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101. 发明授权

US07193299B2 Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components 有权
标题翻译：用于辐射发射部件的导体框架和壳体，辐射发射部件以及使用辐射发射部件的显示和/或照明系统
公开(公告)号：US07193299B2
公开(公告)日：2007-03-20
申请号：US10487576
申请日：2002-08-02
申请人： Karlheinz Arndt , Georg Bogner , Gunter Waitl
发明人： Karlheinz Arndt , Georg Bogner , Gunter Waitl
IPC分类号： H01L23/495 , H01L31/0203
CPC分类号： H01L33/62 , H01L33/483 , H01L33/60 , H01L2924/0002 , H01L2924/12041 , H01L2924/00
摘要： A leadframe for a surface-mountable radiation-emitting component, preferably a light-emitting diode component, having at least one chip connection region and at least one external connection strip. The leadframe is formed in planar fashion and a deformation element, preferably a spring element, is arranged between the chip connection region and the external connection strip. The deformation element enables an elastic or plastic deformation of the leadframe in the plane of the leadframe. A housing, a surface-mountable component and an arrangement having a plurality of such components are furthermore specified.
摘要翻译：用于可表面安装的辐射发射部件的引线框架，优选地是具有至少一个芯片连接区域和至少一个外部连接条的发光二极管部件。引线框架以平面方式形成，并且在芯片连接区域和外部连接带之间布置有变形元件，优选弹簧元件。变形元件使得引线框架在引线框平面中的弹性或塑性变形。进一步规定了外壳，表面安装部件和具有多个这种部件的布置。

102. 发明申请

US20060049477A1 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US20060049477A1
公开(公告)日：2006-03-09
申请号：US10535794
申请日：2003-11-27
申请人： Karlheinz Arndt , Georg Bogner , Gunter Waitl , Matthias Winter
发明人： Karlheinz Arndt , Georg Bogner , Gunter Waitl , Matthias Winter
IPC分类号： H01L31/0203
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.
摘要翻译：本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44）向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。本发明还涉及包括所述部件的装置。组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。

103. 发明授权

US06848819B1 Light-emitting diode arrangement 有权
标题翻译：发光二极管布置
公开(公告)号：US06848819B1
公开(公告)日：2005-02-01
申请号：US10009656
申请日：2000-05-12
申请人： KarlHeinz Arndt , Guenter Waitl , Georg Bogner
发明人： KarlHeinz Arndt , Guenter Waitl , Georg Bogner
IPC分类号： F21V19/00 , F21S8/00 , F21S8/04 , F21S8/10 , F21V29/00 , F21V29/74 , F21V31/03 , F21W101/12 , F21W101/14 , F21Y115/10 , G09F13/22 , G09F21/04 , H01L33/64 , H05K3/00 , F21V21/00
CPC分类号： F21V29/004 , F21S10/06 , F21S43/14 , F21S45/47 , F21V29/74 , F21W2111/00 , F21Y2115/10 , G09F13/22 , G09F21/04 , H01L33/64 , H01L2924/0002 , H05K3/0061 , H05K2201/10106 , Y10S362/80 , H01L2924/00
摘要： An LED array surface-mounted on a circuit board and applied to a cooling member, such that any generated heat is optimally eliminated. The cooling member can be in any desired shape so that motor vehicle lights, such as blinkers, can be adapted to the outside contour of the vehicle. For a rotating light, the circuit board can be applied around a cooling member fashioned as a hollow cylindrical member which is adapted to rotate.
摘要翻译：一种LED阵列，其表面安装在电路板上并被施加到冷却构件上，使得任何产生的热量被最佳地消除。冷却构件可以是任何期望的形状，使得诸如指示灯的机动车辆灯可以适应车辆的外部轮廓。对于旋转的光，电路板可以围绕适于旋转的中空圆柱形构件的冷却构件施加。

104. 发明授权

US06538229B1 Method for the positionally accurate adjustment and fixing of a microoptical element 失效
标题翻译：用于微光学元件的位置精确调整和固定的方法
公开(公告)号：US06538229B1
公开(公告)日：2003-03-25
申请号：US09562260
申请日：2000-05-02
申请人： Georg Bogner , Hans-Ludwig Althaus
发明人： Georg Bogner , Hans-Ludwig Althaus
IPC分类号： H01L2160
CPC分类号： B23K26/04 , B23K1/0056 , B23K2101/40 , H05K13/0465
摘要： The inventor relates to method for the posibility accurate adjustment and fixing of a microoptical element on a carrier. In this case, an optical position monitor with a camera monitors the accurate adjustment of the microchip and an imaging optical system directed onto the microoptical and element. According to the invention, thermal radiation is fed into the position monitor and directed by the same imaging optical system onto the microchip, and in this way the thermal energy is guided to exactly the correct point.
摘要翻译：本发明人涉及一种用于将微光学元件精确调整和固定在载体上的方法。在这种情况下，具有相机的光学位置监视器监视微芯片的精确调整和指向微光学元件的成像光学系统。根据本发明，热辐射被馈送到位置监视器并由相同的成像光学系统引导到微芯片上，并且以这种方式将热能引导到正确的点。

105. 发明授权

US06353202B1 Apparatus and method for producing a chip-substrate connection 失效
标题翻译：用于制造芯片 - 基板连接的装置和方法
公开(公告)号：US06353202B1
公开(公告)日：2002-03-05
申请号：US09491117
申请日：2000-01-24
申请人： Stefan Grötsch , Hans-Ludwig Althaus , Werner Späth , Georg Bogner
发明人： Stefan Grötsch , Hans-Ludwig Althaus , Werner Späth , Georg Bogner
IPC分类号： B23K2620
CPC分类号： H01L24/75 , H01L24/83 , H01L2224/83224 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3436 , H05K3/3494 , H01L2924/3512 , H01L2924/00
摘要： An apparatus for producing a chip-substrate connection, in particular by soldering a semiconductor chip on a substrate. The apparatus has a support, on which the substrate is temporarily supported, and a heating device which is provided for forming the chip-substrate connection. The heating device has a radiation source in the form of a laser in the infrared wavelength range. The support is formed by a heat body, which is assigned to the chip-substrate connection and is heated with thermal radiation by the radiation source. A surface of the heat body is coated with a material, in particular a material containing chromium, exhibiting high absorption with respect to the light radiation emitted by the radiation source.
摘要翻译：一种用于制造芯片 - 基板连接的装置，特别是通过将半导体芯片焊接在基板上。该装置具有支撑件，临时支撑基板，并且提供用于形成芯片 - 基板连接的加热装置。加热装置具有红外波长范围内的激光形式的辐射源。该支撑件由热体形成，其被分配到芯片 - 基板连接并且被辐射源的热辐射加热。加热体的表面涂覆有相对于由辐射源发射的光辐射具有高吸收性的材料，特别是含有铬的材料。

106. 发明授权

US6059463A Electro-optical device 有权
标题翻译：电光装置
公开(公告)号：US6059463A
公开(公告)日：2000-05-09
申请号：US161556
申请日：1998-09-25
申请人： Hans-Ludwig Althaus , Georg Bogner , Joachim Krug
发明人： Hans-Ludwig Althaus , Georg Bogner , Joachim Krug
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4292
摘要： The electro-optical device has a housing and an electro-optical composite component. The composite component has an electro-optical basic component, in particular a photodiode, a laser diode, or an LED, into which light can be injected and/or from which light can be emitted. In order to be able to manufacture the housing for the electro-optical basic component in the most cost-effective way possible, there is provided a guide sleeve for the electro-optical composite component. The guide sleeve is connected to the basic component and it guides a plug with a ferrule of an optical waveguide. When the ferrule is plugged into the guide sleeve, the optical waveguide is optically coupled to the basic component.
摘要翻译：电光装置具有壳体和电光复合部件。该复合部件具有电光基本部件，特别是光电二极管或激光二极管或LED，可以将光注入和/或从其发射光。为了能够以最具成本效益的方式制造用于电光基础部件的壳体，为电光复合部件提供导向套筒。引导套筒连接到基本部件上，并用光波导套管引导插头。当套管插入引导套筒中时，光波导光学耦合到基本部件。

107. 发明授权

US5981945A Optoelectronic transducer formed of a semiconductor component and a lens system 失效
标题翻译：由半导体元件和透镜系统形成的光电换能器
公开(公告)号：US5981945A
公开(公告)日：1999-11-09
申请号：US614836
申请日：1996-03-08
申请人： Werner Spaeth , Wolfgang Gramann , Georg Bogner , Ralf Dietrich
发明人： Werner Spaeth , Wolfgang Gramann , Georg Bogner , Ralf Dietrich
IPC分类号： G02B6/42 , H01L31/0203 , H01L31/0232 , H01L33/58 , H01J5/02
CPC分类号： H01L33/58 , G02B6/4204 , H01L31/0203 , H01L31/0232 , H01L2224/32225
摘要： An optoelectronic transducer includes a base plate, a radiation-emitting or transmitting semiconductor component disposed on the base plate, an optical lens system aimed at the semiconductor component and a spacer joined to the base plate for the lens system. The base plate, the spacer and the lens system are formed of materials with at least similar coefficients of thermal expansion. A method for producing an optoelectronic transducer includes forming indentations in a base plate for receiving semiconductor components, while leaving a land remaining on at least one side of each of the indentations. A first plate of the size of the base plate is placed on the lands and joined to the lands by material locking. The first plate is removed between the lands producing spacers joined to the base plate. A number of the semiconductor components are inserted into the indentations in accordance with a predetermined grid pattern and are joined to the base plate to form substrates. The substrates are covered with a second plate including a number of lens systems correspopnding to number of semiconductor components, while placing the lens systems of the second plate in the same grid pattern. The second plate is adjusted relative to the substrates for aiming each of the lens systems at a respective one of the semiconductor components. The second plate is secured to the substrates.
摘要翻译：光电转换器包括基板，设置在基板上的辐射发射或透射半导体部件，瞄准半导体部件的光学透镜系统和连接到透镜系统的基板的间隔件。基板，间隔件和透镜系统由具有至少相似的热膨胀系数的材料形成。一种光电子换能器的制造方法包括：在基板中形成用于接收半导体部件的凹陷部，同时留下残留在每个压痕的至少一侧上的焊盘。基板的尺寸的第一板被放置在平台上，并通过材料锁定而接合到平台上。第一板在连接到基板的间隔件之间移除。根据预定的格栅图案将多个半导体部件插入到凹陷中，并且与基板接合以形成基板。在将第二板的透镜系统放置在相同的格栅图案中的同时，用包括多个半导体部件的多个透镜系统的第二板覆盖基板。相对于基板调整第二板，以将每个透镜系统瞄准相应的一个半导体部件。第二板固定在基板上。

108. 发明授权

US5907151A Surface mountable optoelectronic transducer and method for its production 失效
标题翻译：表面贴装光电转换器及其生产方法
公开(公告)号：US5907151A
公开(公告)日：1999-05-25
申请号：US863357
申请日：1997-05-27
申请人： Wolfgang Gramann , Georg Bogner , Ralf Dietrich , Martin Weigert
发明人： Wolfgang Gramann , Georg Bogner , Ralf Dietrich , Martin Weigert
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L33/48 , H01L33/58 , H01J40/14
CPC分类号： H01L33/486 , H01L31/0203 , H01L31/0232 , H01L33/58 , H01L2224/73265 , H01L2924/01322 , H01L33/0095
摘要： An optoelectronic transducer has a radiation-emitting and/or radiation-receiving body on a carrier unit. The carrier unit has a mounting surface provided with a number of terminal parts. The terminal parts are provided with electrical terminal areas defining a contacting plane. The distance of the contacting plane from the mounting surface is greater than a maximum height of the body from the mounting surface, including all optional electrical conductors and covers.
摘要翻译：光电转换器在载体单元上具有辐射发射和/或辐射接收体。承载单元具有设置有多个端子部的安装面。端子部分设置有限定接触平面的电端子区域。接触平面与安装表面的距离大于主体与安装表面的最大高度，包括所有可选的电导体和盖。

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