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91. 发明授权

US08621925B2 Device and method for producing a device 有权
标题翻译：用于生产设备的设备和方法
公开(公告)号：US08621925B2
公开(公告)日：2014-01-07
申请号：US12998800
申请日：2009-10-30
申请人： Volker Dietrich , Martin Schuerer
发明人： Volker Dietrich , Martin Schuerer
IPC分类号： G01D11/24 , G01L19/14
CPC分类号： B29C45/14467 , B29C45/14639 , B81B2201/0264 , B81B2207/098 , B81C1/00325 , B81C2203/0154 , G01L19/141
摘要： A sensor device has a structural element, a carrier element and a housing, the structural element being situated on the carrier element, and the structural element and the carrier element being situated at least partially within the housing. The sensor device also has an intermediate housing, which is situated essentially between the housing and the structural element, the intermediate housing including a premold housing.
摘要翻译：传感器装置具有结构元件，载体元件和壳体，结构元件位于载体元件上，并且结构元件和载体元件至少部分地位于壳体内。传感器装置还具有中间壳体，其基本上位于壳体和结构元件之间，中间壳体包括预制壳体。

92. 发明授权

US08618425B2 Sensor module having an electromagnetically shielded electrical component 有权
标题翻译：传感器模块具有电磁屏蔽电气部件
公开(公告)号：US08618425B2
公开(公告)日：2013-12-31
申请号：US13195543
申请日：2011-08-01
申请人： Michael Hortig , Peter Kunert
发明人： Michael Hortig , Peter Kunert
IPC分类号： H05K9/00 , H05K13/04
CPC分类号： B81B7/0064 , B81B2201/0235 , B81B2207/098 , H01L2924/0002 , Y10T29/49117 , H01L2924/00
摘要： In a module having an electrical component, which is situated between two ground planes for electromagnetic shielding, a trough-shaped composite component is provided between an inner and an outer housing, into which the rear side of the inner housing is inserted, the composite component having an insulator trough and, on its inside, a ground plane formed at least on the trough bottom, which forms the shielding of a rear side of the electrical component. The composite component is advantageously designed as an MID component. The outer housing of the module may be manufactured in the two-component injection molding process by extrusion-coating initially using an elastomer and subsequently a thermoplast.
摘要翻译：在具有位于两个用于电磁屏蔽的接地平面之间的电气部件的模块中，在内壳体的后侧插入的内壳体和外壳体之间设置槽状复合部件，复合部件具有绝缘体槽，并且在其内部具有至少形成在槽底部上的接地平面，其形成电气部件的后侧的屏蔽。复合部件有利地被设计为MID部件。模块的外壳可以通过首先使用弹性体和随后的热塑性塑料挤出涂布在双组分注射成型工艺中制造。

93. 发明授权

US08399940B2 Package structure having MEMS elements and fabrication method thereof 有权
标题翻译：具有MEMS元件的封装结构及其制造方法
公开(公告)号：US08399940B2
公开(公告)日：2013-03-19
申请号：US13242720
申请日：2011-09-23
申请人： Chen-Han Lin , Hong-Da Chang , Hsin-Yi Liao , Shih-Kuang Chiu
发明人： Chen-Han Lin , Hong-Da Chang , Hsin-Yi Liao , Shih-Kuang Chiu
IPC分类号： H01L29/84
CPC分类号： B81B7/007 , B81B2207/098 , B81C2203/054 , H01L2224/48091 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.
摘要翻译：具有MEMS元件的封装结构包括：具有MEMS元件，电触点和第二对准键的晶片; 设置在MEMS元件上并被气密封装的板; 通过粘合剂设置在第二对准键上方的透明体; 设置在晶片上以封装所述板，所述电触点和所述透明体的密封剂; 嵌入密封剂中的接合线，每个具有一端连接相应的一个电触点，另一端从该密封剂的顶表面露出; 以及设置在密封剂上并通过接合线电连接到电触头的金属迹线。本发明消除了如现有技术中在硅衬底中形成通孔的需要，以便降低制造成本。此外，本发明通过使用公共对准装置实现布线处理，从而降低设备成本。

94. 发明申请

US20130050226A1 DIE-CUT THROUGH-GLASS VIA AND METHODS FOR FORMING SAME 审中-公开
标题翻译：通过玻璃切割和形成它们的方法
公开(公告)号：US20130050226A1
公开(公告)日：2013-02-28
申请号：US13221677
申请日：2011-08-30
申请人： Ravindra Vaman Shenoy , David William Burns , Kurt Edward Petersen
发明人： Ravindra Vaman Shenoy , David William Burns , Kurt Edward Petersen
IPC分类号： G06T1/00 , H05K7/00 , B05D5/12 , C23F1/00 , B32B37/14 , B32B38/10 , B05D3/12 , H05K1/00 , B05D3/10
CPC分类号： B81B7/007 , B81B2207/095 , B81B2207/097 , B81B2207/098 , B81C2203/0792 , H01L23/15 , H01L23/49827 , H01L2924/0002 , Y10T156/1052 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for providing electrical connections through glass substrates. In one aspect, a through-glass via including a peripheral through-glass via hole and sidewall metallization is provided. Sidewall metallization can include multiple conductive lines facilitating increased interconnect density. In another aspect, one or more methods of forming peripheral through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a through-glass via hole, followed by sidewall metallization and dicing through the through-glass via hole.
摘要翻译：本公开提供了通过玻璃基板提供电连接的系统，方法和装置。在一个方面，提供了一种包括周边透玻璃通孔和侧壁金属化的透玻璃通孔。侧壁金属化可以包括促进增加的互连密度的多条导线。在另一方面，提供了一种或多种形成外围玻璃通孔的方法。在一些实施方式中，所述方法包括双面工艺以在玻璃基板中形成对准的通孔，所述对准的通孔一起形成贯穿玻璃通孔，随后侧壁金属化和通过玻璃通孔进行切割。

95. 发明申请

US20110290016A1 Device and method for producing a device 有权
标题翻译：用于生产设备的设备和方法
公开(公告)号：US20110290016A1
公开(公告)日：2011-12-01
申请号：US12998800
申请日：2009-10-30
申请人： Volker Dietrich , Martin Schuerer
发明人： Volker Dietrich , Martin Schuerer
IPC分类号： G01D11/24 , B29C45/14
CPC分类号： B29C45/14467 , B29C45/14639 , B81B2201/0264 , B81B2207/098 , B81C1/00325 , B81C2203/0154 , G01L19/141
摘要： A sensor device has a structural element, a carrier element and a housing, the structural element being situated on the carrier element, and the structural element and the carrier element being situated at least partially within the housing. The sensor device also has an intermediate housing, which is situated essentially between the housing and the structural element, the intermediate housing including a premold housing.
摘要翻译：传感器装置具有结构元件，载体元件和壳体，结构元件位于载体元件上，并且结构元件和载体元件至少部分地位于壳体内。传感器装置还具有中间壳体，其基本上位于壳体和结构元件之间，中间壳体包括预制壳体。

96. 发明授权

US07763975B2 Flip-chip assembly of protected micromechanical devices 有权
标题翻译：保护微机械装置的倒装芯片组装
公开(公告)号：US07763975B2
公开(公告)日：2010-07-27
申请号：US11963585
申请日：2007-12-21
申请人： Sunil Thomas
发明人： Sunil Thomas
IPC分类号： H01L23/48
CPC分类号： B81B7/0077 , A43B3/0026 , B81B2201/042 , B81B2207/012 , B81B2207/098 , B81C1/00301 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2924/00014 , H01L2924/01322 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2224/05599
摘要： A low-cost ceramic package, in land-grid array or ball-grid array configuration, for micromechanical components is fabricated by coating the whole integrated circuits wafer with a protective material, selectively etching the coating for solder ball attachment, singulating the chips, flip-chip assembling a chip onto the opening of a ceramic substrate, under filling the gaps between the solder joints with a polymeric encapsulant, removing the protective material form the components, and attaching a lid to the substrate for sealing the package. It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase.
摘要翻译：通过用保护材料涂覆整个集成电路晶片来制造用于微机电部件的陆地电网阵列或球栅阵列配置的低成本陶瓷封装，选择性地蚀刻用于焊球附着的涂层，切割芯片，翻转将芯片组装在陶瓷基板的开口上，用聚合物密封剂填充焊点之间的间隙，从组件中移除保护材料，并将盖子附接到基板上以密封封装。本发明的一个方面可应用于各种不同的半导体微机械装置，例如致动器，马达，传感器，空间光调制器和可变形反射镜装置。在所有应用中，本发明实现了技术优点以及显着的成本降低和产量增加。

97. 发明申请

US20100112758A1 CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS 审中-公开
标题翻译：使用压缩薄膜连接微型器件
公开(公告)号：US20100112758A1
公开(公告)日：2010-05-06
申请号：US12635747
申请日：2009-12-11
申请人： M. Zaki Ali , A. Peter Stolt , Gilbert A. Hawkins , Thomas M. Stephany
发明人： M. Zaki Ali , A. Peter Stolt , Gilbert A. Hawkins , Thomas M. Stephany
IPC分类号： H01L21/50
CPC分类号： H01L23/48 , B81B2207/098 , B81C1/00301 , H01L21/4864 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L2224/1131 , H01L2224/24226 , H01L2224/244 , H01L2224/24992 , H01L2224/27013 , H01L2224/73217 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/838 , H01L2224/92144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0781 , H01L2924/12041 , H01L2924/1306 , H05K3/0032 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/321 , H05K2201/09472 , H05K2201/10674 , H05K2203/013 , H05K2203/0568 , H05K2203/1469 , Y10S438/94 , H01L2924/00 , H01L2224/0401
摘要： A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
摘要翻译：提供与微型化装置的连通性的方法，该方法包括以下步骤：提供具有至少顶表面的烧蚀性基材; 提供具有第一和第二表面的模具，并且至少在所述第一表面上具有焊盘; 使所述模具与所述模具的所述至少第一表面接触所述可烧蚀基材的所述至少第一表面; 并且在靠近模具的烧蚀材料中烧蚀通道。

98. 发明申请

US20100109168A1 CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS 审中-公开
公开(公告)号：US20100109168A1
公开(公告)日：2010-05-06
申请号：US12635750
申请日：2009-12-11
申请人： M. Zaki Ali , A. Peter Stolt , Gilbert A. Hawkins , Thomas M. Stephany
发明人： M. Zaki Ali , A. Peter Stolt , Gilbert A. Hawkins , Thomas M. Stephany
IPC分类号： H01L23/485
CPC分类号： H01L23/48 , B81B2207/098 , B81C1/00301 , H01L21/4864 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L2224/1131 , H01L2224/24226 , H01L2224/244 , H01L2224/24992 , H01L2224/27013 , H01L2224/73217 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/838 , H01L2224/92144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0781 , H01L2924/12041 , H01L2924/1306 , H05K3/0032 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/321 , H05K2201/09472 , H05K2201/10674 , H05K2203/013 , H05K2203/0568 , H05K2203/1469 , Y10S438/94 , H01L2924/00 , H01L2224/0401
摘要： A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.

99. 发明申请

US20100072562A1 FUNCTIONAL ELEMENT PACKAGE AND FABRICATION METHOD THEREFOR 失效
标题翻译：功能元件包装及其制造方法
公开(公告)号：US20100072562A1
公开(公告)日：2010-03-25
申请号：US12531552
申请日：2008-03-17
申请人： Yukito Sato , Joerg Froemel
发明人： Yukito Sato , Joerg Froemel
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： B81C1/00301 , B81B2207/095 , B81B2207/097 , B81B2207/098 , B81C2203/019 , H01L23/04 , H01L23/10 , H01L2224/48091 , H01L2924/01079 , H01L2924/1461 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A functional element package includes a silicon substrate with a functional element having one of a mobile portion and a sensor thereon; a seal member being bonded with the silicon substrate to form an airtightly sealed space therein, and including a step portion in its height direction; a first wiring portion being connected with the functional element and extending from the airtightly sealed space to an outside thereof; a second wiring portion being different from the first wiring portion and extending from the step portion to an upper surface of the seal member; and a bump on the second wiring portion, in which the first wiring portion is bent towards the airtightly sealed space and connected via a photoconductive member with the second wiring portion on the step portion.
摘要翻译：功能元件封装包括具有功能元件的硅衬底，功能元件具有可移动部分和传感器之一; 密封构件与硅衬底结合以在其中形成气密密封的空间，并且在其高度方向上包括台阶部分; 第一布线部分与功能元件连接并从气密密封的空间延伸到其外部; 第二布线部分，其不同于第一布线部分并且从台阶部分延伸到密封构件的上表面; 以及第二布线部分上的凸起，其中第一布线部分朝向气密密封的空间弯曲并且经由感光体与台阶部分上的第二布线部分连接。

100. 发明授权

US11975961B2 MEMS package with shock and vibration protection 有权
公开(公告)号：US11975961B2
公开(公告)日：2024-05-07
申请号：US16945265
申请日：2020-07-31
申请人： Beijing Voyager Technology Co., Ltd.
发明人： Youmin Wang , Anan Pan , Henghui Jiang
IPC分类号： B81B7/00 , B81C1/00 , G01S7/481 , G01S7/483 , G01S17/10
CPC分类号： B81B7/0058 , B81B7/0067 , B81C1/00317 , G01S7/4811 , G01S7/483 , G01S17/10 , B81B2201/042 , B81B2207/098
摘要： An optical micro-electromechanical system (MEMS) system is disclosed. The optical MEMS system includes a printed circuit board (PCB), and a MEMS optical integrated circuit (IC) package mounted to the PCB. The IC package includes a MEMS optical die, and a plurality of leads electrically and mechanically connected to the MEMS optical die and to the PCB. The optical MEMS system also includes one or more elastomeric grommets contacting one or more of the leads, where the grommets are configured to absorb mechanical vibration energy from the contacted leads.

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