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101. 发明专利

JP2000068637A SOLDERING OF ELECTRONIC COMPONENT 失效
公开(公告)号：JP2000068637A
公开(公告)日：2000-03-03
申请号：JP23725498
申请日：1998-08-24
申请人： DENSO CORP
发明人： IMAIZUMI NORIHISA , TANAHASHI AKIRA
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To prevent voids from being generated to the utmost in the soldered part of an electronic component in the case where the component is mounted on a board by reflow soldering. SOLUTION: This soldering method is executed as follow: a solder paste 8 is fed to a board 1 and thereafter, both sides of a power transistor 5 are supported by solder chips 9 and 10, which are mounted on the paste 8, have different melting points, have a melting point higher than that of the solder in the paste 8 and have a height higher than the thickness of the paste 8, and a reflow heating is performed in this state to heat the paste 8 and the chips 9 and 10. Whereupon, first, the paste 8 is molten and vapor, which is generated at the time of this melting, escapes out from the space, which is ensured by the chips 9 and 10 between the transistor 5 and the paste 8, to the outside. Then, the chip 9 on one side on the side of the low melting point of the chips 9 and 10 is molten, then, the other chip 10 is molten. As a result, the transistor 5 is slanted so that it comes into contact with the molten solder surface in its slanted state, air is eliminated and it is eliminated that the air is left as voids in the soldered part of the transistor 5.

102. 发明专利

JP2001257437A ELECTRONIC CIRCUIT BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001257437A
公开(公告)日：2001-09-21
申请号：JP2000067407
申请日：2000-03-10
申请人： DENSO CORP
发明人： IMAIZUMI NORIHISA
IPC分类号： H05K7/20 , H01L23/36 , H01L23/40 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To improve the mounting density on a component mounted surface of an electronic circuit board which has a heat sink adhered to the opposite side from the component mounted surface. SOLUTION: A ceramic substrate 2 has electronic components such as a ceramic capacitor 11, an IC 13, and a power IC 14 mounted on its top surface and the heat sink 4 adhered to its reverse surface. The heat sink 4 has suction holes 4a to 4e (passages for suction) in the surface adhered to the ceramic substrate 2. Here, the heat sink 4 is adhered by arranging the ceramic substrate 2 and heat sink opposite each other after applying adhesives 3 which are not hardened to the adhesion surfaces of the both, and then sucking the ceramic substrate 2 to the heat sink 4 through the suction holes 4a to 4e.

103. 发明专利

JP2001044593A MOUNTING STRUCTURE OF CIRCUIT COMPONENT 失效
公开(公告)号：JP2001044593A
公开(公告)日：2001-02-16
申请号：JP21273299
申请日：1999-07-27
申请人： DENSO CORP
发明人： IMAIZUMI NORIHISA , OTANI YUJI , NAGASAKA TAKASHI , TANAHASHI AKIRA
IPC分类号： H05K1/18
摘要： PROBLEM TO BE SOLVED: To realize a mounting structure for circuit components for surface mounting, which are electrically connected to a circuit board with a gap from the surface of the board, in such a way that the circuit board can be cleaned with reliability without increasing cost. SOLUTION: A board electrode part 2 of copper think-film conductor is printed on a circuit board 1 in which a notch 5 is formed, in such a way that its surface is in a concave shape. Solder 6 is provided in accordance with the shape of the board electrode part 2 and a circuit component 1 is mounted on the solder 6, in such a way that a hole 8 connecting between the gap between the circuit board 3 and the circuit component 1 and the exterior through the notch 5 is formed. In this way, at the cleaning of the circuit board 3, since detergent can be made to enter and leave through the hole 8 formed by the notch 5 also, the board 3 can be cleaned surely.

104. 发明专利

JP2000061689A SOLDER PASTE, SOLDERING METHOD, AND SURFACE-MOUNTING TYPE ELECTRONIC DEVICE 失效
公开(公告)号：JP2000061689A
公开(公告)日：2000-02-29
申请号：JP24186398
申请日：1998-08-27
申请人： DENSO CORP , TAMURA KAKEN CO LTD , TOYOTA CENTRAL RES & DEV
发明人： TANAHASHI AKIRA , IMAIZUMI NORIHISA , SHIBATA SEIJI , SUDO EIICHI
IPC分类号： B23K35/22 , B23K35/02 , B23K35/26 , B23K35/36 , B23K35/363 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To maintain the insulation property and the wettability of a specified level even when an additive to improve the printability is added. SOLUTION: A solder paste is applied to electrodes 2, 3 on an upper surface of a ceramic substrate 1. The solder paste contains a metallic powder, an organic acid, and an alcohol having >=2 OH radicals. Electronic parts 6 to be mounted are arranged on the ceramic substrate 1, and electrodes (bumps) of the electronic parts 6 are brought into contact with the paste. The electronic parts are placed in a reflow furnace to effect the solder reflow in a nitrogen atmosphere. The electrodes 2, 3 and the electronic parts 6 in the wiring pattern are joined with each other with solders 9, 10. Ester films 11, 12, 13, 14 are generated around the electrodes 2, 3 on the ceramic substrate 1, and high insulation reliability is ensured by the ester films 11, 12, 13, 14.

105. 发明专利

JP2003168772A PACKAGE STRUCTURE OF POWER MODULE 审中-公开
公开(公告)号：JP2003168772A
公开(公告)日：2003-06-13
申请号：JP2001367055
申请日：2001-11-30
申请人： DENSO CORP , TOYOTA MOTOR CORP
发明人： IMAIZUMI NORIHISA , HARADA TSUTOMU
IPC分类号： H01L23/40 , H01L23/36
摘要： PROBLEM TO BE SOLVED: To prevent deterioration of heat dissipation in a package structure in which a power module is fixed to a heat sink via a thermally conductive grease. SOLUTION: A power module and a heat sink are provided with fixing holes 15, 16 for fixing them to each other with a fixing member 14. A thermally conductive grease is filled between the power module and the heat sink so that the grease is distant from the fixing holes. Grease diffusion preventing portions 17-20 for preventing the thermally conductive grease from entering the fixing holes are formed at least on one of the opposed surfaces of the power module and the heat sink. The grease diffusion preventing portions 17-20 can be formed as a groove 17 or protrusions 18-20 at least disposed between the thermally conductive grease and the fixing holes. COPYRIGHT: (C)2003,JPO

106. 发明专利

JP2002271068A ELECTRONIC DEVICE 失效
公开(公告)号：JP2002271068A
公开(公告)日：2002-09-20
申请号：JP2001072441
申请日：2001-03-14
申请人： DENSO CORP
发明人： IMAIZUMI NORIHISA
IPC分类号： H05K7/20 , H01L23/34 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide an electronic device having improved heat releasing property. SOLUTION: A heater element 4 or the like is mounted on a surface of a ceramic board 3, and a lead 5 is projected from the ceramic board 3. The lead 5 of the ceramic board 3 is inserted into and electrically connected to a motherboard 1 at a predetermined position so that the normal line direction of the motherboard 1 and that of the ceramic board 3 are positioned generally perpendicular to each other. The motherboard 1 and the ceramic board 3 are housed between an upper case 7 and a lower case 8, and the rear surface of the ceramic board 3 is bonded to a protrusion 7a formed on the upper case 7 with a heat conductive Si adhesive 10. The thickness of this adhesive 10 is 100 μm or less.

107. 发明专利

JPH1197836A STRUCTURE AND METHOD FOR MOUNTING SURFACE-MOUNTED TYPE PART 失效
公开(公告)号：JPH1197836A
公开(公告)日：1999-04-09
申请号：JP25078097
申请日：1997-09-16
申请人： DENSO CORP
发明人： IMAIZUMI NORIHISA
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure and a mounting method of a surface- mounted type part, which can eliminate the defects of mounted parts coming off from the substrate and the like at the time of part mounting, after the arrangement of solder paste in the mounting of SMD(surface-mounting part). SOLUTION: A land 3 is formed at the upper plane (surface) of a substrate 1. A terminal 2 is soldered on the land by solder 4. The terminal 2 is L-shaped and comprises a connecting part and a erect standing part. Many projections 6 are formed at the lower surface of the connecting part. Each projection 6 has a conical shape. When the part is mounted after solder paste is printed on the land 3, the part of the solder paste, which is not dried, is brought into contact with the projections 6, and fixing which will become mechanically strong can be performed.

108. 发明专利

JPH1197826A STRUCTURE AND METHOD FOR MOUNTING SURFACE-MOUNTING COMPONENT 失效
公开(公告)号：JPH1197826A
公开(公告)日：1999-04-09
申请号：JP25674197
申请日：1997-09-22
申请人： DENSO CORP
发明人： IMAIZUMI NORIHISA
IPC分类号： H05K3/34 , H05K1/11 , H05K3/30
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure and a mounting method for a surface- mounting component, which can resolve the nonconformities caused by the solder balls generated in reflowing in a new constitution. SOLUTION: Under a state wherein ceramic capacitors 2 face to each other on a substrate 1, electrodes 7 and 8 of a ceramic capacitor 2 are soldered on capacitor-connecting lands 3 and 4 at the surface of the substrate 1. At the lower side of the ceramic capacitor 2, fusing solder introducing lands 9 and 10 are provided at the substrate 1. The fusing solder introducing lands 9 and 10 have the small-diameter circular part 11 arranged at the inside of a providing region Z1 of the ceramic capacitor 11, a large diameter circular part 12 arranged at the outside of the providing region Z1 and a strip-shaped part 13.

109. 发明专利

JPH0994691A FLUX FOR SOLDERING AND SOLDER PASTE AND SOLDERING METHOD USING THE SAME 失效
公开(公告)号：JPH0994691A
公开(公告)日：1997-04-08
申请号：JP34520295
申请日：1995-12-06
申请人： DENSO CORP
发明人： TANAHASHI AKIRA , IMAIZUMI NORIHISA , OTANI YUJI , NAGASAKA TAKASHI
IPC分类号： B23K35/363
摘要： PROBLEM TO BE SOLVED: To impart good wettability to base metals and to entirely eliminate the residues after the end of soldering by using a flux which contains an org. material having hydroxyl functional groups and has a solidus temp. or above. SOLUTION: The flux for soldering which contains the org. material having at least two pieces of the (-OH) hydroxyl functional groups in one molecule and is approximately >=17 deg.C in the temp. at the time the mass% attains approximately 0% in measurement by a thermal gravimetric method when the flow rate of air of gaseous nitrogen (N2 ) atmosphere is set at 200ml/min and the temp. rising rate at 10 deg.C/min and which is above the solidus temp. of the solder is used. The flux is supplied together with the solder to the soldering part of the work and the work is placed in the atmosphere where the temp. elevation is possible. The work is then heated up at a heating up rate of >=10 deg.C/min in average in a temp. range of at least above the solidus line of the solder. The solder is used by kneading the solder powder having the compsn. to a pasty form.

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