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    • 111. 发明公开
    • LEUCHTDIODENCHIP
    • EP2612372A2
    • 2013-07-10
    • EP11746232.5
    • 2011-08-17
    • OSRAM Opto Semiconductors GmbH
    • HÖPPEL, LutzVON MALM, NorwinSABATHIL, Matthias
    • H01L33/22H01L25/075H01L33/00
    • H01L33/22H01L33/0079
    • A light-emitting diode chip is specified, comprising - a semiconductor body (1) comprising a radiation-generating active region (13), - at least two contact locations (2a, 2b) for making electrical contact with the active region, - a carrier (3) and - a connecting means (4), arranged between the carrier (3) and the semiconductor body (1), wherein - the semiconductor body (1) has a roughening (15) at its outer surfaces facing the carrier (3), - the semiconductor body (1) is mechanically connected to the carrier (3) by means of the connecting means (4), - the connecting means (4) is in direct contact with the semiconductor body (1) and the carrier (3) in some locations, and - the at least two contact locations (2a, 2b) are arranged at the top side of the semiconductor body (1) that faces away from the carrier (3).
    • 提供了一种发光二极管芯片,包括: - 包括辐射产生有源区(13)的半导体本体(1), - 用于与有源区电接触的至少两个接触位置(2a,2b), - (3)和布置在所述载体(3)与所述半导体本体(1)之间的连接装置(4),其中 - 所述半导体本体(1)在其面向所述载体的外表面处具有粗糙化(15) 所述连接装置(4)与所述半导体本体(1)直接接触,并且所述载体(3)通过所述连接装置(4)与所述载体(3)机械连接, (3),并且 - 所述至少两个接触位置(2a,2b)布置在所述半导体本体(1)的背对所述载体(3)的顶侧处。