专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

111. 发明授权

US07928456B2 Packaged light emitting devices 有权
标题翻译：封装发光器件
公开(公告)号：US07928456B2
公开(公告)日：2011-04-19
申请号：US11849530
申请日：2007-09-04
申请人： Peter Andrews , Thomas G. Coleman , James Ibbetson , Michael Leung , Gerald H. Negley , Eric Tarsa
发明人： Peter Andrews , Thomas G. Coleman , James Ibbetson , Michael Leung , Gerald H. Negley , Eric Tarsa
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/52 , H01L33/60 , H01L2924/181 , H01L2924/00012
摘要： Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.
摘要翻译：包装半导体发光器件包括具有限定反射腔的下侧壁部分的反射器。发光器件位于反射腔中。具有第一折射率的第一量固化的密封剂材料设置在包括发光器件的反射腔中。在第一量的固化的密封剂材料上提供第二量的具有与第一折射率不同的第二折射率的固化的密封剂材料。选择第一和第二折射率以在反射腔中提供掩埋透镜。

112. 发明申请

US20110053297A1 SUBMOUNTS FOR SEMICONDUCTOR LIGHT EMITTING DEVICES AND METHODS OF FORMING PACKAGED LIGHT EMITTING DEVICES INCLUDING DISPENSED ENCAPSULANTS 有权
标题翻译：用于半导体发光器件的方法和形成包装发光器件的方法，包括分配的封装
公开(公告)号：US20110053297A1
公开(公告)日：2011-03-03
申请号：US12938815
申请日：2010-11-03
申请人： Peter Andrews
发明人： Peter Andrews
IPC分类号： H01L23/14 , H01L33/00
CPC分类号： H01L33/52 , H01L33/486 , H01L33/54 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.
摘要翻译：用于安装LED芯片的基座包括：衬底，被配置为在衬底的上表面上接收LED芯片的管芯附接焊盘;围绕裸片安装焊盘的衬底上的第一弯液面控制特征，并且限定第一密封剂区域并且衬底上的第二弯液面控制特征包围第一密封剂区域并且限定衬底的上表面的第二密封剂区域。第一和第二弯液面控制特征可以与管芯附接垫基本共面。封装的LED包括如上所述的基座，并且还包括在芯片附接垫上的LED芯片，在第一密封剂区域内的衬底上的第一密封剂，以及在第二密封剂区域内的衬底上的第二密封剂，并且覆盖第一密封剂。还公开了方法实施例。

113. 发明授权

US07898281B2 Interface for testing semiconductors 有权
标题翻译：半导体测试接口
公开(公告)号：US07898281B2
公开(公告)日：2011-03-01
申请号：US12316511
申请日：2008-12-12
申请人： Peter Andrews , David Hess , Robert New
发明人： Peter Andrews , David Hess , Robert New
IPC分类号： G01R31/00
CPC分类号： G01R31/2891
摘要： A system includes an imaging device for capturing a video sequence and a display for displaying the video in a window of the display and effectively positioning a probe relative to probe pads of a device under test for testing a semiconductor wafer supported by a support of a probing environment.
摘要翻译：一种系统包括用于捕获视频序列的成像装置和用于在显示器的窗口中显示视频的显示器，并且相对于被测器件的探针焊盘有效地定位探针，以测试由探测支持体支撑的半导体晶片环境。

114. 发明授权

US07834375B2 Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants 有权
标题翻译：用于半导体发光器件的底座和形成包括分配的密封剂的封装发光器件的方法
公开(公告)号：US07834375B2
公开(公告)日：2010-11-16
申请号：US12100647
申请日：2008-04-10
申请人： Peter Andrews
发明人： Peter Andrews
IPC分类号： H01L27/15
CPC分类号： H01L33/52 , H01L33/486 , H01L33/54 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.
摘要翻译：用于安装LED芯片的基座包括：衬底，被配置为在衬底的上表面上接收LED芯片的管芯附接焊盘;围绕裸片安装焊盘的衬底上的第一弯液面控制特征，并且限定第一密封剂区域并且衬底上的第二弯液面控制特征包围第一密封剂区域并且限定衬底的上表面的第二密封剂区域。第一和第二弯液面控制特征可以与管芯附接垫基本共面。封装的LED包括如上所述的基座，并且还包括在芯片附接垫上的LED芯片，在第一密封剂区域内的衬底上的第一密封剂，以及在第二密封剂区域内的衬底上的第二密封剂，并且覆盖第一密封剂。还公开了方法实施例。

115. 发明申请

US20100252851A1 LED PACKAGE WITH INCREASED FEATURE SIZES 有权
标题翻译： LED包装具有增加的特征尺寸
公开(公告)号：US20100252851A1
公开(公告)日：2010-10-07
申请号：US12757891
申请日：2010-04-09
申请人： David Emerson , Brian Collins , Michael Bergmann , John Edmond , Eric Tarsa , Peter Andrews , Bernd Keller , Christopher Hussell , Amber Salter
发明人： David Emerson , Brian Collins , Michael Bergmann , John Edmond , Eric Tarsa , Peter Andrews , Bernd Keller , Christopher Hussell , Amber Salter
IPC分类号： H01L33/58
CPC分类号： H01L33/58 , H01L33/20 , H01L33/486 , H01L33/54 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2924/01019 , H01L2924/01087 , H01L2924/00014
摘要： A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having dimensions greater than 3.5 mm square used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management.
摘要翻译：具有增加的特征尺寸以提高光通量和功效的光发射器封装。发射极芯片设置在具有覆盖发射极芯片的透镜的基座上。在一些情况下，发光芯片的宽度与所述透镜在给定方向上的宽度的比率为0.5或更大。增加的特征尺寸使包装更有效地发光。一些包装包括尺寸大于3.5mm见方的底座，与较大的发射器芯片结合使用。使用具有较高热导率的材料来制造底座，为封装提供更好的热管理。

116. 发明授权

US07777971B2 Aperture stop device 有权
标题翻译：光圈停止装置
公开(公告)号：US07777971B2
公开(公告)日：2010-08-17
申请号：US11032758
申请日：2005-01-11
申请人： Gerhard Moller , Peter Andrews , Peter Reimer
发明人： Gerhard Moller , Peter Andrews , Peter Reimer
IPC分类号： G02B9/08
CPC分类号： G02B5/005 , G02B21/22
摘要： An aperture stop device is provided for use in a microscope with at least one adjustable observation parameter. The aperture stop device includes at least one aperture stop (50a, 50b) with an adjustable aperture, that is to say with an adjustable stop opening. The aperture stop (50a, 50b) is adapted to receive an aperture signal representative of an aperture to be adjusted. In addition the aperture stop device includes a control unit (52) for output of the aperture signal to the aperture stop (50a, 50b) in dependence at least on the respectively set value of the observation parameter of the microscope.
摘要翻译：提供一种孔径光阑装置，用于具有至少一个可调观察参数的显微镜。孔径光阑装置包括具有可调整孔径的至少一个孔径光阑（50a，50b），也就是说具有可调整的止动开口。孔径光阑（50a，50b）适于接收表示要调节的孔径的孔径信号。此外，孔径光阑装置包括用于根据显微镜的观察参数的分别设定的值将孔径信号输出到孔径光阑（50a，50b）的控制单元（52）。

117. 发明授权

US07688091B2 Chuck with integrated wafer support 失效
标题翻译：带集成晶圆支架的卡盘
公开(公告)号：US07688091B2
公开(公告)日：2010-03-30
申请号：US12075385
申请日：2008-03-10
申请人： Peter Andrews , Brad Froemke , John Dunklee
发明人： Peter Andrews , Brad Froemke , John Dunklee
IPC分类号： G01R31/02
CPC分类号： G01R31/2887
摘要： An improved chuck with lift pins within a probe station. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.
摘要翻译：一个改进的卡盘，在探针台内有升降针。卡盘组件可以具有外周边和上表面。提升销可以定位在卡盘组件的周边内，并且可以相对于卡盘组件的上表面相对垂直运动。

118. 发明授权

US07521728B2 Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same 有权
标题翻译：使用分配的反射器的半导体发光器件的封装及其形成方法
公开(公告)号：US07521728B2
公开(公告)日：2009-04-21
申请号：US11336369
申请日：2006-01-20
申请人： Peter Andrews
发明人： Peter Andrews
IPC分类号： H01L27/15
CPC分类号： H01L33/52 , H01L33/486 , H01L33/60 , H01L2224/32225 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A packaged LED includes a substrate, an LED chip on the upper surface of the substrate, a first encapsulant material, including a reflective material, on the substrate and spaced apart from the LED chip, and a second encapsulant material on the LED chip. A method of forming a packaged LED includes forming a first meniscus control feature on a substrate and defining a first region of the substrate, forming a second meniscus control feature surrounding the first region and defining a second region of the substrate between the first meniscus control feature and the second meniscus control feature, mounting an LED chip within the first region, dispensing a first encapsulant material including a reflective material within the second region, curing the first encapsulant material, dispensing a second encapsulant material on the substrate within the first region, and curing the second encapsulant material.
摘要翻译：封装的LED包括衬底，在衬底的上表面上的LED芯片，在衬底上并与LED芯片间隔开的包括反射材料的第一密封剂材料以及LED芯片上的第二密封剂材料。一种形成封装的LED的方法包括在衬底上形成第一弯液面控制特征并限定衬底的第一区域，形成围绕第一区域的第二弯液面控制特征，并在第一弯液面控制特征和第二弯液面控制特征，在第一区域内安装LED芯片，在第二区域内分配包括反射材料的第一密封剂材料，固化第一密封剂材料，在第一区域内分配衬底上的第二密封剂材料，以及固化第二密封材料。

119. 发明授权

US07518158B2 Semiconductor light emitting devices and submounts 有权
标题翻译：半导体发光器件和底座
公开(公告)号：US07518158B2
公开(公告)日：2009-04-14
申请号：US10987894
申请日：2004-11-12
申请人： Bernd Keller , James Ibbetson , Peter Andrews , Gerald H. Negley , Norbert Hiller
发明人： Bernd Keller , James Ibbetson , Peter Andrews , Gerald H. Negley , Norbert Hiller
IPC分类号： H01L29/861
CPC分类号： H01L33/507 , H01L25/167 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.
摘要翻译：半导体发光器件的基座包括其中具有腔室的半导体衬底，其配置为接收发光器件。第一接合焊盘定位在空腔中以耦合到容纳在空腔中的发光器件的第一节点。第二接合焊盘定位在空腔中以耦合到定位在其中的发光器件的第二节点。还提供了包括固体波长转换元件的发光器件及其形成方法。

120. 发明授权

US07405093B2 Methods of assembly for a semiconductor light emitting device package 有权
标题翻译：半导体发光器件封装的组装方法
公开(公告)号：US07405093B2
公开(公告)日：2008-07-29
申请号：US10920613
申请日：2004-08-18
申请人： Peter Andrews
发明人： Peter Andrews
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/81801 , H01L2924/01079 , H01L2924/01322 , H01L2924/12032 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： Methods of assembly for a semiconductor light emitting device package may include positioning a submount on a mounting substrate with a solder material and a flux therebetween. The semiconductor light emitting device is positioned on a top side of the submount with a solder material and a flux therebetween to provide an assembled stack that has not been reflowed. The assembled stack is reflowed to attach the submount to the mounting substrate and the light emitting device to the submount.
摘要翻译：用于半导体发光器件封装的组装方法可以包括使用焊料材料将焊盘定位在安装衬底上，并且其间具有焊剂。半导体发光器件位于基座的顶侧，焊料材料和焊剂之间的焊剂提供未被回流的组装堆叠。将组装的堆叠回流以将底座附接到安装基板和发光装置到底座。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式