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    • 93. 发明申请
    • A THREE-DIMENSIONAL MEMORY
    • 一个三维的记忆
    • WO03032372A8
    • 2003-09-18
    • PCT/CN0200703
    • 2002-09-29
    • ZHANG GUOBIAO
    • ZHANG GUOBIAO
    • G11C7/18G11C29/00H01L27/06H01L21/00
    • H01L29/76G11C7/18G11C17/06G11C17/14G11C29/822G11C29/846H01L23/58H01L27/0688
    • In a three-dimensional integrated memory (3DiM), three-dimensional memories (3D-Ms) are integrated with conventional readable and writeable memories and/or data processors on a single chip. The overall performance of a 3DiM (such as speed, rate of finished products, programmability and data security) is superior to that of standalone 3D-Ms. The invention provides various types of methodsfor improving the capability of integration of said 3D-Ms. In addition, the invention also provides further improvement in the structure, circuit design and the like of 3D-Ms. One important application field of 3D-Ms is the integrated circuit testing : a 3D-M loaded with test data may be integrated with a test circuit, and thereby realize self-testing and high-speed testing on the spot.
    • 在三维集成存储器(3DiM)中,三维存储器(3D-Ms)与传统的可读和可写存储器和/或数据处理器集成在单个芯片上。 3DiM的整体性能(如速度,成品率,可编程性和数据安全性)优于独立式3D-Ms。 本发明提供了各种提高3D-Ms整合能力的方法。 另外,本发明还提供了3D-Ms的结构,电路设计等方面的进一步改进。 3D-Ms的一个重要应用领域是集成电路测试:装载有测试数据的3D-M可以与测试电路集成,从而实现现场自检和高速测试。
    • 94. 发明申请
    • FUSE CONCEPT AND METHOD OF OPERATION
    • 保险丝的概念和操作方法
    • WO03071554A2
    • 2003-08-28
    • PCT/EP0301630
    • 2003-02-18
    • INFINEON TECHNOLOGIES AG
    • HOENIGSCHMID HEINZVIEHMANN HEINRICH
    • G11C29/04G11C17/14G11C29/00G11C29/44
    • G11C11/16G11C17/14G11C29/72G11C29/789
    • It is difficult to fabricate a semiconductor memory device without any faulty memory storage cells. One solution is to produce more storage cells than needed on a device and faulty storage cells are replaced by the redundant storage cells. This solution requires that the addresses of the faulty storage cells, along with the replacement storage cells, be saved in a memory. The present invention teaches the use of non-volatile memory cells, particularly magnetoresistive random access memory (MRAM) cells, to store the addresses. Non-volatile memory cells can effectively replace the laser fuses currently used and also provides an advantage in the elimination of the laser fuse-burning step during the fabrication of the device.
    • 难以制造半导体存储器件而没有任何错误的存储器存储单元。 一个解决方案是生产比设备上所需的更多的存储单元,并且冗余存储单元被替换为故障存储单元。 该解决方案要求将故障存储单元的地址与替换存储单元一起保存在存储器中。 本发明教导了使用非易失性存储单元,特别是磁阻随机存取存储器(MRAM)单元来存储地址。 非易失性存储单元可以有效地替代当前使用的激光熔丝,并且还在设备制造期间消除激光熔丝烧制步骤的优点。