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    • 102. 发明申请
    • PROCESS FOR PRODUCING CIRCUIT BOARD
    • 生产电路板的工艺
    • US20100044078A1
    • 2010-02-25
    • US12551802
    • 2009-09-01
    • Hirohisa NarahashiShigeo NakamuraTadahiko Yokota
    • Hirohisa NarahashiShigeo NakamuraTadahiko Yokota
    • H05K1/00B32B37/00B32B33/00
    • H05K3/025B32B37/025B32B38/10B32B2038/0076B32B2311/00B32B2457/08H05K3/386H05K2201/0358H05K2203/0264H05K2203/0769H05K2203/0786Y10T428/14Y10T428/1438Y10T428/1443Y10T428/1476Y10T428/26Y10T428/263Y10T428/264Y10T428/265Y10T428/266Y10T428/269
    • Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity. By this method, a metal film layer having high adhesiveness and high property uniformity can be formed on the surface without the need for roughening the surface of an insulating layer with an oxidant such as alkaline potassium permanganate solution and the like. Thus, etching for circuit formation can be performed under milder conditions, which in turn provides a superior effect on micro wiring on circuit boards such as multi-layer printed wiring boards, flexible printed wiring boards, and the like.
    • 通过在基板上层叠具有金属膜的粘合膜来制造电路板,所述金属膜包括依次形成在支撑体上的水溶性聚合物剥离层,金属膜层和固化性树脂组合物层 并且具有能够使固化性树脂组合物层固化后使所述水溶性高分子脱离层从支撑层脱离的脱模性,使得固化性树脂组合物层与基材接触; 固化树脂组合物层; 通过将剥离层溶解在水溶液中,分离保护层,除去存在于金属膜层上的水溶性聚合物释放层,有效地形成绝缘层和与绝缘层的粘合性优异的金属膜层,均匀性 。 通过这种方法,可以在表面上形成具有高粘合性和高性能均匀性的金属膜层,而不需要用氧化剂如碱式高锰酸钾溶液等来粗糙化绝缘层的表面。 因此,可以在更温和的条件下进行电路形成蚀刻,这又对诸如多层印刷线路板,柔性印刷线路板等的电路板上的微接线提供了优异的效果。
    • 108. 发明授权
    • Belt-type fixing device
    • 皮带式固定装置
    • US07149464B2
    • 2006-12-12
    • US10805250
    • 2004-03-22
    • Satoru YonedaNoboru YonekawaYutaka OtsukaShigeo Nakamura
    • Satoru YonedaNoboru YonekawaYutaka OtsukaShigeo Nakamura
    • G03G15/20
    • G03G15/2064G03G2215/2016G03G2215/2038
    • A belt-type fixing device is provided in which a wide fixing nip having a generally flat pressure distribution with respect to a paper feeding direction can be formed.The belt-type fixing device of the invention has a nip forming member that is fixed inside an endless-sheet-like fixing belt to be heated so as to be incapable of rotating, and a rotatable pressurizing roller that is in pressure contact with the nip forming member with the fixing belt interposed between. Contact part between the fixing belt and the pressurizing roller forms a fixing nip, and a surface of the nip forming member that is opposite to the pressurizing roller is configured as a curved surface extending along an outer circumferential surface of the pressurizing roller so that a pressure distribution in the fixing nip is made generally flat with respect to the paper feeding direction.
    • 提供了一种带式定影装置,其中可以形成具有相对于送纸方向的大致平坦的压力分布的宽的定影辊隙。 本发明的带式固定装置具有夹持形成构件,其被固定在被加热以便不能旋转的环形片状定影带内,以及与辊隙压力接触的可旋转加压辊 形成构件,其间具有定影带。 定影带与加压辊之间的接触部分形成定影辊隙,并且与加压辊相对的辊隙形成部件的表面被构造为沿着加压辊的外周面延伸的弯曲表面, 定影辊隙中的分布通常相对于送纸方向平坦。