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    • 91. 发明授权
    • Method of semiconductor substrate batch demounting
    • 半导体衬底批量拆卸方法
    • US06601592B1
    • 2003-08-05
    • US09685734
    • 2000-10-11
    • Zhengming Chen
    • Zhengming Chen
    • B08B304
    • H01L21/67781Y10S134/902
    • This is a method of cassette-to-cassette batch demounting process that includes providing an apparatus having two cassettes for holding and separating semiconductor substrates. A first cassette is placed on top of a second cassette, using the first cassette as the top cassette that holds the semiconductor substrate and the support substrate, and the second cassette at the bottom as a bottom cassette that receives the semiconductor substrate after demounting process. The semiconductor substrate is loaded with its support substrate into a slot in the top cassette. The top cassette will let only the semiconductor substrate to descend to the bottom cassette while blocking the support substrate from exiting the top cassette. The two cassettes are then soaked in a hot solvent that can dissolve or melt an adhesive that adheres the semiconductor substrate to the support substrate in order to weaken the cohesive force between the two substrates. The thinned semiconductor substrate will gradually demount from its support substrate by gravitational force and vertically slides down into the bottom cassette.
    • 这是一种盒式到盒式批量拆卸方法,其包括提供一种具有用于保持和分离半导体衬底的两个盒的装置。 第一盒被放置在第二盒的顶部上,使用第一盒作为保持半导体衬底和支撑衬底的顶盒,底部的第二盒作为在拆卸之后接收半导体衬底的底盒。 半导体衬底将其支撑衬底装载到顶盒中的狭槽中。 顶部盒式磁带将仅使半导体衬底下降到底部盒,同时阻止支撑衬底离开顶部盒。 然后将两个盒浸泡在热溶剂中,该热溶剂可溶解或熔化将半导体衬底粘附到支撑衬底上的粘合剂,以便削弱两个衬底之间的内聚力。 减薄的半导体衬底将通过重力从其支撑衬底逐渐脱落并且垂直地向下滑入底部盒。
    • 96. 发明授权
    • Gloss retention compositions
    • 光泽保留组合物
    • US06532973B1
    • 2003-03-18
    • US09578645
    • 2000-05-25
    • Stephen F. GrossTimothy C. MorrisMichael S. WigginsRobert J. Valesky
    • Stephen F. GrossTimothy C. MorrisMichael S. WigginsRobert J. Valesky
    • B08B304
    • C11D1/722C11D1/662C11D1/825
    • A cleaning composition containing: (A) an alkyl polyglycoside corresponding to formula I: R1O(R2O)b(Z)a  I wherein R1 is a monovalent organic radical having from about 6 to about 30 carbon atoms; R2 is a divalent alkylene radical having from 2 to 4 carbon atoms; Z is a saccharide residue having 5 or 6 carbon atoms; b is a number having a value from 0 to about 12; a is a number having a value from 1 to about 6; and (B) at least one product of a reaction between: a) at least one linking agent of formula IV: R4(Y)3  (IV)  wherein each Y group is a halogen atom or one Y group is a halogen atom and two Y groups with two adjacent carbon atoms in the R4 group and an oxygen atom form an epoxy group, and R4 is an alkanetriyl group containing from 3 to 10 carbon atoms; and (b) at least one compound of formula (II) R3(EO)n(PO)m(BO)pX  (II)  wherein R3 is a substituted or unsubstituted saturated or unsaturated, aliphatic oxy or thio group having from 1 to about 36 carbon atoms or a secondary amino group having from 2 to about 36 carbon atoms; n, m, and p are independently numbers of from 0 to about 50; X is hydrogen, or a mercapto group or an amino group in place of a terminal —OH group, provided that when X is mercapto or amino, the sum of n, m, and p must be at least 1; and wherein the mole ratio of component a) to component b) is from about 0.2/1 to about 5/1.
    • 一种清洁组合物,其包含:(A)对应于式I的烷基多糖苷:其中R 1是具有约6至约30个碳原子的一价有机基团; R2是具有2至4个碳原子的二价亚烷基; Z是具有5或6个碳原子的糖残基; b是0至约12的数值; a是1至6的数值; 和(B)至少一种以下反应产物:a)至少一种式IV的连接剂:其中每个Y基团是卤素原子或一个Y基团是卤素原子,和两个具有两个相邻碳原子的Y基团 R4基和氧原子形成环氧基,R4是含有3〜10个碳原子的烷撑三基; 和(b)至少一种式(II)化合物,其中R 3是具有1至约36个碳原子的取代或未取代的饱和或不饱和的脂族氧基或硫基或具有2至约36个碳原子的仲氨基 ; n,m和p独立地为0至约50的数; X是氢或巯基或氨基代替末端-OH基团,条件是当X是巯基或氨基时,n,m和p之和必须至少为1; 并且其中组分a)与组分b)的摩尔比为约0.2 / 1至约5/1。