会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 104. 发明授权
    • Transmission device and redundant configuration between transmission device and layer 2 switch
    • 传输设备和传输设备与第2层交换机之间的冗余配置
    • US07724653B2
    • 2010-05-25
    • US11905376
    • 2007-09-28
    • Youichi KonumaKoichi SaikiJunichi ShimadaAkira Miyasaka
    • Youichi KonumaKoichi SaikiJunichi ShimadaAkira Miyasaka
    • H04J1/16
    • H04L49/351H04L49/552H04L69/14H04L69/40Y02D50/30
    • A transmission device is connected to a layer 2 switch through a transmission path at one side, and to a relay transmission path at the other side. The transmission path includes a transmission path of a active system and a transmission path of a stand-by system. When failure occurs in the transmission path of the active system, the transmission device forcibly shuts down the transmission path of the active system upon detection of link down, to stop packet transmission, and causes the layer 2 switch to perform MAC address flush. The transmission device then switches the transmission path of the stand-by system to the active system, and transmits packets through the transmission path that has become the active system as a result of switching. The layer 2 switch performs MAC address learning to set a port, thereby maintaining communication even after occurrence of the failure.
    • 传输设备通过一侧的传输路径和另一侧的中继传输路径连接到层2交换机。 传输路径包括有源系统的传输路径和备用系统的传输路径。 当主动系统的传输路径发生故障时,传输设备在检测到链路断开后强制关闭主用系统的传输路径,停止数据包传输,使第二层交换机执行MAC地址冲洗。 然后,发送装置将待机系统的传输路径切换到主动系统,并且作为切换的结果,通过已经成为主动系统的传输路径发送分组。 层2交换机执行MAC地址学习来设置端口,从而即使在发生故障后仍保持通信。
    • 110. 发明申请
    • LED ILLUMINATION SYSTEM
    • LED照明系统
    • US20050276052A1
    • 2005-12-15
    • US10539079
    • 2003-12-15
    • Junichi ShimadaYoichi Kawakami
    • Junichi ShimadaYoichi Kawakami
    • F21V29/00F21S2/00F21S8/04F21V7/20F21Y101/02H01L25/075H01L33/48H01L33/60H01L33/64H01R13/533
    • F21V23/06F21K9/20F21V29/505F21Y2115/10H01L25/0753H01L33/641H01L2924/0002H01L2924/00
    • The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 12 made of diamond is provided on a substrate 11, and on top of this, a conductive layer 13 having a predetermined pattern is formed. LED chips 16 are mounted in predetermined positions on the conductive layer 13. Terminals of the conductive layer 13 and electrodes of the LED chips 16 are connected to each other. A connector part 14 for the connection to a socket is provided in an end portion of the substrate 11. The heat conducting layer 12 on the connector part 14 makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips 16 through the conductive layer 13 from the socket, and respective LED chips 16 emit light. Heat that is generated in the LED chips 16 is released to the outside of the illumination system from the socket through the conductive layer 13, the heat conducting layer 12 and the connector part 14. As a result of this, an increase in the temperature of the LED chips 16 can be prevented, and an LED illumination system that emits a large amount of light can be formed.
    • 本发明的目的是提供一种由LED发光体和能够适当地从LED芯片释放热量的插座形成的照明系统。 该目的以如下方式实现。 在基板11上设置由金刚石制成的导热层12,并且在其上形成具有预定图案的导电层13。 LED芯片16安装在导电层13上的预定位置。导电层13的端子和LED芯片16的电极彼此连接。 用于连接到插座的连接器部分14设置在基板11的端部。连接器部分14上的导热层12与设置在插座的开口的内表面上的导热层热接触 。 从插座通过导电层13向相应的LED芯片16提供电流,并且各个LED芯片16发光。 在LED芯片16中产生的热量通过导电层13,导热层12和连接器部分14从插座释放到照明系统的外部。其结果是, 可以防止LED芯片16,并且可以形成发射大量光的LED照明系统。