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    • 101. 发明申请
    • Planarization films for advanced microelectronic applications and devices and methods of production thereof
    • 用于先进微电子应用的平面化膜及其制造方法
    • US20060106160A1
    • 2006-05-18
    • US10518201
    • 2003-10-27
    • Wei HuangJoseph KennedyRonald Katsanes
    • Wei HuangJoseph KennedyRonald Katsanes
    • C04B26/12
    • H01L21/02118C04B26/12C04B2111/00482C08J7/02C08J2361/00C23F1/10C23F1/44C23F3/00C23F3/04H01L21/31051H01L21/312Y10T428/31942C04B2103/0093C04B2103/40
    • A planarization composition is disclosed herein that comprises: a) a structural constituent; and b) a solvent system, wherein the solvent system is compatible with the structural constituent and lowers the lowers at least one of the intermolecular forces or surface forces components of the planarization composition. A film that includes this planarization composition is also disclosed. In addition, another planarization composition is disclosed herein that comprises: a) a cresol-based polymer compound; and b) a solvent system comprising at least one alcohol and at least one ether acetate-based solvent. A film that includes this planarization composition is also disclosed. A layered component is also disclosed herein that comprises: a) a substrate having a surface topography; and b) a planarization composition or a film such as those described herein, wherein the composition is coupled to the substrate. Methods of forming a planarization compositions are also disclosed herein that comprise: a) providing a structural constituent; b) providing a solvent system, wherein the solvent system is compatible with the structural constituent and lowers at least one of the intermolecular forces or surface forces components of the planarization composition; and c) blending the structural constituent and the solvent system to form a planarization composition. Methods of forming a film are also disclosed that comprise: a) providing a planarization composition such as those disclosed herein; and b) evaporating at least part of the solvent system to form a film.
    • 本文公开了一种平面化组合物,其包括:a)结构成分; 和b)溶剂体系,其中所述溶剂体系与所述结构组分相容并降低所述平坦化组合物的至少一种分子间力或表面力组分。 还公开了包含该平坦化组合物的膜。 此外,本文公开了另外的平坦化组合物,其包括:a)甲酚基聚合物化合物; 和b)包含至少一种醇和至少一种乙酸乙烯酯类溶剂的溶剂体系。 还公开了包含该平坦化组合物的膜。 本文还公开了一种分层组件,其包括:a)具有表面形貌的衬底; 和b)平面化组合物或诸如本文所述的那些的膜,其中所述组合物与所述基材偶联。 本文还公开了形成平坦化组合物的方法,其包括:a)提供结构成分; b)提供溶剂系统,其中所述溶剂体系与所述结构组分相容并降低所述平坦化组合物的分子间力或表面力组分中的至少一种; 和c)混合结构成分和溶剂体系以形成平坦化组合物。 还公开了形成膜的方法,其包括:a)提供诸如本文公开的那些的平坦化组合物; 和b)蒸发至少部分溶剂系统以形成膜。
    • 104. 发明申请
    • Layered components, materials, methods of production and uses thereof
    • 分层的部件,材料,生产方法及其用途
    • US20050238889A1
    • 2005-10-27
    • US10875050
    • 2004-06-22
    • Nancy IwamotoJoseph KennedyEal Lee
    • Nancy IwamotoJoseph KennedyEal Lee
    • B32B3/26B32B9/04C07C13/28H01L21/31H01L21/316H01L21/768H05K1/03H05K1/16H05K3/00
    • H01L21/02203H01L21/02118H01L21/02126H01L21/02205H01L21/0228H01L21/02362H01L21/31695H01L21/7682H01L21/76841H01L2221/1047H05K1/036H05K1/162H05K3/0011H05K2201/0116H05K2203/1147Y10T428/249953Y10T428/31663
    • A layered component is described herein that includes: a substrate; a dielectric material having a plurality of pores, wherein the material is coupled to the substrate; and a self-assembled diffusion blocking material coupled to the dielectric material, wherein the diffusion blocking material is attracted to the dielectric material. A layered component is also described herein that includes: a substrate; a dielectric material having a plurality of pores, wherein the material is coupled to the substrate; and a self-assembled diffusion blocking material coupled to the dielectric material, wherein the diffusion blocking material reacts with the dielectric material. A layered material is described that includes: a) a porous material comprising a porous surface; and b) a layer of blocking material comprising reactive functionalities coupled to the porous surface, wherein the interaction of the reactive functionalities with the porous material forms a diffusion blocking layer. Methods are also described of minimizing the diffusion of metal atoms, reactive etchants or CVD/ALD precursor materials into a material having a plurality of pores are disclosed herein that include: a) providing a precursor material that comprises a carbon-including material; b) providing a solvent carrier solution; c) combining the precursor material and the solvent carrier solution to form a diffusion blocking reactive solution; and d) applying the diffusion blocking reactive solution to the material having a plurality of pores to form a diffusion blocking material.
    • 本文描述了一种分层组件,其包括:基底; 具有多个孔的介电材料,其中所述材料耦合到所述基底; 以及耦合到电介质材料的自组装扩散阻挡材料,其中扩散阻挡材料被吸引到电介质材料。 本文还描述了分层组件,其包括:基底; 具有多个孔的介电材料,其中所述材料耦合到所述基底; 以及耦合到所述介电材料的自组装扩散阻挡材料,其中所述扩散阻挡材料与所述电介质材料反应。 描述了层状材料,其包括:a)包含多孔表面的多孔材料; 和b)包含耦合到多孔表面的反应性官能团的阻挡材料层,其中反应性官能团与多孔材料的相互作用形成扩散阻挡层。 还描述了使金属原子,反应性蚀刻剂或CVD / ALD前体材料扩散到具有多个孔的材料中的扩散的方法,其包括:a)提供包含含碳材料的前体材料; b)提供溶剂载体溶液; c)将前体材料和溶剂载体溶液组合以形成扩散阻断反应溶液; 以及d)将扩散阻挡反应性溶液施加到具有多个孔的材料上以形成扩散阻挡材料。
    • 105. 发明申请
    • Tag-based commands for controlling a set of receivers
    • 用于控制一组接收器的基于标签的命令
    • US20050100018A1
    • 2005-05-12
    • US10702703
    • 2003-11-06
    • Joseph KennedyDavid Placek
    • Joseph KennedyDavid Placek
    • H04L12/18H04L12/24H04L12/56
    • H04L12/18
    • This invention is a system and method for controlling a set of receivers in a distributed network. The system uses a tag-based syntax that defines the devices in the receivers and the corresponding commands for the respective devices. The tag is a combination of device and command constructs which is unique to each one of the receiver's parameters. The parameters can be logically grouped in a command stream using the device values. Members in the group are represented by the command values. The standardized syntax allows multiple parameters to be controlled with a single autonomous variable length command and also allows the receivers to operate on the command stream with a standardized set of parser routines.
    • 本发明是用于控制分布式网络中的一组接收机的系统和方法。 系统使用基于标签的语法来定义接收器中的设备和相应设备的相应命令。 标签是设备和命令结构的组合,对于接收机的每个参数都是唯一的。 参数可以使用设备值在逻辑上分组在命令流中。 组中的成员由命令值表示。 标准化语法允许使用单个自主变长命令来控制多个参数,并且还允许接收器使用标准化的解析器例程集合对命令流进行操作。