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    • 91. 发明申请
    • WAFER HOLDER
    • WO01018856A1
    • 2001-03-15
    • PCT/JP2000/005818
    • 2000-08-29
    • C23C16/458C30B25/12C30B31/14H01L21/673H01L21/687H01L21/22H01L21/205
    • H01L21/68735C23C16/4583C30B25/12C30B31/14H01L21/67309H01L21/6875
    • A wafer (22) is placed on the surface of a holder (23), which is held horizontally in a plurality of grooves (14) formed in a heat treatment furnace. The holder has the shape of a disc with no cuts and includes ringlike projections (24) extending from its center and projecting upward. The wafer is held in contact with the upper ends of the projections of the holder. The maximum distance between the diametrically opposed projections ranges from 0.5D to 0.98D so that the projections may not come in contact with the periphery of the wafer, where D is wafer diameter. The holder is manufactured without warpage to prevent slip defects from appearing in a wafer. The holder supports any of wafers of different sizes exactly in place. The holder facilitates loading and unloading a wafer.
    • 将晶片(22)放置在保持器(23)的表面上,该保持器水平地保持在形成在热处理炉中的多个凹槽(14)中。 保持器具有不具有切口的盘的形状,并且包括从其中心延伸并向上突出的环形突起(24)。 晶片与保持器的突起的上端保持接触。 直径相对的突起之间的最大距离为0.5D至0.98D,使得突起可能不与晶片的周边接触,其中D是晶片直径。 保持器没有翘曲地制造,以防止滑动缺陷出现在晶片中。 保持器支撑任何不同尺寸的晶片完全就位。 支架有助于装载和卸载晶圆。