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111. 发明授权

US06746589B2 Plating method and plating apparatus 失效
公开(公告)号：US06746589B2
公开(公告)日：2004-06-08
申请号：US09955115
申请日：2001-09-19
申请人： Koji Mishima , Hiroaki Inoue , Natsuki Makino , Junji Kunisawa , Kenji Nakamura , Tetsuo Matsuda , Hisashi Kaneko , Toshiyuki Morita
发明人： Koji Mishima , Hiroaki Inoue , Natsuki Makino , Junji Kunisawa , Kenji Nakamura , Tetsuo Matsuda , Hisashi Kaneko , Toshiyuki Morita
IPC分类号： C25D500
CPC分类号： H01L21/2885 , C25D5/04 , C25D5/08 , C25D21/12 , H01L21/7684 , H01L21/76877
摘要： The present invention relates to a plating method and a plating apparatus which can attain embedding of copper into fine interconnection patterns with use of a plating liquid having high throwing power and leveling properties, and which can make film thickness of a plated film substantially equal between an interconnection region and a non-interconnection region. A plating method comprises filling a plating liquid containing metal ions and an additive into a plating space formed between a substrate and an anode disposed closely to the substrate so as to face the substrate, and changing concentration of the additive in the plating liquid filled into the plating space during a plating process.

112. 发明授权

US06638411B1 Method and apparatus for plating substrate with copper 有权
标题翻译：用铜电镀基板的方法和装置
公开(公告)号：US06638411B1
公开(公告)日：2003-10-28
申请号：US09492138
申请日：2000-01-27
申请人： Koji Mishima , Mizuki Nagai , Ryoichi Kimizuka , Tetsuo Matsuda , Hisashi Kaneko
发明人： Koji Mishima , Mizuki Nagai , Ryoichi Kimizuka , Tetsuo Matsuda , Hisashi Kaneko
IPC分类号： C25D534
CPC分类号： C25D17/001 , C25D5/18 , C25D5/34 , C25D7/123 , H05K3/22 , H05K2203/0392 , H05K2203/122 , Y10S205/917
摘要： The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate to produce copper interconnections on a surface of a substrate. The substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution. Thereafter, the substrate is brought into contact with the plating solution to plate the substrate.
摘要翻译：本发明涉及一种使用例如硫酸铜溶液在铜的电镀上分离金属铜的方法和装置，以在基板的表面上产生铜互连。使基板与包含在电镀液中的含有有机物质和硫化合物的至少一种的处理液接触至少一次。此后，使基板与电镀液接触以对基板进行平板化。

113. 发明授权

US06633450B1 Method of and apparatus for controlling disk drive 失效
标题翻译：控制磁盘驱动器的方法和设备
公开(公告)号：US06633450B1
公开(公告)日：2003-10-14
申请号：US09371559
申请日：1999-08-10
申请人： Hisashi Kaneko
发明人： Hisashi Kaneko
IPC分类号： G11B1546
CPC分类号： G11B19/26 , G11B19/02
摘要： A method and an apparatus for controlling a disk drive are contrived to reduce consumed electric power of a spindle motor of the disk drive while an operation continues. The disk drive has a disk storage medium, the spindle motor for rotating the disk storage medium, and a head for reading data on the disk storage medium. This control method comprises a first step of detecting a load of the spindle motor or a load capacity of a power source of the disk drive, and a second step of selecting any one of a first mode of revolving the spindle motor at a comparatively high speed and reading the data on the disk storage medium by the head, and a second mode of revolving the spindle motor at a comparatively low speed and reading the data on the disk storage medium by the head in accordance with a detected result of the first step.
摘要翻译：设计一种用于控制磁盘驱动器的方法和装置，以在操作继续时减少磁盘驱动器的主轴电动机的消耗电力。磁盘驱动器具有磁盘存储介质，用于旋转磁盘存储介质的主轴电机和用于读取磁盘存储介质上的数据的磁头。该控制方法包括：检测主轴电机的负载或磁盘驱动器的电源的负载能力的第一步骤，以及选择以较高速度旋转主轴电动机的第一模式中的任何一个的第二步骤以及通过头部读取磁盘存储介质上的数据，以及以较低速度旋转主轴电机的第二模式，并且根据第一步骤的检测结果，由磁头读取磁盘存储介质上的数据。

114. 发明授权

US06375823B1 Plating method and plating apparatus 失效
标题翻译：电镀方法和电镀装置
公开(公告)号：US06375823B1
公开(公告)日：2002-04-23
申请号：US09500645
申请日：2000-02-09
申请人： Tetsuo Matsuda , Hisashi Kaneko , Katsuya Okumura
发明人： Tetsuo Matsuda , Hisashi Kaneko , Katsuya Okumura
IPC分类号： C25D506
CPC分类号： C25D5/16 , C25D5/02 , C25D5/06 , C25D7/123 , C25D17/001 , C25D17/12 , H01L21/2885 , H01L21/76877 , H05K3/423
摘要： A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plating solution is supplied by causing an impregnated member containing the plating solution to face the conductive layer. Since the plating solution stays in the depression, a larger amount of plating solution is supplied than on the upper surface of the substrate, and the plating rate of the plating film in the depression increases. Consequently, the plating film can be preferentially formed in the depression such as a groove or hole.
摘要翻译：对形成在具有凹陷图案的基板上的导电层施加阴极电位。将与阳极电接触的电镀溶液供给到导电层，以在导电层上形成镀膜。此时，通过使包含电镀液的浸渍部件面对导电层而供给电镀液。由于电镀溶液滞留在凹陷中，所以与基板的上表面相比，供给电镀液的量较多，因此抑制了镀膜的镀覆速度。因此，可以在诸如凹槽或孔的凹陷中优先地形成镀膜。

115. 发明授权

US06229211B1 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06229211B1
公开(公告)日：2001-05-08
申请号：US09362683
申请日：1999-07-29
申请人： Takashi Kawanoue , Junichi Wada , Tetsuo Matsuda , Hisashi Kaneko
发明人： Takashi Kawanoue , Junichi Wada , Tetsuo Matsuda , Hisashi Kaneko
IPC分类号： H01L2348
CPC分类号： H01L21/76843 , H01L21/76846 , H01L21/76849 , H01L21/76855 , H01L21/76856 , H01L23/53209 , H01L23/53276 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device comprises a base layer, a barrier metal layer formed on the base layer and a metal interconnect formed on the barrier metal layer, the barrier metal layer being made of at least one element &agr; selected from metal elements and at least one element &bgr; selected from a group of boron, oxygen, carbon and nitrogen and having at least two compound films &agr;&bgr;n with different compositional ratios in atomic level arranged to form a laminate. When the elements &agr; contained in the compound films &agr;&bgr;n are same and identical and at least one of the at least two compound films &agr;&bgr;n is a compound film &agr;&bgr;x (x>1), the via resistance and the interconnect resistance of the device can be reduced, while maintaining the high barrier effect.
摘要翻译：半导体器件包括基底层，形成在基底层上的阻挡金属层和形成在阻挡金属层上的金属互连，阻挡金属层由选自金属元素和至少一个元素β的至少一种元素α制成选自一组硼，氧，碳和氮，并且具有至少两个具有原子级别的不同组成比的英文字母复合膜，以形成层压体。当复合薄膜字母表中包含的元素α相同且相同时，至少两个化合物薄膜字母表中的至少一个是化合物薄膜字母（x> 1）时，器件的通孔电阻和互连电阻可以减小同时保持高屏障效果。

116. 发明授权

US6069071A Method of manufacturing an interconnect by dissolving an intermetallic compound film into a main component of a metal film 失效
标题翻译：通过将金属间化合物膜溶解在金属膜的主要成分中来制造互连的方法
公开(公告)号：US6069071A
公开(公告)日：2000-05-30
申请号：US996240
申请日：1997-12-22
申请人： Masahiko Hasunuma , Hisashi Kaneko
发明人： Masahiko Hasunuma , Hisashi Kaneko
IPC分类号： H01L21/28 , H01L21/768 , H01L21/44
CPC分类号： H01L21/76864 , H01L21/76843 , H01L21/76882
摘要： The intermetallic compound used to form a liner in the wiring of the semiconductor device is formed from a compound of a main component of the metal film used as the wiring and at least one metal material made to be dissolved in the main component to form a solid solution, or from a compound of at least two metal materials capable of forming a solid solution with the main component. The metal elements constituting the intermetallic compound are made to be dissolved in the metal film to form a solid solution during a heat treatment, and thus the barrier formed by the liner, which has been a problem studied to be solved, can be absent. Therefore, a semiconductor device excellent in resistance against electromigration and a highly reliable wiring process can be obtained.
摘要翻译：用于在半导体器件的布线中形成衬垫的金属间化合物由用作布线的金属膜的主要成分的化合物和制成溶解在主要成分中的至少一种金属材料形成，以形成固体溶液，或由能够与主要成分形成固溶体的至少两种金属材料的化合物。构成金属间化合物的金属元素在热处理中被溶解在金属膜中以形成固溶体，因此可以不存在已经被解决的问题的衬垫形成的阻挡层。因此，可以获得耐电迁移和高可靠性布线工艺优异的半导体器件。

117. 发明授权

US5859746A Magnetic disk drive and flexible printed board used in such drive 失效
标题翻译：这种驱动器中使用的磁盘驱动器和柔性印刷电路板
公开(公告)号：US5859746A
公开(公告)日：1999-01-12
申请号：US707201
申请日：1996-08-30
申请人： Katsuaki Ishida , Mitsuhisa Sekino , Yoshiaki Nagasawa , Tomoo Sukagawa , Masaharu Sugimoto , Tsuyoshi Furukawa , Masaki Jinbo , Tsuneyori Ino , Hisashi Kaneko , Shinichi Fukuzawa
发明人： Katsuaki Ishida , Mitsuhisa Sekino , Yoshiaki Nagasawa , Tomoo Sukagawa , Masaharu Sugimoto , Tsuyoshi Furukawa , Masaki Jinbo , Tsuneyori Ino , Hisashi Kaneko , Shinichi Fukuzawa
IPC分类号： G11B5/60 , G11B5/127 , G11B5/48 , G11B5/55 , G11B21/02 , G11B25/04 , G11B33/12 , H05K1/18 , G11B5/012
CPC分类号： G11B33/121 , G11B25/043 , G11B5/4813 , G11B5/4886 , G11B5/5526 , H05K1/189 , G11B5/4846 , H05K2201/055
摘要： A magnetic disk drive having one or more magnetic disks, one or more read/write heads each recording or reproducing information for a corresponding one of the magnetic disks, a servo head reading control information from a predetermined one of the magnetic disks, and an actuator supporting the one or more read/write heads and the servo head includes first leads extending from the one or more read/write heads along one side of the actuator, and second leads extending from the servo head along the other side of the actuator so that the second leads can be distanced in space from the first leads.
摘要翻译：具有一个或多个磁盘的磁盘驱动器，一个或多个读/写头，每个读/写头都记录或再现相应的一个磁盘的信息，来自预定的一个磁盘的伺服头读取控制信息，以及致动器支持一个或多个读/写头，并且伺服头包括从致动器的一侧从一个或多个读/写头延伸的第一引线和沿着致动器的另一侧从伺服头延伸的第二引线，使得第二个引线可以与第一个引线距离太空。

118. 发明授权

US5770095A Polishing agent and polishing method using the same 失效
标题翻译：抛光剂和抛光方法使用相同
公开(公告)号：US5770095A
公开(公告)日：1998-06-23
申请号：US500753
申请日：1995-07-11
申请人： Yasutaka Sasaki , Nobuo Hayasaka , Hisashi Kaneko , Hideaki Hirabayashi , Masatoshi Higuchi
发明人： Yasutaka Sasaki , Nobuo Hayasaka , Hisashi Kaneko , Hideaki Hirabayashi , Masatoshi Higuchi
IPC分类号： C09K13/06 , C23F1/18 , C23F3/00 , H01L21/304 , H01L21/3205 , H01L21/321 , H01L21/768 , H01L21/00 , B44C1/22 , C23F1/00
CPC分类号： C23F3/00 , H01L21/3212 , H01L21/7684
摘要： The present invention provides a polishing method including the steps of forming a film made of material containing a metal as a main component over a substrate having depressed portions on a surface thereof so as to fill the depressed portions with the film, and polishing the film by a chemical mechanical polishing method using a polishing agent containing a chemical agent responsible for forming a protection film on a surface of the film by reacting with the material containing a metal as a main component, thereby forming a conductive film in the depressed portions. The present invention also provides a polishing agent, which is used in forming a film made of material containing a metal as a main component in depressed portions of a substrate having depressed portions on a surface thereof by using a chemical mechanical polishing method, including a chemical agent responsible for forming a protection film on the surface of a substrate to be polished by reacting with the material containing a metal as a main component.
摘要翻译：本发明提供了一种抛光方法，包括以下步骤：在其表面上具有凹陷部分的基底上形成由含有金属作为主要成分的材料制成的膜，以便用该膜填充凹陷部分，并且通过使用包含负责通过与包含金属作为主要成分的材料在膜的表面上形成保护膜的化学试剂的抛光剂的化学机械抛光方法，从而在凹陷部分中形成导电膜。本发明还提供了一种抛光剂，其用于通过使用化学机械抛光方法在其表面上形成具有凹陷部的基板的凹部中的以金属为主要成分的材料制成的膜，所述化学机械抛光方法包括化学负责通过与含有金属作为主要成分的材料反应而在要抛光的基材的表面上形成保护膜的试剂。

119. 发明授权

US5731927A Spindle assembly for a disk drive using less than a full compliment of disks 失效
标题翻译：磁盘驱动器的主轴组合使用少于完整的磁盘
公开(公告)号：US5731927A
公开(公告)日：1998-03-24
申请号：US747307
申请日：1996-11-12
申请人： Hisashi Kaneko
发明人： Hisashi Kaneko
IPC分类号： G11B17/038 , G11B19/20 , G11B33/14 , G11B17/04
CPC分类号： G11B33/14 , G11B17/038 , G11B19/2009
摘要： A spindle assembly for a disk drive uses fewer than the maximum number of disks, reducing power consumption of a spindle motor without reducing the dust collecting ability of an air filter. The spindle assembly includes a shaft adapted to be fixed to a housing of the disk drive, and a spindle hub rotatably mounted on the shaft. A first set of disks spaced from each other a given distance is mounted on a lower portion of the spindle hub, and a second set of disks spaced from each other the above given distance is mounted on an upper portion of the spindle hub. A dummy ring is mounted on an intermediate portion of the spindle hub to define a large space between the first set and the second set. The intermediate portion does not have disks. A clamp is secured to the spindle hub by screws, thereby fixing the first and second sets of disks to the spindle hub.
摘要翻译：用于磁盘驱动器的主轴组件使用的磁盘数量少于最大数量，从而降低主轴电机的功耗，而不会降低空气过滤器的集尘能力。主轴组件包括适于固定到盘驱动器的壳体的轴和可旋转地安装在轴上的主轴毂。彼此间隔一定距离的第一组磁盘安装在主轴毂的下部，并且在主轴毂的上部安装了彼此在上述给定距离间隔开的第二组磁盘。虚拟环安装在主轴毂的中间部分上，以在第一组和第二组之间限定大的空间。中间部分不具有盘。夹具通过螺钉固定到主轴毂，从而将第一组和第二组固定到主轴毂。

120. 发明授权

US5498909A Semiconductor device and method of manufacturing such semiconductor device 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US5498909A
公开(公告)日：1996-03-12
申请号：US937398
申请日：1992-08-31
申请人： Masahiko Hasunuma , Hisashi Kaneko , Atsuhito Sawabe , Takashi Kawanoue , Yoshiko Kohanawa , Shuichi Komatsu
发明人： Masahiko Hasunuma , Hisashi Kaneko , Atsuhito Sawabe , Takashi Kawanoue , Yoshiko Kohanawa , Shuichi Komatsu
IPC分类号： C30B25/14 , H01L21/28 , H01L21/285 , H01L21/3205 , H01L21/822 , H01L23/52 , H01L23/532 , H01L27/04 , H01L29/41 , H01L23/48 , H01L23/28 , H01L29/40
CPC分类号： H01L21/28556 , H01L21/32051 , H01L23/532 , H01L23/53219 , H01L23/53223 , H01L23/53233 , H01L23/53242 , H01L23/53247 , H01L2924/0002
摘要： The close-packed plane of a single crystal forming an electrode line such as electrodes or lines of a semiconductor device whose active regions are reduced in size, i.e., highly integrated, is arranged parallel to the longitudinal direction of the line; or in the case of a polycrystalline electrode line, the angle formed between the normal line direction of the close-packed plane of its crystal grains and that of the electrode line is arranged to be 80.degree. or less.
摘要翻译：形成电极线的单晶的紧密平面平行于线的纵向方向布置，其中活性区域尺寸减小，即高度集成的半导体器件的电极或线路的电极线，或者在多晶电极线的情况下，将其晶粒的紧密接合面的法线方向与电极线的法线方向之间形成的角度设定为80°以下。

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