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91. 发明授权

US07923103B2 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods 有权
标题翻译：具有高导热性和低热膨胀系数的复合材料和散热基板及其制造方法
公开(公告)号：US07923103B2
公开(公告)日：2011-04-12
申请号：US11678391
申请日：2007-02-23
申请人： Hideko Fukushima
发明人： Hideko Fukushima
IPC分类号： B32B5/18 , B32B15/00
CPC分类号： C04B41/009 , C04B41/4523 , C04B41/52 , C04B41/81 , C04B41/89 , C04B2111/00844 , C22C1/1036 , C22C47/06 , C22C2001/1021 , H01L21/4878 , H01L23/373 , H01L23/3733 , H01L23/3736 , H01L2924/0002 , Y10T428/12493 , Y10T428/249957 , Y10T428/249967 , Y10T428/249969 , Y10T428/24997 , Y10T428/30 , Y10T428/31678 , C04B41/0072 , C04B41/4521 , C04B41/5096 , C04B41/5155 , C04B41/5127 , C04B41/515 , C04B41/5116 , C04B41/51 , C04B41/4541 , C04B41/5144 , C04B35/522 , C04B38/00 , H01L2924/00
摘要： A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the thermal expansion coefficient are 250 W/mK a more and less than 4×10−6/K, respectively, in an extrusion direction; and that the thermal conductivity and the thermal expansion coefficient are 150 W/mK or more and 10×10−6/K or less, respectively, in a direction perpendicular to the extrusion direction.
摘要翻译：通过用金属浸渍多孔石墨化挤出物获得的具有高热导率和热膨胀系数小的复合材料; 具有各向异性的复合材料，导热性和热膨胀系数分别在挤出方向上分别为250W / mK以上且小于4×10-6 / K; 热导率和热膨胀系数分别在垂直于挤出方向的方向上为150W / mK以上且10×10-6 / K以下。

92. 发明授权

US07708050B2 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods 有权
标题翻译：具有高导热性和低热膨胀系数的复合材料和散热基板及其制造方法
公开(公告)号：US07708050B2
公开(公告)日：2010-05-04
申请号：US11678405
申请日：2007-02-23
申请人： Hideko Fukushima
发明人： Hideko Fukushima
IPC分类号： B22D23/00
CPC分类号： C04B41/009 , C04B41/4523 , C04B41/52 , C04B41/81 , C04B41/89 , C04B2111/00844 , C22C1/1036 , C22C47/06 , C22C2001/1021 , H01L21/4878 , H01L23/373 , H01L23/3733 , H01L23/3736 , H01L2924/0002 , Y10T428/12493 , Y10T428/249957 , Y10T428/249967 , Y10T428/249969 , Y10T428/24997 , Y10T428/30 , Y10T428/31678 , C04B41/0072 , C04B41/4521 , C04B41/5096 , C04B41/5155 , C04B41/5127 , C04B41/515 , C04B41/5116 , C04B41/51 , C04B41/4541 , C04B41/5144 , C04B35/522 , C04B38/00 , H01L2924/00
摘要： A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the thermal expansion coefficient are 250 W/mK or more and less than 4×10−6/K, respectively, in an extrusion direction; and that the thermal conductivity and the thermal expansion coefficient are 150 W/mK or more and 10×10−6/K or less, respectively, in a direction perpendicular to the extrusion direction.
摘要翻译：通过用金属浸渍多孔石墨化挤出物获得的具有高热导率和热膨胀系数小的复合材料; 具有各向异性的复合材料，其导热率和热膨胀系数分别在挤出方向上为250W / mK以上且小于4×10-6 / K; 热导率和热膨胀系数分别在垂直于挤出方向的方向上为150W / mK以上且10×10-6 / K以下。

93. 发明申请

US20100015468A1 METHOD FOR MANUFACTURING METALLIZED ALUMINUM NITRIDE SUBSTRATE 审中-公开
标题翻译：制造金属化氮化铝衬底的方法
公开(公告)号：US20100015468A1
公开(公告)日：2010-01-21
申请号：US12519571
申请日：2007-12-21
申请人： Yasuyuki Yamamoto , Masakatsu Maeda , Osamu Yatabe
发明人： Yasuyuki Yamamoto , Masakatsu Maeda , Osamu Yatabe
IPC分类号： B32B15/04 , B05D3/02
CPC分类号： H05K3/38 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00844 , H01L21/4867 , H01L23/3735 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K3/248 , H05K2201/0347 , H05K2201/035 , Y10T428/12576 , C04B35/581 , C04B41/4517 , C04B41/4539 , C04B41/5133 , C04B41/4541 , C04B41/5144 , C04B41/5127 , C04B41/522 , C04B41/5116 , H01L2924/00
摘要： A method for manufacturing metallized aluminum nitride substrate. The method includes: Step A for forming a high-melting point metal layer over a sintered aluminum nitride substrate; Step B for forming over the high-melting point metal layer an intermediate metal layer of at least one selected from the group of: nickel, copper, copper-silver, copper-tin, and gold by plate processing; and Step C for forming a surface metal layer containing silver as a main component over the intermediate metal layer by coating a silver paste whose glass component content is 1 mass % or less and firing under nonoxidizing atmosphere. By this method, it is capable of forming a glass component-free silver layer which is adhered at a high degree of adhesion strength onto the high-melting point metal layer formed over the aluminum nitride substrate as a top face by thick-film method using a silver paste which makes thick-membrane forming easier.
摘要翻译：金属化氮化铝基板的制造方法。该方法包括：步骤A，用于在烧结的氮化铝衬底上形成高熔点金属层; 步骤B，通过板加工在高熔点金属层上形成选自镍，铜，铜 - 银，铜 - 锡和金中的至少一种的中间金属层; 以及步骤C，通过涂覆玻璃成分含量为1质量％以下的银膏，在非氧化性气氛下进行烧成，在中间金属层上形成含有银为主要成分的表面金属层。通过该方法，能够通过厚膜法以高膜法形成以高粘合强度粘附在形成在氮化铝基板上的高熔点金属层上的无玻璃成分的银层，使得较厚膜形成更容易的银糊。

94. 发明授权

US07282265B2 Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods 失效
标题翻译：具有高导热性和低热膨胀系数的复合材料和散热基板及其制造方法
公开(公告)号：US07282265B2
公开(公告)日：2007-10-16
申请号：US10845257
申请日：2004-05-14
申请人： Hideko Fukushima
发明人： Hideko Fukushima
IPC分类号： B32B5/18 , B32B5/04 , B32B3/26 , B32B15/04
CPC分类号： C04B41/009 , C04B41/4523 , C04B41/52 , C04B41/81 , C04B41/89 , C04B2111/00844 , C22C1/1036 , C22C47/06 , C22C2001/1021 , H01L21/4878 , H01L23/373 , H01L23/3733 , H01L23/3736 , H01L2924/0002 , Y10T428/12493 , Y10T428/249957 , Y10T428/249967 , Y10T428/249969 , Y10T428/24997 , Y10T428/30 , Y10T428/31678 , C04B41/0072 , C04B41/4521 , C04B41/5096 , C04B41/5155 , C04B41/5127 , C04B41/515 , C04B41/5116 , C04B41/51 , C04B41/4541 , C04B41/5144 , C04B35/522 , C04B38/00 , H01L2924/00
摘要： A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the thermal expansion coefficient are 250 W/mK or more and less than 4×10−6/K, respectively, in an extrusion direction; and that the thermal conductivity and the thermal expansion coefficient are 150 W/mK or more and 10×10−6/K or less, respectively, in a direction perpendicular to the extrusion direction.
摘要翻译：通过用金属浸渍多孔石墨化挤出物获得的具有高热导率和热膨胀系数小的复合材料; 具有各向异性的复合材料分别在挤出方向上的热导率和热膨胀系数分别为250W / mK以上且小于4×10 -6 / K; 并且热导率和热膨胀系数分别在垂直于挤出方向的方向上分别为150W / mK以上且10×10 -6 / K以下。

95. 发明申请

US20070132127A1 COMPOSITE MATERIAL, HAVING HIGH THERMAL CONDUCTIVITY AND LOW THERMAL EXPANSION COEFFICIENT, AND HEAT-DISSIPATING SUBSTRATE, AND THEIR PRODUCTION METHODS 有权
标题翻译：具有高导热系数和低热膨胀系数的复合材料和散热基板及其生产方法
公开(公告)号：US20070132127A1
公开(公告)日：2007-06-14
申请号：US11678405
申请日：2007-02-23
申请人： Hideko FUKUSHIMA
发明人： Hideko FUKUSHIMA
IPC分类号： C01B31/00
CPC分类号： C04B41/009 , C04B41/4523 , C04B41/52 , C04B41/81 , C04B41/89 , C04B2111/00844 , C22C1/1036 , C22C47/06 , C22C2001/1021 , H01L21/4878 , H01L23/373 , H01L23/3733 , H01L23/3736 , H01L2924/0002 , Y10T428/12493 , Y10T428/249957 , Y10T428/249967 , Y10T428/249969 , Y10T428/24997 , Y10T428/30 , Y10T428/31678 , C04B41/0072 , C04B41/4521 , C04B41/5096 , C04B41/5155 , C04B41/5127 , C04B41/515 , C04B41/5116 , C04B41/51 , C04B41/4541 , C04B41/5144 , C04B35/522 , C04B38/00 , H01L2924/00
摘要： A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the thermal expansion coefficient are 250 W/mK or more and less than 4×10−6/K, respectively, in an extrusion direction; and that the thermal conductivity and the thermal expansion coefficient are 150 W/mK or more and 10×10−6 or less, respectively, in a direction perpendicular to the extrusion direction.
摘要翻译：通过用金属浸渍多孔石墨化挤出物获得的具有高热导率和热膨胀系数小的复合材料; 具有各向异性的复合材料分别在挤出方向上的热导率和热膨胀系数分别为250W / mK以上且小于4×10 -6 / K; 并且热导率和热膨胀系数分别在垂直于挤出方向的方向上为150W / mK以上且10×10 -6以下。

96. 发明授权

US07147896B2 Electroless nickel plating method for the preparation of zirconia ceramic 失效
标题翻译：化学镀镍法制备氧化锆陶瓷
公开(公告)号：US07147896B2
公开(公告)日：2006-12-12
申请号：US10836068
申请日：2004-04-30
申请人： Mark D. Rine
发明人： Mark D. Rine
IPC分类号： B05D3/10
CPC分类号： C04B41/5144 , C04B41/009 , C04B41/52 , C04B41/88 , C04B41/90 , C23C18/1653 , C23C18/1893 , C23C18/32 , C25D3/46 , C25D5/40 , C04B41/4541 , C04B41/4564 , C04B41/5116 , C04B35/48
摘要： An electroless nickel plating method for the preparation of zirconia ceramic material. The surface of the zirconia ceramic material is first cleaned of contaminants. This is followed by an etching step where the surface of the material is etched by an acid. Then, activating the surface of the material is achieved by first applying a tin sensitizer, and then a palladium activator. Following the palladium activator step, applying an electroless nickel to the surface of the post activated material. After the electroless nickel bath, the zirconial ceramic material can then be further electroless or electrolytically plated with a variety of finishes. Applying the method of the present invention provides a suitable, commercially practicable method for the preparation of zirconia ceramic material for electroless nickel plating, so that the electroless nickel chemistry is distributed evenly on the material's surface.
摘要翻译：一种用于制备氧化锆陶瓷材料的化学镀镍方法。首先清洁氧化锆陶瓷材料的表面污染物。之后是蚀刻步骤，其中材料的表面被酸蚀刻。然后，通过首先施加锡增感剂，然后钯催化剂来实现材料的表面活化。在钯活化剂步骤之后，将化学镀镍施加到后活化材料的表面。在化学镀镍浴之后，锆石陶瓷材料可以进一步无电解或电镀多种表面处理。应用本发明的方法提供了用于制备用于无电镀镍的氧化锆陶瓷材料的合适的商业上可行的方法，使得化学镀镍化学物质均匀地分布在材料的表面上。

97. 发明申请

US20060121200A1 Electroless plating of piezoelectric ceramic 审中-公开
标题翻译：压电陶瓷化学镀
公开(公告)号：US20060121200A1
公开(公告)日：2006-06-08
申请号：US10998128
申请日：2004-11-29
申请人： Daniel Halpert , Joe Arnold
发明人： Daniel Halpert , Joe Arnold
IPC分类号： B05D3/04 , B05D5/12
CPC分类号： C04B41/5127 , C04B41/009 , C04B41/88 , C04B2111/00844 , C23C18/1605 , G06K9/0002 , H01L41/1132 , H01L41/183 , H01L41/37 , C04B41/4541 , C04B35/491 , C04B35/499
摘要： Methods of electroless plating piezoelectric ceramic with copper metal, include contacting a copper halide salt with an electroless plating solution to form a mixture and contacting the piezoelectric ceramic with the mixture.
摘要翻译：含铜金属的无电镀压电陶瓷的方法包括使卤化铜盐与化学镀溶液接触以形成混合物并使压电陶瓷与混合物接触。

98. 发明申请

US20050203231A1 Polymer ceramic slip and method of manufacturing ceramic green bodies there therefrom 审中-公开
标题翻译：聚合物陶瓷滑移及其制造陶瓷生坯体的方法
公开(公告)号：US20050203231A1
公开(公告)日：2005-09-15
申请号：US10998127
申请日：2004-11-29
申请人： Daniel Halpert , Joe Arnold , Walter Scott
发明人： Daniel Halpert , Joe Arnold , Walter Scott
IPC分类号： B28B1/00 , B28B3/00 , B28B5/00 , C04B20060101 , C04B33/32 , C04B33/36 , C04B35/64 , C04B41/51 , C04B41/88 , C08J3/00 , C08K3/00 , C08K3/10 , C08L63/00 , C08L75/00 , G06K20060101 , G06K9/00 , H01L41/113 , H01L41/18 , H01L41/22
CPC分类号： C04B41/5127 , C04B41/009 , C04B41/88 , C04B2111/00844 , C23C18/1605 , G06K9/0002 , H01L41/1132 , H01L41/183 , H01L41/37 , C04B41/4541 , C04B35/491 , C04B35/499
摘要： A polymer slip for producing a ceramic body is disclosed. The slip includes a polymer, surfactant, dispersant and about 50-70 volume % ceramic powder. The slip can be set in a closed mold. In another embodiment, the present invention relates to a method of manufacturing a green body. The method includes contacting a ceramic powder with a polymer to form a slip mixture, mixing the slip mixture, injecting the slip mixture in a mold and setting the mixture in the mold at a temperature of about 20-40° C. The slip mixture comprises about 50-65 volume % of the ceramic powder.
摘要翻译：公开了一种用于制造陶瓷体的聚合物滑移件。滑动剂包括聚合物，表面活性剂，分散剂和约50-70体积％的陶瓷粉末。滑动可以设置在闭合的模具中。在另一实施例中，本发明涉及一种生坯生产方法。该方法包括使陶瓷粉末与聚合物接触以形成滑爽混合物，混合滑动混合物，将滑动混合物注入模具中，并将混合物在模具中置于约20-40℃的温度下。滑爽混合物包含约50-65体积％的陶瓷粉末。

99. 发明授权

US06660071B2 Electroless copper plating bath, electroless copper plating method and electronic part 失效
公开(公告)号：US06660071B2
公开(公告)日：2003-12-09
申请号：US09880335
申请日：2001-06-13
申请人： Yasushi Yoshida , Tatsuo Kunishi
发明人： Yasushi Yoshida , Tatsuo Kunishi
IPC分类号： C23C1840
CPC分类号： C04B41/009 , C04B41/5127 , C04B2111/00844 , C23C18/38 , C23C18/40 , C04B41/4541 , C04B35/00
摘要： An electroless copper plating bath containing a cupric compound, a cupric ion complexing agent, a reducing agent, and a pH adjusting agent is provided, in which a carboxylic acid is added as a reaction accelerator to accelerate the oxidation reaction of the reducing agent. It does not need to use formaldehyde as the reducing agent yet it has a plating reaction velocity which is equivalent to that of a bath in which formaldehyde is contained as the reducing agent.

100. 发明授权

US06656526B2 Porously coated open-structure substrate and method of manufacture thereof 有权
标题翻译：外涂开口结构基材及其制造方法
公开(公告)号：US06656526B2
公开(公告)日：2003-12-02
申请号：US09956432
申请日：2001-09-20
申请人： Alfred I-Tsung Pan
发明人： Alfred I-Tsung Pan
IPC分类号： B05D302
CPC分类号： C04B41/89 , B22F7/002 , C04B41/009 , C04B41/4582 , C04B41/52 , C04B41/81 , C04B2111/00853 , H01M4/0471 , H01M4/9083 , H01M4/926 , Y10T428/249924 , Y10T428/249953 , C04B41/4539 , C04B41/51 , C04B41/4541 , C04B41/5105 , C04B41/5122 , C04B41/4564 , C04B41/522 , C04B35/00 , C04B35/52 , C04B38/00
摘要： A method for sintering a porous coating on an open-structure substrate, i.e., a substrate with pre-made pores or openings. The open-structure substrate is spread with a coating paste that is prepared with such a viscosity so that the paste will not drip through the pores/openings on the open-structure substrate. The coating paste is then sintered to form a porous layer on the surface of the open-structure substrate. Optionally, the porous coating may be further coated with a catalyst for fuel cell applications.
摘要翻译：一种用于在开放结构的基底上，即具有预制孔或开口的基底上烧结多孔涂层的方法。开放结构基材用涂布糊剂扩散，该涂料浆料以这样的粘度制备，使得糊料不会滴在开放结构基材上的孔/孔中。然后将涂料糊料烧结以在开放结构基材的表面上形成多孔层。任选地，多孔涂层可以进一步涂覆用于燃料电池应用的催化剂。

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