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101. 发明授权

US08338927B2 Semiconductor device with the leads projected from sealing body 有权
标题翻译：具有从密封体突出的引线的半导体器件
公开(公告)号：US08338927B2
公开(公告)日：2012-12-25
申请号：US13225788
申请日：2011-09-06
申请人： Hiroyuki Nakamura , Atsushi Nishikizawa , Nobuya Koike
发明人： Hiroyuki Nakamura , Atsushi Nishikizawa , Nobuya Koike
IPC分类号： H01L21/44
CPC分类号： H01L21/4835 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/45144 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/0106 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , H05K3/3426 , H05K2201/10795 , H05K2201/10909 , Y02P70/613 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： The semiconductor device includes a semiconductor chip, a chip mounting portion, a suspension lead, and a plurality of leads. Each of the plurality of leads has a first part and a second part, and the suspension lead has a first part and a second part. The first part of each of the plurality of leads and the suspension lead project from the plurality of side surfaces of the sealing body, respectively. Parts of the side surfaces of the plurality of leads and the suspension lead are exposed from the plurality of side surfaces of the sealing body, respectively. An area of the obverse surface of the first part of the suspension lead is larger than an area of the obverse surface of the first part of each of the plurality of leads in a plan view.
摘要翻译：半导体器件包括半导体芯片，芯片安装部分，悬挂引线和多个引线。多个引线中的每一个具有第一部分和第二部分，并且悬架引线具有第一部分和第二部分。多个引线中的每一个的第一部分和悬挂引线分别从密封体的多个侧表面伸出。多个引线的侧面部分和悬挂引线分别从密封体的多个侧面露出。在俯视图中，悬架引线的第一部分的正面的面积大于多根引线中的每一个的第一部分的正面的面积。

102. 发明申请

US20120313724A1 ELASTIC WAVE FILTER DEVICE AND ANTENNA DUPLEXER USING SAME 有权
标题翻译：弹性波过滤装置和使用相同的天线双工器
公开(公告)号：US20120313724A1
公开(公告)日：2012-12-13
申请号：US13509641
申请日：2010-11-10
申请人： Tetsuya Tsurunari , Joji Fujiwara , Hiroyuki Nakamura
发明人： Tetsuya Tsurunari , Joji Fujiwara , Hiroyuki Nakamura
IPC分类号： H03H9/72 , H03H9/64
CPC分类号： H03H9/725
摘要： An elastic wave filter device includes a longitudinally coupled resonator-type elastic wave filter formed on a piezoelectric substrate; and a ladder-type elastic wave filter connected to the resonator-type elastic wave filter. The resonator-type filter includes an input IDT and an output IDT. The ladder-type filter includes a series arm resonator and a parallel arm resonator. A first ground electrode connected to the parallel arm resonator is electrically separated from a second ground electrode connected to at least one of the input IDT and the output IDT.
摘要翻译：弹性波滤波器装置包括形成在压电基片上的纵向耦合的谐振器型弹性波滤波器; 连接到谐振器型弹性波滤波器的梯形弹性波滤波器。谐振器型滤波器包括输入IDT和输出IDT。梯型滤波器包括串联臂谐振器和并联臂谐振器。连接到并联臂谐振器的第一接地电极与连接到输入IDT和输出IDT中的至少一个的第二接地电极电隔离。

103. 发明授权

US08299600B2 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US08299600B2
公开(公告)日：2012-10-30
申请号：US12619561
申请日：2009-11-16
申请人： Yukihiro Sato , Katsuhiko Funatsu , Hiroyuki Nakamura
发明人： Yukihiro Sato , Katsuhiko Funatsu , Hiroyuki Nakamura
IPC分类号： H01L23/48
CPC分类号： H01L23/4334 , H01L23/49524 , H01L23/49562 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/91 , H01L2224/0603 , H01L2224/29111 , H01L2224/2919 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/40095 , H01L2224/40245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4847 , H01L2224/48599 , H01L2224/73215 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2224/85013 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device is provided with improved reliability. A semiconductor chip is mounted over a chip mounting portion of a lead frame via solder. A metal plate is arranged over a source pad of the semiconductor chip and a lead portion of a lead frame via solder. A solder reflow process is performed thereby to bond the semiconductor chip over the chip mounting portion with a solder, and to bond the metal plate to the source pad and the lead portion with the other solders. The lead frame is formed of a copper alloy, and thus has its softening temperature higher than the temperature of the solder reflow process. The metal plate is formed of oxygen-free copper, and has its softening temperature lower than the temperature of the solder reflow process, whereby the metal plate is softened in the solder reflow process. Thereafter, a gate pad electrode of the semiconductor chip is coupled to a lead portion via the wire, a sealing resin portion is formed, and then the lead frame is cut.
摘要翻译：半导体器件具有改进的可靠性。通过焊料将半导体芯片安装在引线框架的芯片安装部分上。金属板通过焊料布置在半导体芯片的源极焊盘和引线框架的引线部分的上方。进行焊料回流工艺，从而通过焊料将半导体芯片连接在芯片安装部分上，并将金属板与其它焊料接合到源极焊盘和引线部分。引线框架由铜合金形成，因此其软化温度高于焊料回流工艺的温度。金属板由无氧铜形成，其软化温度低于焊锡回流工序的温度，由此金属板在回流焊工艺中软化。此后，半导体芯片的栅极焊盘电极通过导线连接到引线部分，形成密封树脂部分，然后引线框架被切割。

104. 发明申请

US20120261825A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20120261825A1
公开(公告)日：2012-10-18
申请号：US13533391
申请日：2012-06-26
申请人： Nobuya KOIKE , Atsushi Fujiki , Norio Kido , Yukihiro Sato , Hiroyuki Nakamura
发明人： Nobuya KOIKE , Atsushi Fujiki , Norio Kido , Yukihiro Sato , Hiroyuki Nakamura
IPC分类号： H01L23/48
CPC分类号： H01L21/565 , H01L23/49503 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L2224/04042 , H01L2224/29111 , H01L2224/29139 , H01L2224/32245 , H01L2224/32257 , H01L2224/40095 , H01L2224/40245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/49171 , H01L2224/49175 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： It is made for the layout of the mounting wiring at the time of mounting to become efficient by changing the structure of a semiconductor device.A first chip is mounted on a first die pad, and a second chip is also mounted on a second die pad. A first die pad and a second die pad do division structure in parallel to the first side and second side of sealing body 40. As a result, the pin for an output from a first chip and the pin for control of the circuit for a drive can make it able to project from a counter direction, and can set the wiring layout at the time of mounting as the minimum route.
摘要翻译：通过改变半导体器件的结构，安装时的安装布线的布局变得有效。第一芯片安装在第一芯片焊盘上，第二芯片也安装在第二芯片焊盘上。第一管芯焊盘和第二管芯焊盘与密封体40的第一侧面和第二侧平行地进行分割结构。结果，用于从第一芯片输出的引脚和用于控制驱动电路的引脚可以使其能够从反方向投影，并可以将安装时的布线布局设置为最小路线。

105. 发明授权

US08174165B2 Surface acoustic wave device and manufacturing method of the same surface acoustic wave device 有权
标题翻译：声表面波装置及相同声表面波装置的制造方法
公开(公告)号：US08174165B2
公开(公告)日：2012-05-08
申请号：US12720778
申请日：2010-03-10
申请人： Hidekazu Nakanishi , Hiroyuki Nakamura , Yukio Iwasaki
发明人： Hidekazu Nakanishi , Hiroyuki Nakamura , Yukio Iwasaki
IPC分类号： H03H9/25 , H01L41/22
CPC分类号： H03H3/08 , H03H9/25 , Y10T29/42
摘要： A surface acoustic wave device includes a piezoelectric element, an IDT electrode formed on the piezoelectric element for exciting a principal wave, a reflection film formed on the piezoelectric element having a higher reflectivity than the reflectivity of the piezoelectric element in a visible light wavelength region, and a light permeable dielectric layer formed on the piezoelectric element, at least a part of the IDT electrode, and the reflection film. Accordingly, when measuring the film thickness of the light permeable dielectric layer by light interference method, the reflected light from the reflection film having a higher reflectivity than the reflectivity of the piezoelectric element in a visible light wavelength region can be utilized, so that the film thickness can be measured more accurately.
摘要翻译：表面声波装置包括压电元件，形成在用于激励主波的压电元件上的IDT电极，形成在压电元件上的具有比可见光波长区域中的压电元件的反射率更高的反射率的反射膜，以及形成在压电元件上的透光性介电层，IDT电极的至少一部分和反射膜。因此，当通过光干涉法测量透光电介质层的膜厚时，可以利用具有比可见光波长区域中的压电元件的反射率更高的反射率的反射膜的反射光，使得膜可以更精确地测量厚度。

106. 发明申请

US20110169899A1 LIQUID CONTAINER AND LIQUID EJECTING APPARATUS 有权
标题翻译：液体容器和液体喷射装置
公开(公告)号：US20110169899A1
公开(公告)日：2011-07-14
申请号：US12986131
申请日：2011-01-06
申请人： Izumi Nozawa , Tadahiro Mizutani , Hiroyuki Nakamura
发明人： Izumi Nozawa , Tadahiro Mizutani , Hiroyuki Nakamura
IPC分类号： B41J2/175
CPC分类号： B41J2/17513 , B41J2/17556 , B41J2002/17516
摘要： Provided is a liquid container containing a liquid which is to be supplied to a liquid ejecting apparatus, including: a containing portion containing the liquid and including a liquid out-flowing hole for out-flowing the liquid to an external portion and an air introducing hole for introducing external air into the containing portion, and a deforming portion being deformed in such a direction that a volume of the containing portion is reduced according to a decrease in an internal pressure of the containing portion; wherein the air introducing portion includes: a first sealing portion disposed in a circumference of the air introducing hole inside the containing portion; a second sealing portion displaceably disposed inside the containing portion and capable of closing the air introducing hole by pressing the first sealing portion outwards; and a biasing portion pressing the second sealing portion toward the first sealing portion.
摘要翻译：本发明提供容纳液体喷射装置的液体的液体容器，该液体容器包括：含有液体的容纳部分，并且包括用于使液体向外部流出的液体流出孔和空气导入孔用于将外部空气引入到容纳部分中，并且变形部分沿着容纳部分的体积根据容纳部分的内部压力的降低而减小的方向变形; 所述空气导入部包括：第一密封部，设置在所述容纳部内的所述空气导入孔的周围; 第二密封部，可移动地设置在容纳部的内部，能够通过向外按压第一密封部而闭合空气导入孔; 以及将所述第二密封部朝向所述第一密封部按压的偏压部。

107. 发明申请

US20110133858A1 ELASTIC WAVE ELEMENT AND ELECTRONIC DEVICE USING THE SAME 审中-公开
标题翻译：使用它的弹性波元件和电子器件
公开(公告)号：US20110133858A1
公开(公告)日：2011-06-09
申请号：US13056813
申请日：2009-08-05
申请人： Rei Goto , Hidekazu Nakanishi , Hiroyuki Nakamura
发明人： Rei Goto , Hidekazu Nakanishi , Hiroyuki Nakamura
IPC分类号： H03H9/15 , H03H9/25
CPC分类号： H03H9/0222 , H03H9/02559 , H03H9/14541
摘要： An elastic wave device includes a piezoelectric substrate, an IDT electrode disposed on a piezoelectric device, a first dielectric layer disposed on the piezoelectric substrate such that it covers the IDT electrode, and a second dielectric layer disposed over the first dielectric layer. The second dielectric layer propagates transverse waves faster than that on the first dielectric layer. When a film thickness of the second dielectric layer is greater than a wave length of a major wave excited by the IDT electrode, a cut angle of the piezoelectric substrate in indication of Euler angles (φ, θ, Φ) is set to φ≠0°, θ≠0°, and Φ≠0°. This suppresses deterioration of device characteristics.
摘要翻译：弹性波装置包括压电基板，设置在压电装置上的IDT电极，设置在压电基板上以覆盖IDT电极的第一电介质层和设置在第一介电层上的第二电介质层。第二电介质层比第一电介质层上的横波更快地传播。当第二电介质层的膜厚度大于由IDT电极激发的主波的波长时，表示欧拉角（＆phgr;＆Theta;Φ）的压电基板的切割角被设定为＆phgr ;≠0°，＆thetas;≠0°，Φ≠0°。这抑制了器件特性的劣化。

108. 发明申请

US20110109196A1 PLATE WAVE ELEMENT AND ELECTRONIC EQUIPMENT USING SAME 有权
标题翻译：板波元件和使用相同的电子设备
公开(公告)号：US20110109196A1
公开(公告)日：2011-05-12
申请号：US12999369
申请日：2009-07-08
申请人： Rei Goto , Hidekazu Nakanishi , Hiroyuki Nakamura
发明人： Rei Goto , Hidekazu Nakanishi , Hiroyuki Nakamura
IPC分类号： H01L41/053
CPC分类号： H03H9/02559 , H03H9/02228 , H03H9/02574 , H03H9/02834
摘要： A plate wave element includes a piezoelectric body, a comb-shaped electrode disposed on an upper surface of the piezoelectric body, and a medium layer disposed on the upper surface of the piezoelectric body so as to cover the comb-shaped electrode. The comb-shaped electrode excites a Lamb wave as a main wave. The medium layer has a frequency temperature characteristic opposite to that of the piezoelectric body. The plate wave element has a preferable frequency temperature characteristic.
摘要翻译：平板波形元件包括压电体，设置在压电体的上表面上的梳状电极和设置在压电体的上表面上以覆盖梳状电极的介质层。梳状电极激发兰姆波作为主波。介质层具有与压电体相反的频率温度特性。板波元件具有优选的频率温度特性。

109. 发明申请

US20110063046A1 SURFACE ACOUSTIC WAVE FILTER DEVICE, DUPLEXER INCLUDING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME 有权
标题翻译：表面声波滤波装置，包括它们的双面器，以及包括它们的电子装置
公开(公告)号：US20110063046A1
公开(公告)日：2011-03-17
申请号：US12878104
申请日：2010-09-09
申请人： Joji FUJIWARA , Tetsuya TSURUNARI , Hiroyuki NAKAMURA , Rei GOTO
发明人： Joji FUJIWARA , Tetsuya TSURUNARI , Hiroyuki NAKAMURA , Rei GOTO
IPC分类号： H03H9/72 , H03H9/64
CPC分类号： H03H9/008 , H03H9/0071 , H03H9/725
摘要： A surface acoustic wave (SAW) filter device includes an input port for receiving an unbalanced signal, a pair of input/output ports, a first SAW filter for receiving the unbalanced signal from the input port and outputting balanced signals to the pair of input/output ports, a second SAW filter for receiving the balanced signals output from the pair of input/output ports and outputting balanced signals, and a pair of output ports for outputting the balanced signals output from the second SAW filter. The first SAW filter includes a first longitudinally-coupled SAW resonator having a first unbalanced signal input port and first and second balanced signal output ports, and a second longitudinally-coupled SAW resonator having a second unbalanced signal input port and third and fourth balanced signal output port. The first and second unbalanced signal input ports are electrically connected to the input port. The first and third balanced signal output ports both are electrically connected to one of the pair of input/output ports. The second and fourth balanced signal output ports both are electrically connected to another of the pair of input/output ports. This SAW filter device can suppress spurious and has a small insertion loss.
摘要翻译：表面声波（SAW）滤波器装置包括用于接收不平衡信号的输入端口，一对输入/输出端口，用于从输入端口接收不平衡信号的第一SAW滤波器，并将平衡信号输出到输入/ 输出端口，第二SAW滤波器，用于接收从一对输入/输出端口输出的平衡信号并输出平衡信号;以及一对输出端口，用于输出从第二SAW滤波器输出的平衡信号。第一SAW滤波器包括具有第一不平衡信号输入端口和第一和第二平衡信号输出端口的第一纵向耦合SAW谐振器，以及具有第二不平衡信号输入端口和第三和第四平衡信号输出端的第二纵向耦合SAW谐振器港口。第一和第二不平衡信号输入端口电连接到输入端口。第一和第三平衡信号输出端口都电连接到一对输入/输出端口中。第二和第四平衡信号输出端口都电连接到该对输入/输出端口中的另一个。该SAW滤波器装置可以抑制杂散并具有小的插入损耗。

110. 发明申请

US20100281500A1 AV DEVICE AND UI DISPLAY METHOD 审中-公开
标题翻译： AV设备和UI显示方法
公开(公告)号：US20100281500A1
公开(公告)日：2010-11-04
申请号：US12810697
申请日：2008-05-28
申请人： Akio Uemichi , Hiroyuki Nakamura , Kenji Sakamoto , Jun Sasaki , Satoshi Matsuyama , Ryusuke Watanabe
发明人： Akio Uemichi , Hiroyuki Nakamura , Kenji Sakamoto , Jun Sasaki , Satoshi Matsuyama , Ryusuke Watanabe
IPC分类号： H04N5/445
CPC分类号： H04N5/44543 , H04N7/163 , H04N21/4312 , H04N21/4314 , H04N21/4622 , H04N21/482
摘要： To solve the problems that it is necessary to perform an overlapped operation even if final viewing is to be decided while a plurality of contents included in a specified list of UI are compared (selected for a plurality of times) and that extra operation burden is given to a user in conventional technology. An AV device for giving priority to the list of a viewing source device to which the content outputted at present belongs and displaying it in UI at the time of receiving a list request of the content from the user is provided.
摘要翻译：为了解决即使在确定包括在指定的UI列表中的多个内容（多次选择）并且给出额外的操作负担的情况下，即使在最终观看被确定时也需要执行重叠操作的问题传统技术中的用户。提供了用于优先考虑当前输出的内容的观看源设备的列表所属的AV设备，并且在从用户接收到内容的列表请求时将其显示在UI中。

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