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    • 103. 发明申请
    • METHODS AND APPARATUS FOR PROCESSING MICROELECTRONIC WORKPIECES USING METROLOGY
    • 使用计量处理微电子工件的方法和装置
    • WO02004887A1
    • 2002-01-17
    • PCT/US2001/021800
    • 2001-07-09
    • H01L21/00H01L21/677G01B11/06B24B49/08G01N21/86G01R31/00
    • H01L21/67173H01L21/67103H01L21/67178H01L21/6719H01L21/67219H01L21/6723H01L21/67751
    • A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing transport units, a metrology unit (228), and a control unit (270) coupled to the metrology unit and at least one of the processing or transport unites. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The processing unit can include, a seed layer disposition unit, a process layer electrochemical disposition unit, a seed layer enhancement layer(232), a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing unit.
    • 一种用计量学处理微电子工件的方法和装置。 该装置可以包括一个或多个处理传送单元,测量单元(228)和耦合到测量单元和处理或传输单元中的至少一个的控制单元(270)。 控制单元可以基于来自计量单元的前馈信号或反馈信号来修改处理单元的处理配方或处理顺序。 处理单元可以包括种子层配置单元,处理层电化学配置单元,种子层增强层(232),化学机械抛光单元和/或退火室,用于对工件进行顺序处理。 处理单元可以作为使用一个或多个计量单元的集成系统来控制,或者单独的计量单元可以向处理单元提供输入。