磷的玻璃之后,留下薄层的氮化硅。 然后在暴露的硅衬底表面上生长氧化硅保护层。 去除剩余的氮化硅,并在整个表面上沉积磷硅玻璃。 通过形成金属接触的磷硅玻璃制成接触切割。