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91. 发明公开

EP1252028A2 TEMPORARY BRIDGE FOR MICRO MACHINED STRUCTURES 有权
标题翻译：用于生产微机械结构
公开(公告)号：EP1252028A2
公开(公告)日：2002-10-30
申请号：EP00966870.8
申请日：2000-09-25
申请人： Input Output, Inc.
发明人： YU, Lianzhong , GOLDBERG, Howard, D. , YU, Duli
IPC分类号： B44C1/22 , G03F7/00 , H01L21/306
CPC分类号： B81C1/00142 , B81B2201/042 , B81B2203/0315 , B81C1/00896 , B81C2203/0118 , B81C2203/036 , G02B26/0816
摘要： A micro machined structure includes one or more temporary bridges for temporarily coupling the micro machined structure to a support structure.

92. 发明公开

EP1180693A1 SENSOR DEVICE AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译： SENSORVORRICHTUNG UND DESSEN HERSTELLUNGSVERFAHREN。
公开(公告)号：EP1180693A1
公开(公告)日：2002-02-20
申请号：EP99961327.6
申请日：1999-12-22
申请人： MITSUBISHI DENKI KABUSHIKI KAISHA
发明人： YASUDA, Naoki, Mitsubishi Denki Kabushiki Kaisha , FUKAMI, Tatsuya, Mitsubishi Denki Kabushiki Kaisha , TAGUCHI, Motohisa, Mitsubishi Denki Kabushiki K. , KAWANO, Yuji, Mitsubishi Denki Kabushiki Kaisha
IPC分类号： G01R33/06
CPC分类号： B81C1/00896 , G01F1/6845 , G01L9/0042 , G01N27/121 , G01P5/12 , G01P15/0802 , G01P15/125 , Y10T428/31663
摘要： The invention provides a sensor element having a sensor substrate and a flat sensor portion supported by the sensor substrate in which the surface of the flat sensing portion is covered with a silicone resin film. The silicone resin film is excellent in step coverage of the flat sensing portion, having low stress applied to the sensing portion, can be formed at low temperature and can prevent the sensing portion from being effected with adverse influence even in the fabrication steps.
摘要翻译：本发明提供一种传感器元件，其具有传感器基板和由传感器基板支撑的平坦传感器部分，其中平面感测部分的表面被硅树脂膜覆盖。有机硅树脂膜在平坦感测部分的阶梯覆盖度优异，对感应部分施加的应力低，可以在低温下形成，并且即使在制造步骤中也可以防止感测部分受到不利影响。

93. 发明公开

EP0655781A3 Integrated circuit processing 失效
标题翻译：集成电路处理
公开(公告)号：EP0655781A3
公开(公告)日：1995-10-25
申请号：EP94112032.1
申请日：1994-08-02
申请人： TEXAS INSTRUMENTS INCORPORATED
发明人： Mignardi, Michael A.
IPC分类号： H01L21/78 , G02B26/08
CPC分类号： B81C1/00896 , B81B2201/0235 , B81B2201/042 , B81C99/004 , G01P2015/0831 , Y10S156/93 , Y10T29/49789 , Y10T29/49794 , Y10T156/11 , Y10T156/19
摘要： A method for processing a wafer containing microelectronic mechanical devices that allows all fabrication and test steps to be performed in wafer form instead of device form. The wafer 20 is mounted in a saw frame 24 on dicing tape 22 and the individual devices 27 separated, typically by sawing, prior to completing device fabrication. The devices are left on the dicing tape during the remaining fabrication steps. Some fabrication steps may require covering the adhesive of the dicing tape with a protective cover 44. After all fabrication steps including the application of a protective overcoat and functional testing are completed, the devices are removed from the dicing tape and packaged.
摘要翻译：一种用于处理含有微电子机械装置的晶片的方法，其允许以晶片形式而不是装置形式来执行所有制造和测试步骤。在完成器件制造之前，晶片20被安装在切割带22上的锯框架24中，并且单个器件27通常通过锯切被分离。在剩余的制造步骤中，器件留在切割带上。一些制造步骤可能需要用保护盖44覆盖切割带的粘合剂。在完成包括施加保护涂层和功能测试的所有制造步骤之后，将器件从切割带移除并包装。

94. 发明公开

KR20180033542A 마이크로전자 매체 센서 어셈블리를 위한 제조 방법 및 마이크로전자 매체 센서 어셈블리 审中-公开
公开(公告)号：KR20180033542A
公开(公告)日：2018-04-03
申请号：KR20187005065
申请日：2016-05-25
IPC分类号： B81C1/00
CPC分类号： B81C1/00896 , B81B2201/0264 , B81C2201/053 , H01L2224/73204
摘要： 본발명은, 마이크로전자부품어셈블리를위한제조방법및 상응하는마이크로전자부품어셈블리에관한것이다. 본발명에따른제조방법은, 제1 표면및 상기제1 표면에마주놓인제2 표면그리고하나이상의측면을갖는센서가제공되는단계를포함하며, 이경우제1 표면이적어도국부적으로검출면을갖는다. 그다음단계에서는, 센서의제1 표면에희생재료가도포되며, 이경우검출면은적어도국부적으로희생재료에의해덮이고, 이희생재료는센서의측면까지연장된다. 또한, 실장면을갖는캐리어가제공된다. 그다음에, 센서가캐리어에전기적으로연결되며, 이때센서의제1 표면과캐리어의실장면이서로간격을두고마주놓인다. 이어서희생재료가제거되는데, 이때검출면에서적어도부분적으로희생재료가제거된다.

95. 发明公开

KR1020120039735A 해방되지 않은 박막 컴포넌트를 구비한 미소 기전 시스템 无效
标题翻译：具有无薄膜组件的MEMS器件
公开(公告)号：KR1020120039735A
公开(公告)日：2012-04-25
申请号：KR1020127004907
申请日：2004-10-28
申请人： 퀄컴 엠이엠에스 테크놀로지스, 인크.
发明人： 마일즈마크더블유.
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81C1/00896
摘要： 일 실시예에서, 본 발명은 미소 기전 시스템(microelectromechanical systems, MEMS) 기기를 제공한다. 미소 기전 시스템 기기는 적어도 하나의 가동 컴포넌트(movable component); 및 상기 미소 기전 시스템 기기를 운송하는 동안에 상기 가동 컴포넌트의 움직임을 적어도 감소시키는 희생 컴포넌트를 포함하는 복수의 기능 컴포넌트를 포함하며, 상기 희생 컴포넌트는 운송한 후에 제거될 수 있다.

96. 发明公开

KR1020100110371A ＭＥＭＳ 소자, ＭＥＭＳ 소자를 제조하는 방법 및 ＭＥＭＳ 소자를 처리하는 방법 有权
标题翻译： MEMS组件，用于生产MEMS组件的方法和用于处理MEMS组件的方法
公开(公告)号：KR1020100110371A
公开(公告)日：2010-10-12
申请号：KR1020107018704
申请日：2009-01-21
申请人： 에프코스 아게
发明人： 팔,울프강 , 페이어택,그레고르 , 레이들,안톤
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81C1/00896 , B81B7/0061 , B81B2201/0257 , B81C2201/053 , H04R2201/003
摘要： 적어도 하나의 캐비티(2)가 존재하는 기판(1)을 포함하는 MEMS 소자가 설명된다. 상기 캐비티(2)는 상기 기판(1)의 능동면에 대해서는 폐쇄된다. 상기 기판(1)의 능동면의 반대면에는 비능동면이 형성되고, 상기 기판(1)은 상기 비능동면 상의 커버링 필름(3)에 의해 커버된다. 또한, MEMS 소자를 제조하는 방법에 설명되며, 상기 방법은 다음 단계들을 포함한다. 제1단계에서, 기판 웨이퍼(1) 상에 캐비티(2)가 생성되고, 상기 캐비티(2)는 능동면에 대해서는 폐쇄되고, 비능동면에 대해서는 개구부를 갖는다. 제2단계에서, 상기 기판 웨이퍼(1)의 비능동면에 커버링 필름(3)이 인가되고, 상기 커버링 필름(3)은 상기 기판 웨이퍼(1) 중 적어도 상기 캐비티들(2) 사이의 기판 웨이퍼(1) 영역에서 기판 웨이퍼(1)에 접착 본딩된다.

97. 发明公开

KR1020100011941A ＭＥＭＳ 장치에서의 쏘 파편 감소 无效
标题翻译： MEMS器件中的SAW减少损耗
公开(公告)号：KR1020100011941A
公开(公告)日：2010-02-03
申请号：KR1020090067605
申请日：2009-07-24
申请人： 허니웰 인터내셔널 인코포레이티드
发明人： 리들리,제프에이. , 글렌,맥스 , 노하바,제임스씨. , 호닝,로버트디. , 렉스태드,제인
IPC分类号： H01L29/00 , H01L21/301
CPC分类号： B81C1/00896 , B81B2207/07 , B81C2203/0118 , B81C2203/019
摘要： PURPOSE: A saw debris reduction method in a MEMS device is provided to improve yield and reliability by reducing or removing particles related to the sawing. CONSTITUTION: One channel(54,58) or more are formed on at least one of a first substrate(40), and a second substrate. At least one of the channels is formed around one MEMS device region(42) on the first substrate. One seal ring(50) or more are applied on at least part of the channels. A second substrate is attached to the seal ring. One channel or more includes a first cross section and a second cross section.
摘要翻译：目的：通过减少或去除与锯切有关的颗粒，提供MEMS装置中的锯屑碎屑减少方法来提高产量和可靠性。构成：在第一基板（40）和第二基板中的至少一个上形成一个通道（54,58）或更多个。至少一个通道围绕第一基板上的一个MEMS器件区域（42）形成。一个密封环（50）或更多的应用在通道的至少一部分上。第二基板附接到密封环。一个或多个通道包括第一横截面和第二横截面。

98. 发明公开

KR1020040105423A 미세 구조물이 형성된 기판과 그 기판의 제조방법 失效
标题翻译：具有微结构的衬底，用于通过形成两个衬底之间的空气间隙及其制造方法来减少应力
公开(公告)号：KR1020040105423A
公开(公告)日：2004-12-16
申请号：KR1020030036796
申请日：2003-06-09
申请人： 한국전자통신연구원
发明人： 윤선진 , 임정욱 , 이진호
IPC分类号： H01L21/31
CPC分类号： H01L21/6835 , B81C1/00896 , H01L21/4803 , H01L21/4814 , H01L2221/68318 , H01L2221/68345
摘要： PURPOSE: A substrate having a micro structure and a fabricating method thereof are provided to reduce effectively stress in a semiconductor fabrication process by forming an air gap between a top substrate and a bottom substrate. CONSTITUTION: A bottom substrate(11) is used for supporting a top substrate(13) on which a device is formed during a device fabrication process. The bottom substrate is separated from the top substrate after the device fabrication process. A buffer layer(14) is patterned to include a plurality of forming layers for forming air gaps in a predetermined interval on an upper surface of the bottom substrate. An adhesion layer(12) is used for adhering the top substrate to the buffer layer.
摘要翻译：目的：提供具有微结构的基板及其制造方法，以通过在顶部基板和底部基板之间形成气隙来有效地减少半导体制造工艺中的应力。构成：在器件制造过程中，底部衬底（11）用于支撑其上形成器件的顶部衬底（13）。在器件制造过程之后，底部衬底与顶部衬底分离。缓冲层（14）被图案化以包括用于在底部衬底的上表面上以预定间隔形成气隙的多个形成层。使用粘合层（12）将顶部基板粘附到缓冲层。

99. 发明公开

KR1020040004769A 마이크로 전기 기계 구조 칩의 다이싱 방법 失效
标题翻译：微电子机械系统芯片的定位方法
公开(公告)号：KR1020040004769A
公开(公告)日：2004-01-16
申请号：KR1020020038792
申请日：2002-07-05
申请人： 삼성전기주식회사
发明人： 이현기 , 정성천 , 강준석 , 윤상기
IPC分类号： H01L21/78
CPC分类号： B81C1/00888 , B81C1/00896 , B81C2201/053
摘要： PURPOSE: A dicing method of an MEMS(Micro Electro-Mechanical Systems) chip is provided to be capable of improving yield and productivity by preventing the damage of a micro structure using photoresist or filling material under a dicing process. CONSTITUTION: After discharging liquid photoresist on a wafer(1) having a micro structure(3), a photoresist coating process is carried out on the entire surface of the wafer by using a spin coater. A predetermined heat treatment is carried out at the resultant structure for removing the moisture of the photoresist. Then, a dicing process is carried out at the resultant structure. The photoresist is removed from the resultant structure. At this time, the photoresist is used as the protecting material for the micro structure. Preferably, a multi-step heat treatment is used as the predetermined heat treatment.
摘要翻译：目的：提供一种MEMS（微机电系统）芯片的切割方法，其能够通过防止在切割工艺下使用光致抗蚀剂或填充材料的微结构的损坏来提高产量和生产率。构成：在具有微结构（3）的晶片（1）上排出液体光致抗蚀剂之后，通过使用旋转涂布机在晶片的整个表面上进行光致抗蚀剂涂覆处理。在所得到的结构中进行预定的热处理以除去光致抗蚀剂的水分。然后，在所得结构下进行切割处理。从所得结构中除去光致抗蚀剂。此时，光致抗蚀剂用作微结构的保护材料。优选地，使用多步热处理作为预定的热处理。

100. 发明公开

KR1020080082481A 미세 가공물의 제조 방법 및 레이저 가공 장치 无效
标题翻译：制造工件和激光加工设备的方法
公开(公告)号：KR1020080082481A
公开(公告)日：2008-09-11
申请号：KR1020080020543
申请日：2008-03-05
申请人： 후지쯔 가부시끼가이샤
发明人： 도쿠라후미히코
IPC分类号： B23C1/08 , B23K26/38 , B23K26/00
CPC分类号： B23K26/38 , B81C1/00484 , B81C1/00896
摘要： A method for fabricating a workpiece and a laser processing apparatus are provided to prevent a workpiece from being broken by using a laser beam which does not apply an impact to the workpiece. A method for fabricating a workpiece comprises the steps of irradiating a laser beam onto a workpiece(22) to increase the temperature of the workpiece so that at least a part of the workpiece is melt, and maintaining a state, in which the part of the workpiece is melt, until at least a part of the workpiece is separated. The laser beam includes a continuous wave or a pseudo continuous wave. The laser beam includes a pulse wave having a pulse width of 1millisecond or more, and irradiation time of the laser beam is less than the pulse width. While the laser beam is irradiated, temperature is continuously increased until an object to be processed is cut.
摘要翻译：提供了一种用于制造工件的方法和激光加工装置，以通过使用不对工件施加冲击的激光束来防止工件被破坏。一种用于制造工件的方法包括以下步骤：将激光束照射到工件（22）上以增加工件的温度，使得工件的至少一部分熔化，并保持其状态工件熔化，直到工件的至少一部分被分离。激光束包括连续波或伪连续波。激光束包括脉冲宽度为1毫秒以上的脉波，激光束的照射时间小于脉冲宽度。在照射激光束的同时，持续增加温度，直到切割被处理物体为止。

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