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    • 111. 发明授权
    • Fine-grained thermal control in memory subsystems
    • 内存子系统中的细粒度热控制
    • US06851064B2
    • 2005-02-01
    • US09934615
    • 2001-08-22
    • Joseph Weiyeh KuChandrakant D. Patel
    • Joseph Weiyeh KuChandrakant D. Patel
    • G06F11/34G06F1/20
    • G06F11/3466G06F2201/81
    • An apparatus and method for monitoring memory system performance and controlling an operating parameter is provided. A plurality of digital events indicative of memory system operations is detected, from which a subset of digital events to count is periodically selected, the subset being those digital events occurring during a sampling window time interval. Responsive to each digital event of the subset, a transistor is switched on to conduct current from a power supply to a capacitor. The transistor is biased by the capacitor to operate in a constant current region providing a substantially fixed amount of charge added to the capacitor responsive to each digital event of the subset. The operating parameter is controlled responsive to the charge accumulated in the capacitor, representative of the count of digital events in the subset. In one embodiment, the sampling window time interval is selected pseudo-randomly within a periodic base time interval.
    • 提供了一种用于监视存储器系统性能并控制操作参数的装置和方法。 检测指示存储器系统操作的多个数字事件,从中定期选择要计数的数字事件的子集,该子集是在采样窗口时间间隔期间发生的那些数字事件。 响应于子集的每个数字事件,晶体管被接通以将电流从电源传导到电容器。 晶体管被电容器偏置以在恒定电流区域中工作,该电流区域响应于子集的每个数字事件提供添加到电容器的基本固定量的电荷。 响应于在电容器中累积的电荷控制操作参数,代表该子集中数字事件的计数。 在一个实施例中,采样窗口时间间隔在周期性基准时间间隔内伪随机选择。
    • 113. 发明授权
    • Ducted high aspect ratio heatsink assembly
    • 导管高宽比散热器组件
    • US5946190A
    • 1999-08-31
    • US920515
    • 1997-08-29
    • Chandrakant D. PatelFrederic AmersonChristian Belady
    • Chandrakant D. PatelFrederic AmersonChristian Belady
    • F28F3/02H05K7/20
    • H05K7/20154F28F3/048
    • A low-cost high aspect ratio skived heatsink with high performance ducting in order to optimize airflow over and through the skived fins. The skived heatsink can additionally have formed channels or extruded holes for insertion of a heatsink pipe therein. A thermally enhanced compound is used between the heatsink and heatpipe to provide a low thermal resistance between the parts. The heatpipe is expanded to optimally fill the channel or hole by injecting pressured fluid into the pipe before sealing the pipe with working fluid, or via heating of a sealed pipe and expansion of the working fluid therein. A partitioned cooling system can additionally be used, one partitioned section having high volume airflow with low static pressure, and another partitioned section using higher velocity ducted air over a plurality of skived heatsinks.
    • 一种低成本高纵横比的高性能导管散热片,以优化气流通过和通过翅片。 经过散热的散热器可另外形成有用于将散热管插入其中的通道或挤出孔。 在散热器和热管之间使用热增强化合物,以在部件之间提供低热阻。 通过在用管道与工作流体密封之前,或者通过密封管的加热和其中的工作流体的膨胀,将管道膨胀到最佳地填充通道或孔。 另外可以使用分隔的冷却系统,一个分隔部分具有高静态空气流量,另一个分隔部分使用多个刮风散热器中的较高速度的管道空气。