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111. 发明申请

US20100056631A1 ANTIALLERGENIC COMPOSITION 审中-公开
标题翻译：抗真菌组合物
公开(公告)号：US20100056631A1
公开(公告)日：2010-03-04
申请号：US12447413
申请日：2007-10-26
申请人： Ryuji Hisamura , Shigeru Nakamura , Toyoaki Yoneda
发明人： Ryuji Hisamura , Shigeru Nakamura , Toyoaki Yoneda
IPC分类号： A61K31/19 , C07C59/01 , A61P27/14
CPC分类号： A61K31/191 , A61K9/0048 , A61K31/19 , A61K49/0008
摘要： An antiallergenic composition comprising 3-hydroxybutyric acid and/or a salt thereof. The antiallergenic composition is safe.
摘要翻译：包含3-羟基丁酸和/或其盐的抗过敏组合物。抗过敏组合物安全。

112. 发明申请

US20090230541A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090230541A1
公开(公告)日：2009-09-17
申请号：US12395008
申请日：2009-02-27
申请人： Makoto Araki , Shimpei Ishida , Shigeru Nakamura
发明人： Makoto Araki , Shimpei Ishida , Shigeru Nakamura
IPC分类号： H01L23/48 , H01L21/78 , H01L21/50
CPC分类号： H01L24/91 , H01L24/24 , H01L24/73 , H01L24/82 , H01L2224/0401 , H01L2224/04026 , H01L2224/04105 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/27013 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/73259 , H01L2224/73265 , H01L2224/83051 , H01L2224/92 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/1306 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/0206 , H05K1/186 , H05K3/429 , H05K3/4602 , H05K2201/09509 , H05K2201/10674 , H05K2201/10969 , H05K2203/049 , H01L2224/81 , H01L2224/82 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device in which a chip is embedded in a wiring board and bump electrodes formed over the front surface of the semiconductor chip are flip-chip coupled to wiring formed in the wiring board and the entire back surface of the semiconductor chip functions well as a back electrode and a method of manufacturing the semiconductor device. A semiconductor chip is embedded inside a wiring board. The semiconductor chip is flip-chip coupled (face down) to a base substrate as the core layer of the wiring board through bump electrodes. A conductive film is formed over the semiconductor chip's surface reverse to the surface over which bump electrodes are formed. The conductive film functions as a back electrode which supplies a reference voltage to the integrated circuit in the semiconductor chip. The conductive film is electrically coupled to third-layer wiring through vias.
摘要翻译：其中将芯片嵌入布线板中的半导体器件和形成在半导体芯片的前表面上的凸块电极被倒装芯片耦合到布线板中形成的布线，并且半导体芯片的整个背面的功能很好地作为背电极和半导体器件的制造方法。将半导体芯片嵌入在布线板内。半导体芯片通过凸块电极与布线板的芯层作为基底衬底（面向下）耦合（面向下）。导电膜形成在与形成凸起电极的表面相反的半导体芯片的表面上。导电膜用作向半导体芯片中的集成电路提供参考电压的背面电极。导电膜通过通孔电耦合到第三层布线。

113. 发明授权

US07564050B2 Radiation image detector 有权
标题翻译：辐射图像检测器
公开(公告)号：US07564050B2
公开(公告)日：2009-07-21
申请号：US12045478
申请日：2008-03-10
申请人： Kaku Irisawa , Yasuhisa Kaneko , Shigeru Nakamura
发明人： Kaku Irisawa , Yasuhisa Kaneko , Shigeru Nakamura
IPC分类号： G01N23/00
CPC分类号： G01T1/241 , G01T1/246
摘要： A radiation image detector includes: a photoconductive layer that generates electric charges when irradiated by recording electromagnetic waves which have passed through an electrode layer; and detecting electrodes, for detecting signals corresponding to the electric charges generated in the photoconductive layer. The radiation image detector further includes: dielectrics that cover the edges of the detecting electrodes, the edges being the side surfaces and portions of surfaces continuous with the side surfaces of the detecting electrodes, that face the photoconductive layer; and a charge injection preventing layer, which is a conductor with respect to electric charges of the same polarity as the electric charges accumulated during recording of the image information, and an insulator with respect to electric charges of the opposite polarity from the accumulated electric charges, provided to cover at least the surfaces of the detecting electrodes that face the photoconductive layer which are not covered by the dielectric.
摘要翻译：放射线图像检测器包括：光电导层，其通过记录已经通过电极层的电磁波照射时产生电荷; 以及用于检测对应于在光电导层中产生的电荷的信号的检测电极。放射线图像检测器还包括：覆盖检测电极的边缘的电介质，边缘是面对感光层的侧面和与检测电极的侧表面连续的表面的部分; 以及相对于与图像信息记录期间累积的电荷具有相同极性的电荷的导体和相对于累积电荷的极性相反的电荷的绝缘体的电荷注入阻止层，被设置成至少覆盖面对光电导层的检测电极的未被电介质覆盖的表面。

114. 发明授权

US07388082B2 Alkoxyalcohol adduct of rare earth monocarboxylate 失效
标题翻译：稀土单羧酸的醇醇加成物
公开(公告)号：US07388082B2
公开(公告)日：2008-06-17
申请号：US11226310
申请日：2005-09-15
申请人： Shigeru Nakamura
发明人： Shigeru Nakamura
IPC分类号： C07F5/00
CPC分类号： C07F5/003 , C01F17/0043
摘要： An alkoxyalcohol adduct of rare earth monocarboxylate has the formula (I): M(R2—COO)3.(R1O(CH2)nOH)p (I) in which M is a rare earth element such as Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu; R1 is an aliphatic hydrocarbon group having 1 to 4 carbon atoms or a substituted aliphatic hydrocarbon group having 3 to 6 carbon atoms; R2 is a hydrogen atom or an aliphatic hydrocarbon group having 1 to 4 carbon atoms which has or does not have a substituent; n is 2 or 3; and p is a number in the range of 0.5 to 3.
摘要翻译：稀土单羧酸盐的烷氧基醇加成物具有式（I）：<？in-line-formula description =“In-line formula”end =“lead”？> M（R 2 -COO）（R 1）O（CH 2）n OH）（R 1）其中M是稀土元素，例如Pr，Nd，Pm，Sm，Eu，Gd，Tb，Dy等，其中M为In-line-formula description =“In-line formula”end =“tail” Ho，Er，Tm，Yb和Lu; R 1是具有1至4个碳原子的脂族烃基或具有3至6个碳原子的取代的脂族烃基; R 2是具有或不具有取代基的碳原子数为1〜4的氢原子或脂肪族烃基; n为2或3; p为0.5〜3的数。

115. 发明申请

US20070114430A1 Image detector and manufacturing method of the same 有权
标题翻译：图像检测器及其制造方法相同
公开(公告)号：US20070114430A1
公开(公告)日：2007-05-24
申请号：US11602205
申请日：2006-11-21
申请人： Shinji Imai , Shigeru Nakamura
发明人： Shinji Imai , Shigeru Nakamura
IPC分类号： G01T1/24
CPC分类号： G01T1/244 , H01L27/1462 , H01L27/14632 , H01L27/14687 , H01L27/14692
摘要： In an image detector that includes the following layers arranged on top of another: a charge generation layer that generates charges when exposed to a recording electromagnetic wave representing image information; and a charge detection layer that includes multitudes of detection elements disposed two-dimensionally, each having a switch element and a pixel electrode used for reading out the charges generated in the charge generation layer, a smoothing layer formed by a wet coating process is provided between the charge generation layer and charge detection layer.
摘要翻译：在包括布置在另一层之上的以下层的图像检测器中：电荷产生层，当暴露于表示图像信息的记录电磁波时产生电荷; 以及电荷检测层，其包括二维设置的检测元件，各自具有用于读出在电荷产生层中产生的电荷的开关元件和像素电极，在湿式涂布工艺之间形成的平滑层设置在电荷产生层和电荷检测层。

116. 发明申请

US20070001092A1 Light Reception Output Controlling Apparatus of Photo Detector in Optical Pickup Unit 失效
标题翻译：光接收单元中光检测器的光接收输出控制装置
公开(公告)号：US20070001092A1
公开(公告)日：2007-01-04
申请号：US11427703
申请日：2006-06-29
申请人： Akira Tsukihashi , Shigeru Nakamura , Misao Kuramochi , Mitsuhiro Hiruma , Michiyoshi Sawada , Hiromitsu Kondo
发明人： Akira Tsukihashi , Shigeru Nakamura , Misao Kuramochi , Mitsuhiro Hiruma , Michiyoshi Sawada , Hiromitsu Kondo
IPC分类号： G02B27/40 , H03F3/08
CPC分类号： H03F3/08
摘要： In the optical pickup unit configured to guide a laser beam emitted from a laser source to an objective lens, to converge the laser beam with the objective lens to be irradiated to a disk, and to guide the laser beam reflected and returned by the disk to the photo detector including a light reception region constituted by a plurality of segments, the photo detector is disposed with each amplifier corresponding to each segment of the light reception region, is disposed with each output terminal that outputs each light reception output corresponding to each segment from the photo detector via each amplifier, and is disposed with an output setting circuit that sets each light reception output from each of the output terminals by changing the gain of each of the amplifiers and/or by attenuating the input or output of each of the amplifiers with an attenuator to correct each light reception output from each of the output terminals with the output setting circuit depending on an output difference generated in each light reception output from each of the output terminals based on a position of a light reception spot projected on the light reception region.
摘要翻译：在被配置为将从激光源发射的激光束引导到物镜的光学拾取单元中，将具有要照射到盘的物镜的激光束会聚并将由盘反射和返回的激光束引导到光检测器包括由多个段构成的光接收区域，光检测器设置有与光接收区域的每个段对应的每个放大器，每个输出端子输出与每个段对应的每个光接收输出经由每个放大器的光电检测器，并且设置有输出设置电路，其通过改变每个放大器的增益来设置每个输出端子的每个光接收输出和/或通过衰减每个放大器的输入或输出具有衰减器，以根据输出差异与输出设置电路校正每个输出端子的每个光接收输出基于投射在光接收区域上的光接收点的位置，从每个输出端子的每个光接收输出中产生的反射。

117. 发明申请

US20060280065A1 Optical pickup device 失效
标题翻译：光学拾取装置
公开(公告)号：US20060280065A1
公开(公告)日：2006-12-14
申请号：US11442496
申请日：2006-05-25
申请人： Tohru Hotta , Ryouichi Kawasaki , Shigeru Nakamura
发明人： Tohru Hotta , Ryouichi Kawasaki , Shigeru Nakamura
IPC分类号： G11B7/00
CPC分类号： G11B7/1365 , G11B7/1263 , G11B7/1275 , G11B7/1356 , G11B7/1395 , G11B2007/0006
摘要： A first laser source is arranged on a transmitting side of a polarizing beam splitter, while a second laser source is arranged on a reflecting side of the polarizing beam splitter. The splitting surface of the polarizing beam splitter has a film characteristic of substantially transmitting s-polarization component of the laser light having the first wavelength emitted by the first laser source and substantially reflecting s-polarization component of the laser light having the second wavelength emitted by the second laser source. A plate-like beam splitter serves to introduce laser light reflected off of a signal recording medium into an optical detector by directing the laser light away from the optical path in which the laser sources are located. The plate-like beam splitter includes a splitting surface which has a reflectance that is higher than its transmittance.
摘要翻译：第一激光源设置在偏振分束器的发射侧，而第二激光源设置在偏振分束器的反射侧。偏振分束器的分离表面具有基本上透射由第一激光源发出的具有第一波长的激光的s偏振分量并基本上反射出具有第二波长的激光的s偏振分量的膜特性，第二激光源。板状分束器用于将激光从激光源所在的光路引导出来，将从信号记录介质反射的激光引入光学检测器。板状分束器包括具有高于其透射率的反射率的分离表面。

118. 发明申请

US20060249709A1 PROCESS FOR PREPARATION OF RARE EARTH SILICATE PHOSPHOR 失效
标题翻译：制备稀土硅酸盐磷酸盐的方法
公开(公告)号：US20060249709A1
公开(公告)日：2006-11-09
申请号：US10799885
申请日：2004-03-15
申请人： Shigeru Nakamura
发明人： Shigeru Nakamura
IPC分类号： C09K11/08 , C09K11/66
CPC分类号： C09K11/7774
摘要： A rare earth element-activated rare earth silicate phosphor is prepared by the steps of (1) heating a rare earth carboxylate with an alkoxyalcohol to obtain a solution; (2) adding to the solution a silicon alkoxide and a compound of the element A, to prepare a mixture; and (3) subjecting the mixture to thermal decomposition.
摘要翻译：通过以下步骤制备稀土元素活化的稀土硅酸盐荧光体：（1）用烷氧基醇加热稀土羧酸盐以获得溶液; （2）向溶液中加入硅醇盐和元素A的化合物，以制备混合物; 和（3）使混合物进行热分解。

119. 发明授权

US07015070B2 Electronic device and a method of manufacturing the same 失效
公开(公告)号：US07015070B2
公开(公告)日：2006-03-21
申请号：US10790057
申请日：2004-03-02
申请人： Shigeru Nakamura
发明人： Shigeru Nakamura
IPC分类号： H01L21/44
CPC分类号： H05K3/341 , H01L24/27 , H01L2224/27001 , H01L2224/45144 , H01L2224/73204 , H01L2224/83192 , H01L2924/14 , H01L2924/19105 , H05K3/328 , H05K2201/10636 , H05K2201/10674 , H05K2203/0278 , Y02P70/611 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49137 , Y10T29/49139 , Y10T29/49144 , Y10T29/49149 , H01L2924/00
摘要： A method of manufacturing an electronic device including a first electronic component mounted on one main surface of a wiring board by being thermo-compression bonded by means of a thermo-compression bonding tool with an adhesive resin interposed between a first area of the one main surface of the wiring board and the first electronic component, and a second electronic component mounted on a second area different from the first area of the one main surface of the wiring board by melting a soldering paste material and higher than the first electronic component in post-mounting height, and wherein the first electronic component is mounted before the mounting of the second electronic component.

120. 发明授权

US06951774B2 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06951774B2
公开(公告)日：2005-10-04
申请号：US10086717
申请日：2002-03-04
申请人： Shigeru Nakamura , Masakatsu Gotou
发明人： Shigeru Nakamura , Masakatsu Gotou
IPC分类号： H01L25/18 , H01L21/60 , H01L23/31 , H01L25/065 , H01L25/07 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/49 , H01L23/3128 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05554 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/49171 , H01L2224/4945 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/85191 , H01L2224/92247 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06562 , H01L2225/06568 , H01L2225/06575 , H01L2225/06582 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/00011 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device having a stack structure comprises: a single-piece substrate having a chip support surface serving as a main surface, a back surface, a plurality of connection terminals provided on the chip support surface and a plurality of solder balls provided on the back surface; a first semiconductor chip having a main surface, aback surface, a plurality of semiconductor devices on the main surface of the first semiconductor chip and a plurality of pads provided on the main surface of the first semiconductor chip; a second semiconductor chip having a main surface, a back surface, a plurality of semiconductor devices provided on the main surface of the second semiconductor chip and a plurality of pads provided on the main surface of the second semiconductor chip; and a resin sealing body formed on the chip support surface of the single-piece substrate and used for sealing the first semiconductor chip and the second semiconductor chip; and a plurality of wires for connecting the pads of the second semiconductor chip to the respective connection terminals provided on the single-piece substrate.In the stack structure, the second semiconductor chip is made thinner than the first semiconductor chip. As a result, the structure package of the semiconductor device can be made thin.
摘要翻译：具有堆叠结构的半导体器件包括：具有用作主表面的芯片支撑表面的单片衬底，背面，设置在芯片支撑表面上的多个连接端子和设置在背面的多个焊球表面; 第一半导体芯片，其具有主表面，粗糙表面，在第一半导体芯片的主表面上的多个半导体器件和设置在第一半导体芯片的主表面上的多个焊盘; 具有主表面，后表面，设置在第二半导体芯片的主表面上的多个半导体器件和设置在第二半导体芯片的主表面上的多个焊盘的第二半导体芯片; 以及树脂密封体，其形成在所述单件基板的所述芯片支撑面上，用于密封所述第一半导体芯片和所述第二半导体芯片; 以及用于将第二半导体芯片的焊盘连接到设置在单片基板上的各个连接端子的多条导线。在堆叠结构中，第二半导体芯片比第一半导体芯片薄。结果，可以使半导体器件的结构封装变薄。

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