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    • 113. 发明申请
    • Moving picture editing apparatus
    • 运动图像编辑装置
    • US20100061445A1
    • 2010-03-11
    • US12461204
    • 2009-08-04
    • Satoshi ShimadaAkira NakagawaAkihiro Yamori
    • Satoshi ShimadaAkira NakagawaAkihiro Yamori
    • H04N7/26
    • G11B27/034H04N19/40H04N19/61H04N19/70H04N19/85
    • A moving picture editing apparatus includes a picture extracting unit that extracts pictures of a predetermined range including a picture subsequent to a coupling point from encoded data to be coupled; an adjustment-information generating unit that generates adjustment information for adjusting values of information to be continuous from/to inside to/from outside the predetermined range upon decoding, from among information included in headers of the pictures of the predetermined range extracted by the picture extracting unit; and a re-encoding unit that adds the adjustment information generated by the adjustment-information generating unit to the headers of the pictures of the predetermined range extracted by the picture extracting unit, and re-encodes the pictures of the predetermined range.
    • 运动图像编辑装置包括:图像提取单元,从耦合的编码数据中提取包括耦合点之后的图像的预定范围的图像; 调整信息生成单元,从解码后的预定范围的图像的标题中包含的信息中生成用于调整从内到外的信息的值的调整信息, 单元; 以及重新编码单元,其将由调整信息生成单元生成的调整信息添加到由图像提取单元提取的预定范围的图像的标题,并对预定范围的图像进行重新编码。
    • 116. 发明申请
    • MANUFACTURING METHOD FOR SEMICONDUCTOR CHIPS
    • 半导体晶片的制造方法
    • US20090093104A1
    • 2009-04-09
    • US11911918
    • 2006-04-17
    • Kiyoshi AritaAkira Nakagawa
    • Kiyoshi AritaAkira Nakagawa
    • H01L21/302
    • H01L21/6835H01L21/3065H01L21/78H01L29/0657H01L2221/6834H01L2221/68354H01L2924/10158H01L2924/30105
    • By forming dividing-groove portions in accordance with dividing regions on the second surface of a semiconductor wafer where an insulating film is placed in the dividing regions of the first surface and performing etching of the entire second surface and the surfaces of the dividing-groove portions by performing plasma etching from the second surface, corner portions on the second surface side are removed, while the insulating film is exposed from the etching bottom portion by removing the dividing-groove portions in the dividing regions. And by continuously performing the plasma etching in a state in which the exposed insulating film is surface charged with electric charge due to ions in plasma, corner portions on the first surface side put in contact with the insulating film are removed, and semiconductor chips that have a high transverse rupture strength are provided.
    • 通过在半导体晶片的第二表面上形成分隔槽部分,其中绝缘膜被放置在第一表面的分割区域中,并且对整个第二表面进行蚀刻,并且分割槽部分的表面 通过从第二表面进行等离子体蚀刻,除去第二表面侧的角部,同时通过去除分割区域中的分割槽部分从蚀刻底部露出绝缘膜。 并且通过在由于等离子体中的离子而暴露的绝缘膜被表面带电荷的状态下连续进行等离子体蚀刻,去除与绝缘膜接触的第一表面侧的角部,以及具有 提供了高的横向断裂强度。