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101. 发明授权

US07447022B2 Rack-mount equipment bay cooling heat exchanger 有权
标题翻译：机架安装设备湾冷却换热器
公开(公告)号：US07447022B2
公开(公告)日：2008-11-04
申请号：US11501657
申请日：2006-08-09
申请人： Vance Murakami , Christian L. Belady
发明人： Vance Murakami , Christian L. Belady
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H05K7/206
摘要： An apparatus in one example comprises at least one heat exchanger mounted within a rack-mount equipment bay and at least one duct coupled with the at least one heat exchanger that is configured to form a semi-closed cooling loop with at least one electronic device mounted within the rack-mount equipment bay. The at least one duct directs an airflow between the at least one heat exchanger and the at least one electronic device for cooling of the at least one electronic device.
摘要翻译：在一个示例中的装置包括安装在机架安装设备间隔中的至少一个热交换器和与所述至少一个热交换器耦合的至少一个管道，该至少一个热交换器被配置成形成半闭合冷却回路，其中安装有至少一个电子设备在机架安装设备托架内。所述至少一个管道引导所述至少一个热交换器和所述至少一个电子设备之间的气流，以冷却所述至少一个电子设备。

102. 发明授权

US07403396B2 Communicating with an electronic module that is slidably mounted in a system 有权
标题翻译：与可滑动地安装在系统中的电子模块通信
公开(公告)号：US07403396B2
公开(公告)日：2008-07-22
申请号：US11039042
申请日：2005-01-20
申请人： Christian L. Belady , Eric C. Peterson
发明人： Christian L. Belady , Eric C. Peterson
IPC分类号： H05K5/00 , H05K7/00 , G06F1/16 , A47B97/00
CPC分类号： H05K7/1492 , H05K7/1498
摘要： A system comprises an electronic module slidably mounted in the system, a first assembly including at least one wireless transceiver mounted in the system, and a second assembly including at least one wireless transceiver to communicate wirelessly with the wireless transceiver of the first assembly. The second assembly is attached to the electronic module, and the wireless transceivers of the first and second assemblies continue communicating as the electronic module is slidably moved in the system.
摘要翻译：系统包括可滑动地安装在系统中的电子模块，包括安装在系统中的至少一个无线收发器的第一组件和包括至少一个无线收发器的第二组件，以与第一组件的无线收发器进行无线通信。第二组件附接到电子模块，并且随着电子模块在系统中可滑动地移动，第一组件和第二组件的无线收发器继续通信。

103. 发明授权

US07379297B2 Air flow regulation devices 有权
标题翻译：气流调节装置
公开(公告)号：US07379297B2
公开(公告)日：2008-05-27
申请号：US11586300
申请日：2006-10-25
申请人： Eric C. Peterson , Christian L. Belady
发明人： Eric C. Peterson , Christian L. Belady
IPC分类号： H05K7/20
CPC分类号： G06F1/206 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： In one embodiment, an airflow regulation device comprises a at least one base member configured to couple to a connector on a circuit board, a first segment connected to the at least one base member and extending a first height from the at least one base member, and a second segment removably connected to the first segment and extending a second height from the at least one base member, wherein the second height is different than the first height.
摘要翻译：在一个实施例中，气流调节装置包括配置成耦合到电路板上的连接器的至少一个基座构件，连接到所述至少一个基座构件并且从所述至少一个基座构件延伸第一高度的第一段，以及第二段，其可移除地连接到所述第一段并且从所述至少一个基座构件延伸第二高度，其中所述第二高度不同于所述第一高度。

104. 发明申请

US20080082219A1 Heat sink system management 审中-公开
标题翻译：散热器系统管理
公开(公告)号：US20080082219A1
公开(公告)日：2008-04-03
申请号：US11540118
申请日：2006-09-29
申请人： Christian L. Belady , Mark E. Shaw
发明人： Christian L. Belady , Mark E. Shaw
IPC分类号： G05D23/00
CPC分类号： G05D23/1919
摘要： In one embodiment, a computing system comprises one or more processors and a memory module communicatively connected to the one or more processors. The memory module comprises logic instructions which, when executed on the one or more processors configure the one or more processors to activate a primary heat sink system, monitor the status of the primary heat sink system, and activate a secondary heat sink system when the primary heat sink system fails to meet an operational parameter.
摘要翻译：在一个实施例中，计算系统包括一个或多个处理器和通信地连接到一个或多个处理器的存储器模块。存储器模块包括逻辑指令，当在一个或多个处理器上执行时，配置一个或多个处理器以激活主散热器系统，监视主散热器系统的状态，并且当初级散热器系统散热器系统不能满足运行参数。

105. 发明申请

US20080074841A1 Dampening acoustic vibrations within an electronic system 有权
标题翻译：减轻电子系统内的声音振动
公开(公告)号：US20080074841A1
公开(公告)日：2008-03-27
申请号：US11526993
申请日：2006-09-26
申请人： Robert Boyd Curtis , Robert W. Skoog , Christian L. Belady , Jeffrey N. Metcalf
发明人： Robert Boyd Curtis , Robert W. Skoog , Christian L. Belady , Jeffrey N. Metcalf
IPC分类号： H05K7/20
CPC分类号： H05K7/20172 , G06F1/20
摘要： An electronic system includes a component that heats up during operation and an acoustic dampening air moving assembly. The acoustic dampening air moving assembly includes air moving blades, a motor, a support structure and a housing. The motor is attached to the air moving blades to rotate the air moving blades. The support structure supports the motor and the air moving blades within the housing. The housing and the support structure at least partially include a material selected for its acoustic dampening characteristics. The acoustic dampening air moving assembly moves air to the component to cool the component. The selected material dampens acoustic vibrations within the electronic system.
摘要翻译：电子系统包括在操作期间加热的部件和声学阻尼空气移动组件。声学阻尼空气移动组件包括空气移动叶片，马达，支撑结构和壳体。电动机连接到空气移动叶片上以旋转空气移动叶片。支撑结构支撑壳体内的电机和空气移动叶片。壳体和支撑结构至少部分地包括为其声学抑制特性选择的材料。声学阻尼空气移动组件将空气移动到部件以冷却部件。所选择的材料抑制电子系统内的声振动。

106. 发明授权

US07280365B2 Multi-processor module with redundant power 有权
标题翻译：具冗余电源的多处理器模块
公开(公告)号：US07280365B2
公开(公告)日：2007-10-09
申请号：US11061156
申请日：2005-02-18
申请人： Steven A. Belson , Shaun L. Harris , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Steven A. Belson , Shaun L. Harris , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , H05K1/0203 , H05K1/0263 , H05K2201/066 , H05K2201/0979 , H05K2201/10189
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.
摘要翻译：一个实施例包括具有第一印刷电路板（PCB）和具有至少两个处理器的第二PCB的电子组件。第二PCB耦合到并设置在第一PCB上方。散热装置将散热物从处理器中散出。第一和第二电源模块向第二PCB提供电源，并且是分离的和冗余的电源，使得在第一电源模块故障时，第二电源模块可为两个电源模块向第二个PCB提供电力。

107. 发明授权

US07064955B2 Redundant power for processor circuit board 失效
公开(公告)号：US07064955B2
公开(公告)日：2006-06-20
申请号：US10996477
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/184 , G06F1/185 , G06F1/20 , G06F1/263 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K2201/0979 , H05K2201/10189 , H05K2201/1056 , Y10T307/505 , H01L2924/00
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least one processor coupled to and disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the processor, and provides an airflow path. First and second power systems are coupled to the second PCB and in a pathway of the airflow path. The first and second power systems are redundant such that upon failure of the first power system, the second power system can provide power for both power systems.

108. 发明授权

US06809925B2 Dual-purpose computer having gravity-actuated fan speed control 有权
标题翻译：具有重力驱动风扇转速控制的双用途计算机
公开(公告)号：US06809925B2
公开(公告)日：2004-10-26
申请号：US10356080
申请日：2003-01-31
申请人： Christian L. Belady , Christopher G. Malone
发明人： Christian L. Belady , Christopher G. Malone
IPC分类号： H05K720
CPC分类号： H05K7/20727 , G06F1/20 , G06F2200/1638 , H05K7/1487
摘要： A dual-purpose computer according to the invention has a gravity-actuated switch mounted therein or thereon. The gravity-actuated switch is used to control the speed of a cooling fan for the computer. When the computer is operated in a horizontal orientation such as a typical rack-mounted server would be, the gravity actuated switch assumes a first state. When the computer is operated in a vertical orientation such as a typical desk side workstation would be, the gravity actuated switch assumes a second state. When the switch is in the first state, fan speed controller circuitry runs the fan at a first speed. When the switch is in the second state, fan speed controller circuitry runs the fan at a second speed. In one embodiment, the first speed is a higher speed intended to optimize reliability, and the second speed is a lower speed intended to minimize noise.
摘要翻译：根据本发明的两用计算机具有安装在其中或其上的重力驱动开关。重力驱动开关用于控制计算机的冷却风扇的速度。当计算机在诸如典型的机架式服务器的水平方向上操作时，重力驱动开关将处于第一状态。当计算机在诸如典型的桌面工作站的垂直方向上操作时，重力驱动的开关处于第二状态。当开关处于第一状态时，风扇转速控制器电路以第一速度运行风扇。当开关处于第二状态时，风扇转速控制器电路以第二速度运行风扇。在一个实施例中，第一速度是旨在优化可靠性的较高速度，并且第二速度是旨在最小化噪声的较低速度。

109. 发明授权

US06695042B1 Adjustable pedestal thermal interface 失效
标题翻译：可调基座热接口
公开(公告)号：US06695042B1
公开(公告)日：2004-02-24
申请号：US10209981
申请日：2002-07-31
申请人： Brent A. Boudreaux , Stacy Fraker , Eric C. Peterson , Christian L. Belady
发明人： Brent A. Boudreaux , Stacy Fraker , Eric C. Peterson , Christian L. Belady
IPC分类号： F28D1500
CPC分类号： F28F13/00 , F28F2013/006 , H01L21/4882 , H01L23/4338 , H01L2924/0002 , H01L2924/3011 , Y10T29/49353 , H01L2924/00
摘要： A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-up. The pedestals may be raised and lowered and tilted as needed to match the heights and tilts of the electronic devices. Within the heat sink is a cavity above the pedestal that may be filled with a thermally conductive material, such as solder, or a thermally conductive liquid, during construction to create a low thermal resistance contact between the pedestal and the heat sink fins. Also, thermally conductive material, such as thermal paste or a thermal pad, may be used between the heat generating device and the pedestal to create a low thermal resistance contact.
摘要翻译：构造了散热器，其包括至少一个导热基座，允许散热器的配置与多个发热电子器件接触，其中由于公差叠加，器件可能不是共面的。基座可以根据需要升高和降低并倾斜以匹配电子设备的高度和倾斜度。在散热器内部是在基座上方的空腔，其可以在构造期间填充有导热材料，例如焊料或导热液体，以在基座和散热鳍片之间产生低热阻接触。此外，可以在发热装置和基座之间使用导热材料，例如热膏或热垫，以产生低热阻接触。

110. 发明授权

US6133631A Semiconductor package lid with internal heat pipe 失效
标题翻译：带内部热管的半导体封装盖
公开(公告)号：US6133631A
公开(公告)日：2000-10-17
申请号：US866898
申请日：1997-05-30
申请人： Christian L. Belady
发明人： Christian L. Belady
IPC分类号： F28D15/02 , H01L23/02 , H01L23/04 , H01L23/427 , H01L23/34
CPC分类号： H01L23/427 , F28D15/0233 , H01L2224/16225 , H01L2924/15311 , H01L2924/16152
摘要： The thermal resistance to lateral flow of heat flux through the lid of a semiconductor package may be reduced by incorporating one or more heat pipes into the lid itself. This has the further benefit of reducing the effective thermal resistance of the mechanical interface between the lid of the package and an external heat sink, owing to an increased area over which the heat flux is conducted. The result is a reduced temperature at the source of heat inside the semiconductor package.
摘要翻译：可以通过将一个或多个热管并入盖子本身来减少通过半导体封装盖的热流的横向流动的热阻。由于增加了热通量的面积，所以具有降低封装盖和外部散热器之间的机械界面的有效热阻的优点。结果是半导体封装内的热源的温度降低。

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