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111. 发明申请

US20100284159A1 CIRCUIT DEVICE 有权
标题翻译：电路设备
公开(公告)号：US20100284159A1
公开(公告)日：2010-11-11
申请号：US12837078
申请日：2010-07-15
申请人： Hideyuki Sakamoto , Hidefumi Saito , Yasuhiro Koike , Masao Tsukizawa
发明人： Hideyuki Sakamoto , Hidefumi Saito , Yasuhiro Koike , Masao Tsukizawa
IPC分类号： H05K5/00
CPC分类号： H05K1/144 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4903 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/3025 , H05K3/284 , H05K3/3447 , H05K5/065 , H05K2201/042 , H05K2201/10318 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.
摘要翻译：提供了能够增加封装密度并防止引入电路元件之间的热干扰的电路装置。在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式装配到壳体构件中。第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。此外，在壳体内设置有未填充有密封树脂的中空部。这样的结构防止作为微型计算机的第二电路元件例如由于在作为功率晶体管的第一电路元件中产生的热而不稳定地运行。

112. 发明授权

US07754901B2 Method for producing fluorinated compounds and polymers 有权
标题翻译：氟化合物和聚合物的制备方法
公开(公告)号：US07754901B2
公开(公告)日：2010-07-13
申请号：US12510003
申请日：2009-07-27
申请人： Yoshiyuki Okamoto , Yasuhiro Koike , Wei-Hong Liu , Yinzhong Guo
发明人： Yoshiyuki Okamoto , Yasuhiro Koike , Wei-Hong Liu , Yinzhong Guo
IPC分类号： C08F116/16 , C07D317/00
CPC分类号： C07D317/16 , C08F114/18
摘要： A fluorinated polymer comprising a unit represented by the following formula (1), a method for producing fluorinated compounds and the fluorinated polymers, and an optical/electrical material or coating material comprising the fluorinated polymer.
摘要翻译：包含由下式（1）表示的单元的氟化聚合物，含氟化合物的制造方法和氟化聚合物，以及包含含氟聚合物的光学/电气材料或涂料。

113. 发明申请

US20090326178A1 Method for Producing Fluorinated Compounds and Polymers 有权
标题翻译：生产氟化合物和聚合物的方法
公开(公告)号：US20090326178A1
公开(公告)日：2009-12-31
申请号：US12510003
申请日：2009-07-27
申请人： Yoshiyuki Okamoto , Yasuhiro Koike , Wei-Hong Liu , Yinzhong Guo
发明人： Yoshiyuki Okamoto , Yasuhiro Koike , Wei-Hong Liu , Yinzhong Guo
IPC分类号： C08F16/24 , C07D317/16
CPC分类号： C07D317/16 , C08F114/18
摘要： A fluorinated polymer comprising a unit represented by the following formula (1), a method for producing fluorinated compounds and the fluorinated polymers, and an optical/electrical material or coating material comprising the fluorinated polymer.
摘要翻译：包含由下式（1）表示的单元的氟化聚合物，含氟化合物的制造方法和氟化聚合物，以及包含氟化聚合物的光学/电气材料或涂料。

114. 发明授权

US07635780B2 Method for producing fluorinated 1,3-dioxolane compounds, fluorinated 1, 3-dioxolane compounds, fluorinated polymers of the fluorinated 1,3-dioxolane compounds and optical or electrical materials using the polymers 有权
标题翻译：氟化1,3-二氧戊环化合物的制造方法，氟化1,3-二氧戊环化合物，氟化1,3-二氧戊环化合物的氟化聚合物和使用聚合物的光学或电气材料
公开(公告)号：US07635780B2
公开(公告)日：2009-12-22
申请号：US10570210
申请日：2004-08-30
申请人： Yoshiyuki Okamoto , Yasuhiro Koike
发明人： Yoshiyuki Okamoto , Yasuhiro Koike
IPC分类号： C07D317/16 , C07D317/42
CPC分类号： C07D317/42 , C07D317/44 , C07D317/46
摘要： A production method of fluorinated compounds, for producing a compound represented by formula (3) in a fluorine-based solution in a flow of fluorine gas after reaction of at least one type of compounds represented by formula (1) and at least one type of compounds represented by formula (2). Similarly, fluorinated compounds represented by formula (4) prepared by the fluorination of compounds obtained by the reaction of formula (1) and formula (2)′. The fluorinated polymers obtained by the polymerizations of formula (3) and (4) compounds are useful as an optical or electrical materials. wherein R1, R2, R3, R4, Rff1, Rff2, Rff3, Rff4, X, Y, Z, and n are defined in the specification respectively.
摘要翻译：一种含氟化合物的制备方法，用于在由式（1）表示的至少一种类型的化合物与至少一种类型的化合物反应之后的氟气流中的氟基溶液中制备由式（3）表示的化合物由式（2）表示的化合物。类似地，通过氟化通过式（1）和式（2）'的反应获得的化合物氟化制备的由式（4）表示的氟化化合物。通过式（3）和（4）化合物的聚合获得的氟化聚合物可用作光学或电气材料。其中R1，R2，R3，R4，Rff1，Rff2，Rff3，Rff4，X，Y，Z和n分别在规范中定义。

115. 发明申请

US20090310976A1 Illuminative light communication system 审中-公开
标题翻译：照明光通信系统
公开(公告)号：US20090310976A1
公开(公告)日：2009-12-17
申请号：US12461225
申请日：2009-08-05
申请人： Masao Nakagawa , Toshihiko Komine , Shinichiro Haruyama , Takaaki Ishigure , Yasuhiro Koike
发明人： Masao Nakagawa , Toshihiko Komine , Shinichiro Haruyama , Takaaki Ishigure , Yasuhiro Koike
IPC分类号： H04B10/04
CPC分类号： H04B10/116 , F21K9/20 , F21K9/65 , F21V33/0052 , F21Y2115/10 , G09F9/33 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H04B3/54 , H04B10/1141 , H04B10/1149 , H04B2203/5412 , H04B2203/5458 , H05B37/0263 , H05B37/0272 , H01L2924/00014 , H01L2924/00
摘要： An light source control unit controls the flashing of a light source and the light amount of a light source according to information to be transmitted. Thus, light, which is modulated according to the information to be transmitted, is emitted from the light source. The light emitted from the light source is made to enter an optical fiber to pass therethrough and enter a light-scattering body which scatters and radiates the modulated light incident from the optical fiber. The scattered light serves as illumination light as it is. Furthermore, if the illumination light is decoded by a decoding unit after being received by a photoreceptor unit of a receiving set, then information carried by the illumination light can be received.
摘要翻译：光源控制单元根据要发送的信息来控制光源的闪烁和光源的光量。因此，根据要发送的信息调制的光从光源发射。使从光源发出的光进入光纤通过，并进入散射并辐射从光纤入射的调制光的光散射体。散射光照原样照亮。此外，如果照明光在被接收组的感光体接收之后被解码单元解码，则可以接收由照明光携带的信息。

116. 发明申请

US20090264610A1 Novel Copolymer of Methacrylic Ester, Composition, Optical Element and Electric Member 有权
标题翻译：新型甲基丙烯酸酯，组合物，光学元件和电气成员共聚物
公开(公告)号：US20090264610A1
公开(公告)日：2009-10-22
申请号：US12299157
申请日：2006-10-05
申请人： Yasuhiro Koike , Yoshiyuki Okamoto , Akihiro Tagaya
发明人： Yasuhiro Koike , Yoshiyuki Okamoto , Akihiro Tagaya
IPC分类号： C08F220/22
CPC分类号： C08F220/18 , C08F220/24 , Y10T428/105
摘要： A copolymer of (meth)acrylic ester represented by a general formula (1) including a following repeating unit A and repeating unit B. In the general formula (1), R1 and R2 each independently represent hydrogen atom or methyl group; R3 represents an alkyl group having 1 to 4 carbon atoms; Y represents an atomic group forming an aromatic ring; x represents 1 to n, n represents the number of fluorine atoms which can be contained in the aromatic ring; and a and b each independently represent an integer of 1 or more.
摘要翻译：由通式（1）表示的（甲基）丙烯酸酯的共聚物，其包含以下重复单元A和重复单元B.在通式（1）中，R 1和R 2各自独立地表示氢原子或甲基。 R3表示碳原子数1〜4的烷基。 Y表示形成芳环的原子团; x表示1〜n，n表示可以包含在芳香环中的氟原子数; a和b各自独立地表示1以上的整数。

117. 发明申请

US20090103276A1 CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US20090103276A1
公开(公告)日：2009-04-23
申请号：US12239256
申请日：2008-09-26
申请人： Hideyuki SAKAMOTO , Hidefumi Saito , Yasuhiro Koike , Masao Tsukizawa
发明人： Hideyuki SAKAMOTO , Hidefumi Saito , Yasuhiro Koike , Masao Tsukizawa
IPC分类号： H05K1/11 , H05K3/36 , H05K3/46
CPC分类号： H05K1/144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/01004 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H01L2924/3025 , H05K3/284 , H05K3/3447 , H05K5/065 , H05K2201/042 , H05K2201/10318 , Y10T29/49146 , H01L2924/00014 , H01L2924/00
摘要： Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.
摘要翻译：本发明提供一种电路装置及其制造方法，其特征在于，能够使由树脂构成的多个电路基板与树脂密封而形成。在混合集成电路装置中，第一电路板与第二电路板重叠，并且两个板都装配到壳体中。第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。此外，在壳体构件的侧壁部设置有开口，壳体的内部空间通过该开口与外部连通。因此，在树脂密封工序中，能够通过该开口从外部将密封树脂注入到壳体的内部空间。

118. 发明申请

US20090086454A1 CIRCUIT DEVICE 有权
标题翻译：电路设备
公开(公告)号：US20090086454A1
公开(公告)日：2009-04-02
申请号：US12239250
申请日：2008-09-26
申请人： Hideyuki Sakamoto , Hidefumi Saito , Yasuhiro Koike , Masao Tsukizawa
发明人： Hideyuki Sakamoto , Hidefumi Saito , Yasuhiro Koike , Masao Tsukizawa
IPC分类号： H05K7/00
CPC分类号： H05K1/144 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4903 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/3025 , H05K3/284 , H05K3/3447 , H05K5/065 , H05K2201/042 , H05K2201/10318 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.
摘要翻译：提供了能够增加封装密度并防止引入电路元件之间的热干扰的电路装置。在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式装配到壳体构件中。第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。此外，在壳体内设置有未填充有密封树脂的中空部。这样的结构防止作为微型计算机的第二电路元件例如由于在作为功率晶体管的第一电路元件中产生的热而不稳定地运行。

119. 发明申请

US20090086431A1 CIRCUIT DEVICE, CIRCUIT MODULE, AND OUTDOOR UNIT 有权
标题翻译：电路设备，电路模块和室外单元
公开(公告)号：US20090086431A1
公开(公告)日：2009-04-02
申请号：US12239286
申请日：2008-09-26
申请人： Hideyuki Sakamoto , Hidefumi Saito , Yasuhiro Koike , Masao Tsukizawa
发明人： Hideyuki Sakamoto , Hidefumi Saito , Yasuhiro Koike , Masao Tsukizawa
IPC分类号： H05K7/00 , H05K7/20
CPC分类号： H05K7/20009 , H01L2224/48091 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19105 , H05K1/144 , H01L2924/00014 , H01L2924/00
摘要： Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.
摘要翻译：提供一种电路装置，其能够增加封装密度并且还抑制所加入的电路元件之间的热干扰。在混合集成电路装置中，将第一电路基板和第二电路基板结合到壳体部件中，使得第一电路板与第二电路板重叠。第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。另外，在壳体的内部，设置没有填充有密封树脂的中空部（内部空间），该中空部通过将壳体部件打开而设置的连通开口与外部连通。

120. 发明授权

US07136269B2 Inverted circuit overcurrent protection device and hybrid integrated circuit device with the same incorporated 有权
标题翻译：反相电路过流保护装置和混合集成电路装置相同
公开(公告)号：US07136269B2
公开(公告)日：2006-11-14
申请号：US10422556
申请日：2003-04-24
申请人： Junichi Iimura , Katsumi Okawa , Yasuhiro Koike , Soichi Izutani
发明人： Junichi Iimura , Katsumi Okawa , Yasuhiro Koike , Soichi Izutani
IPC分类号： H02H3/08
CPC分类号： H02H7/1222 , H02H3/006
摘要： An inverter circuit overcurrent protection device in which an overcurrent detection resistor (Rs) is incorporated in a hybrid integrated circuit, in which a detection voltage from the overcurrent detection resistor (Rs) is divided by voltage dividing resistors (R1 and R2) and is compared with a reference voltage in an overcurrent detection circuit, for carrying out an overcurrent protection, and an external resistor is connected in series or in parallel with one of the voltage dividing resistors (R1 and R2) to change a division ratio so that the level of overcurrent protection can be adjusted; and an embodiment wherein, in the vicinity of a current detection terminal, a first pad (P1) is connected to a detection voltage from the overcurrent detection resistance, a second pad (P2) is connected to a detection voltage from the amplifier, and a third pad (P3) is connected to the voltage dividing resistors, and a bonding wire (10) is connected between the current detection terminal one of said pads, to select one of a plurality of overcurrent protection devices.
摘要翻译：一种逆变器电路过电流保护装置，其中过电流检测电阻器（Rs）被并入混合集成电路中，其中来自过电流检测电阻器（Rs）的检测电压被分压电阻器（R 1> SUB＆gt;和R＆lt; 2＆gt;），并与过电流检测电路中的参考电压进行比较，以实现过电流保护，并且外部电阻器与分压中的一个串联或并联电阻器（R 1 1和R 2），以改变分频比，从而可以调节过电流保护的电平; 以及在电流检测端子附近，由过电流检测电阻将第一焊盘（P 1）与检测电压连接的第二焊盘（P 2）与放大器的检测电压连接的实施例，并且第三焊盘（P 3）连接到分压电阻器，并且接合线（10）连接在所述焊盘之一的电流检测端子之间，以选择多个过电流保护装置中的一个。

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