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    • 105. 发明申请
    • IN-MOLD TRANSFER FILM
    • 模内转印膜
    • US20140242336A1
    • 2014-08-28
    • US14238566
    • 2012-08-27
    • Yasuhito MuneHiroshi IwasakiTakeshi Sugie
    • Yasuhito MuneHiroshi IwasakiTakeshi Sugie
    • B41M5/025B29C69/00
    • B41M5/025B29C69/007B32B3/30B32B27/36B44C1/17Y10T428/24364
    • The present invention provides an in-mold transfer film that has an excellent gloss feel, is free from occurrence of blocking in a process for production of the transfer sheet, and has such a function that the film can be smoothly released from its boundary after completion of the in-mold transfer process. The in-mold transfer film of the present invention comprises a polyester film and a release layer formed on one surface of the polyester film, in which the polyester film is in the form of a laminated polyester film comprising at least three layers whose outermost layers both are formed of the same polyester composition, a number of projections present on a surface of the polyester film which have a height of not less than 0.05 μm is not more than 1900/mm2, and a number of projections present on a surface of the polyester film which have a height of not less than 0.6 μm is not less than 25/mm2.
    • 本发明提供了一种具有优良光泽感的模内转印膜,在转印片生产过程中不会发生堵塞,并且具有能够在完成之后从其边界平滑地释放膜的功能 的模内转移过程。 本发明的模内转印膜包括聚酯膜和形成在聚酯膜的一个表面上的剥离层,其中聚酯膜是层压聚酯膜的形式,其包含至少三层,其最外层均为 由相同的聚酯组合物形成,存在于聚酯膜的表面上的高度不小于0.05μm的多个突起不大于1900 / mm 2,存在于聚酯表面上的多个突起 高度不小于0.6μm的膜不小于25 / mm2。
    • 107. 发明授权
    • Semiconductor storage device and method of manufacturing same
    • 半导体存储装置及其制造方法
    • US07907451B2
    • 2011-03-15
    • US12665320
    • 2008-12-08
    • Hiroshi Iwasaki
    • Hiroshi Iwasaki
    • G11C11/34
    • H01L21/28273G11C16/0408H01L27/11517H01L29/42324H01L29/42328H01L29/66825H01L29/7881
    • The disclosure of this application enhances the data writing speed of an electrically erasable and writable semiconductor memory. In a semiconductor storage device of this application, at a time of writing data, when a positive voltage lower than a voltage at control gate 30 is applied to potential control gate 28 formed inside tunnel oxide film 360 between p channel 22 of a transistor and floating gate 32, a potential barrier between p channel 22 of the transistor and floating gate 32 is lowered, and a time required for storing an electron in floating gate 30 is reduced. After data is stored, when 0 V or a negative voltage is applied to the potential control gate, a potential barrier for an electron moving from the floating gate to the channel of the transistor increases, thereby preventing erasure of data.
    • 本申请的公开内容增强了电可擦除和可写入的半导体存储器的数据写入速度。 在本申请的半导体存储装置中,在写入数据时,当将低于控制栅极30处的电压的正电压施加到形成在晶体管的p沟道22之间的隧道氧化物膜360内的电位控制栅极28,并且浮置 栅极32,晶体管的p沟道22和浮置栅极32之间的势垒降低,并且在浮动栅极30中存储电子所需的时间减小。 在存储数据之后,当向电位控制栅极施加0V或负电压时,从浮置栅极向晶体管的沟道移动的电子的势垒增加,从而防止数据的擦除。
    • 109. 发明授权
    • Card adapter for use with a storage apparatus
    • 用于存储设备的卡适配器
    • US07768111B2
    • 2010-08-03
    • US12007002
    • 2008-01-04
    • Hiroshi Iwasaki
    • Hiroshi Iwasaki
    • B42D15/02G06K19/00H01L29/41H01L23/495H05K7/10
    • G06K19/07739G06K19/07743H01L23/3121H01L23/49855H01L24/48H01L2224/05599H01L2224/48091H01L2224/48227H01L2224/4847H01L2224/48472H01L2224/73265H01L2224/85399H01L2924/00014H01L2924/01079H01L2924/15153H01L2924/15165H01L2924/181H01L2924/00H01L2924/00012H01L2224/45015H01L2924/207H01L2224/45099
    • A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 disposed on the second surface of the wiring substrate 11 and having a connection terminal 14a connected to the flat type external connection terminal 12a, a molding resin 15 for coating the semiconductor device 14 on the second surface of the wiring substrate 11, a card type supporting frame 10a having a concave portion or a hole portion fitting the wiring substrate 11, the semiconductor device 14, and the molding resin 15 in such a manner that the flat type external connection terminal 12a is exposed to the first surface of the wiring substrate 11, and adhesive resin a adhering integrally the flat type external connection terminal 12a, the wiring substrate 11, the semiconductor device 14, the molding resin 15, and the card type supporting frame 10a. In addition, the storage apparatus 10 can be combined with a card type supporting means 21 that supports detachably with the flat type external connection terminal 12a exposed to one of the surfaces so as to be used as a card type storage apparatus 20 having bigger size.
    • 公开了一种存储装置10,其包括具有第一表面和第二表面的布线基板11,布置在布线基板11的第一表面上的平面型外部连接端子12a,设置在布线基板11的第二表面上的半导体装置14 布线基板11并具有连接到扁平型外部连接端子12a的连接端子14a,用于在布线基板11的第二表面上涂覆半导体器件14的模制树脂15,具有凹部的卡式支撑框架10a 或配线基板11,半导体装置14以及模塑树脂15的孔部,使平面型外部连接端子12a暴露于布线基板11的第一面,粘合树脂a一体地粘接 扁平型外部连接端子12a,布线基板11,半导体装置14,成型树脂15,以及支持f型卡 ame ame ame ame 此外,存储装置10可以与能够与暴露于一个表面的平面型外部连接端子12a可拆卸地支撑的卡式支撑装置21组合,以用作具有较大尺寸的卡式存储装置20。
    • 110. 发明授权
    • Accessible electronic storage apparatus for use with support frame
    • 用于支撑框架的无障碍电子存储装置
    • US07659607B2
    • 2010-02-09
    • US12007001
    • 2008-01-04
    • Hiroshi Iwasaki
    • Hiroshi Iwasaki
    • H01L29/41H01L23/495B42D15/02G06K19/00
    • G06K19/07739G06K19/07743H01L23/3121H01L23/49855H01L24/48H01L2224/05599H01L2224/48091H01L2224/48227H01L2224/4847H01L2224/48472H01L2224/73265H01L2224/85399H01L2924/00014H01L2924/01079H01L2924/15153H01L2924/15165H01L2924/181H01L2924/00H01L2924/00012H01L2224/45015H01L2924/207H01L2224/45099
    • A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 disposed on the second surface of the wiring substrate 11 and having a connection terminal 14a connected to the flat type external connection terminal 12a, a molding resin 15 for coating the semiconductor device 14 on the second surface of the wiring substrate 11, a card type supporting frame 10a having a concave portion or a hole portion fitting the wiring substrate 11, the semiconductor device 14, and the molding resin 15 in such a manner that the flat type external connection terminal 12a is exposed to the first surface of the wiring substrate 11, and adhesive resin a adhering integrally the flat type external connection terminal 12a, the wiring substrate 11, the semiconductor device 14, the molding resin 15, and the card type supporting frame 10a. In addition, the storage apparatus 10 can be combined with a card type supporting means 21 that supports detachably with the flat type external connection terminal 12a exposed to one of the surfaces so as to be used as a card type storage apparatus 20 having bigger size.
    • 公开了一种存储装置10,其包括具有第一表面和第二表面的布线基板11,布置在布线基板11的第一表面上的平面型外部连接端子12a,设置在布线基板11的第二表面上的半导体装置14 布线基板11并具有连接到扁平型外部连接端子12a的连接端子14a,用于在布线基板11的第二表面上涂覆半导体器件14的模制树脂15,具有凹部的卡式支撑框架10a 或配线基板11,半导体装置14以及模塑树脂15的孔部,使平面型外部连接端子12a暴露于布线基板11的第一面,粘合树脂a一体地粘接 扁平型外部连接端子12a,布线基板11,半导体装置14,成型树脂15,以及支持f型卡 ame ame ame ame 此外,存储装置10可以与能够与暴露于其中一个表面的平面型外部连接端子12a可拆卸地支撑的卡式支撑装置21组合,以用作具有较大尺寸的卡式存储装置20。