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91. 发明授权

US07909469B2 Image projecting apparatus and image projecting method for use in the same 有权
标题翻译：图像投影装置和图像投影方法
公开(公告)号：US07909469B2
公开(公告)日：2011-03-22
申请号：US12080904
申请日：2008-04-07
申请人： Izushi Kobayashi , Yutaka Sugawara , Akihiro Kojima , Akira Nakamura , Katsuhisa Ito
发明人： Izushi Kobayashi , Yutaka Sugawara , Akihiro Kojima , Akira Nakamura , Katsuhisa Ito
IPC分类号： G03B21/28 , G02B26/08
CPC分类号： G02B26/12 , G03B21/28
摘要： Disclosed herein is an image projecting apparatus, including: a one-dimension type light modulating device for modulating a light in accordance with image information; a projection optical system; and a light deflecting device for deflecting an image light in a direction approximately perpendicular to an extension direction of a one-dimensional image light emitted from the one-dimensional light modulating device; wherein the light deflecting device is composed of a first light deflecting device arranged between the projection optical system and the one-dimension type light modulating device, and a second light deflecting device arranged on an emission side of the projection optical system; the second light deflecting device is detachably mounted.
摘要翻译：这里公开了一种图像投影装置，包括：一维型光调制装置，用于根据图像信息调制光; 投影光学系统; 以及光偏转装置，用于使图像光沿与所述一维光调制装置发射的一维图像光的延伸方向大致垂直的方向偏转; 其中所述光偏转装置由布置在所述投影光学系统和所述一维型光调制装置之间的第一光偏转装置和布置在所述投影光学系统的发射侧的第二光偏转装置构成; 第二光偏转装置可拆卸地安装。

92. 发明申请

US20110027921A1 METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：制造半导体发光器件的方法
公开(公告)号：US20110027921A1
公开(公告)日：2011-02-03
申请号：US12797711
申请日：2010-06-10
申请人： Hiroshi Hamasaki , Akihiro Kojima , Yoshiaki Sugizaki
发明人： Hiroshi Hamasaki , Akihiro Kojima , Yoshiaki Sugizaki
IPC分类号： H01L21/56
CPC分类号： H01L33/62 , H01L33/0008 , H01L33/0016 , H01L33/0095 , H01L33/36 , H01L33/387 , H01L33/56 , H01L2933/0016 , H01L2933/005 , H01L2933/0066 , Y10S438/94
摘要： According to one embodiment, a method for manufacturing a semiconductor light emitting device includes forming a separation groove on a major surface of a substrate. A semiconductor layer including a light emitting layer is formed on the substrate. The separation groove separates the semiconductor layer into a plurality of elements. The method includes forming an insulating film on the major surface of the substrate. The insulating film covers the semiconductor layer and a bottom surface of the separation groove provided on the substrate. The method includes separating the substrate from the semiconductor layer by irradiating the semiconductor layer with laser light from an surface of the substrate opposite to the major surface. An edge portion of irradiation area of the laser light is positioned near an edge portion of the semiconductor layer neighboring the separation groove.
摘要翻译：根据一个实施例，一种用于制造半导体发光器件的方法包括在衬底的主表面上形成分隔槽。在基板上形成包括发光层的半导体层。分离槽将半导体层分离成多个元件。该方法包括在基板的主表面上形成绝缘膜。绝缘膜覆盖半导体层和设置在基板上的分离槽的底面。该方法包括通过从与主表面相反的表面的激光照射半导体层来从半导体层分离衬底。激光的照射区域的边缘部分位于与分离槽相邻的半导体层的边缘部分附近。

93. 发明申请

US20080284988A1 Image projecting apparatus and image projecting method for use in the same 有权
标题翻译：图像投影装置和图像投影方法
公开(公告)号：US20080284988A1
公开(公告)日：2008-11-20
申请号：US12080904
申请日：2008-04-07
申请人： Izushi Kobayashi , Yutaka Sugawara , Akihiro Kojima , Akira Nakamura , Katsuhisa Ito
发明人： Izushi Kobayashi , Yutaka Sugawara , Akihiro Kojima , Akira Nakamura , Katsuhisa Ito
IPC分类号： G03B21/28 , G02B26/08
CPC分类号： G02B26/12 , G03B21/28
摘要： Disclosed herein is an image projecting apparatus, including: a one-dimension type light modulating device for modulating a light in accordance with image information; a projection optical system; and a light deflecting device for deflecting an image light in a direction approximately perpendicular to an extension direction of a one-dimensional image light emitted from the one-dimensional light modulating device; wherein the light deflecting device is composed of a first light deflecting device arranged between the projection optical system and the one-dimension type light modulating device, and a second light deflecting device arranged on an emission side of the projection optical system; the second light deflecting device is detachably mounted.
摘要翻译：这里公开了一种图像投影装置，包括：一维型光调制装置，用于根据图像信息调制光; 投影光学系统; 以及光偏转装置，用于使图像光沿与所述一维光调制装置发射的一维图像光的延伸方向大致垂直的方向偏转; 其中所述光偏转装置由布置在所述投影光学系统和所述一维型光调制装置之间的第一光偏转装置和布置在所述投影光学系统的发射侧的第二光偏转装置构成; 第二光偏转装置可拆卸地安装。

94. 发明授权

US07144117B2 Projection type image display apparatus 失效
标题翻译：投影型图像显示装置
公开(公告)号：US07144117B2
公开(公告)日：2006-12-05
申请号：US10943860
申请日：2004-09-20
申请人： Akihiro Kojima
发明人： Akihiro Kojima
IPC分类号： G03B21/26 , G03B21/28 , G03B21/00 , G09G5/00
CPC分类号： H04N9/3129
摘要： A projection type image display apparatus including a scanning mirror and a projection lens adapted to project an image on an image-displaying screen by scanning with a laser beam, and a detector adapted to detect the presence or absence of an intruding object between the projection means and the screen, wherein detection by the detector is conducted relative to a position preceding the laser beam in the scan direction of the laser beam.
摘要翻译：一种投影型图像显示装置，包括扫描镜和投影透镜，其适于通过用激光束扫描在图像显示屏上投影图像;以及检测器，适于检测投影物体之间是否存在入射物体以及屏幕，其中由激光束的扫描方向相对于激光束之前的位置进行检测器的检测。

95. 发明申请

US20060216920A1 Method for fabricating semiconductor device and semiconductor device 有权
公开(公告)号：US20060216920A1
公开(公告)日：2006-09-28
申请号：US11346310
申请日：2006-02-03
申请人： Akihiro Kojima
发明人： Akihiro Kojima
IPC分类号： H01L21/4763
CPC分类号： H01L21/7682 , H01L21/76831 , H01L21/76832 , H01L21/76849 , H01L2924/0002 , H01L2924/00
摘要： A method of fabricating a semiconductor device having an air-gapped multilayer interconnect wiring structure is disclosed. After having formed a first thin film on or above a substrate, define a first opening in the first thin film. Then, deposit a conductive material in the first opening. Then form a second thin film made of a porous material above the first thin film with the conductive material being deposited in the first opening. Next, define in the second thin film a second opening extending therethrough, followed by deposition of a conductive material in the second opening. The first thin film is removed through voids in the second thin film after having deposited the conductive material in the second opening. An integrated semiconductor device as manufactured thereby is also disclosed.

96. 发明授权

US5797604A Metal gasket 失效
标题翻译：金属垫片
公开(公告)号：US5797604A
公开(公告)日：1998-08-25
申请号：US764879
申请日：1996-12-16
申请人： Toshiyasu Inagaki , Yoshinori Morooka , Akihiro Kojima
发明人： Toshiyasu Inagaki , Yoshinori Morooka , Akihiro Kojima
IPC分类号： F16L19/00 , F16J15/08
CPC分类号： F16J15/0893 , F16J15/0887
摘要： A metal gasket excellent in sealing performance and capable of sealing with a small pressing force. The metal gasket comprises at least one metal sheath with a C-shaped cross-section and a ring elastic core surrounded by the metal sheath. The metal gasket provides a seal upon exertion of a force in the axis center direction. The metal sheath has a locally thin cross-section over the whole annular length, and when the metal sheath subject to a force and deformed, the deflection in the axis direction of the metal sheath due to concentrated stress on the thin worked portion causes the formation projections at both sides of the deflection which projections are pressed onto the sealing face to form air-tight seals.
摘要翻译：密封性能优良，能够以小的按压力密封的金属密封垫。金属垫片包括至少一个具有C形横截面的金属护套和由金属护套包围的环形弹性芯。金属垫片在轴心方向上施加力时提供密封。金属护套在整个环形长度上具有局部薄的横截面，并且当金属护套受到力并变形时，由于在薄加工部分上的集中应力，金属护套的轴向方向上的偏转导致形成在突出部的两侧突出部被压在密封面上以形成气密密封。

97. 发明授权

US09021983B2 Stage apparatus and process apparatus 有权
标题翻译：舞台装置和处理装置
公开(公告)号：US09021983B2
公开(公告)日：2015-05-05
申请号：US13428530
申请日：2012-03-23
申请人： Ryoichi Inanami , Shinichi Ito , Hiroshi Koizumi , Akihiro Kojima
发明人： Ryoichi Inanami , Shinichi Ito , Hiroshi Koizumi , Akihiro Kojima
IPC分类号： B05C11/00 , C23C16/00 , H01L21/76 , H01L21/687 , H01L21/67 , H01L21/683
CPC分类号： H01L21/6875 , H01L21/6715 , H01L21/67288 , H01L21/6833 , H01L21/6838 , Y10T29/41
摘要： According to one embodiment, a stage apparatus includes a height control unit includes height control elements each which is drove in an upward/downward direction independently, a measuring unit which divides an upper surface of the substrate into areas, and measures a height of each of the areas. The control unit is configured to set the height of each of the areas independently by controlling a height of each of the height control elements based on a data value, determine using the measuring unit whether the height of each of the areas in the upper surface of the substrate is in a allowable range, and set the height of the area out of the allowable range again by the height control elements.
摘要翻译：根据一个实施例，舞台装置包括高度控制单元，包括各自独立地向上/向下驱动的高度控制元件，测量单元，其将衬底的上表面划分为区域，并且测量每个的高度地区。控制单元被配置为通过基于数据值来控制每个高度控制元件的高度来独立地设置每个区域的高度，使用测量单元确定上表面中的每个区域的高度基板处于允许范围内，并且通过高度控制元件再次将该区域的高度设定在允许范围之外。

98. 发明授权

US08587038B2 Electric component and method of manufacturing the electric component 有权
标题翻译：电气部件的制造方法和电气部件的制造方法
公开(公告)号：US08587038B2
公开(公告)日：2013-11-19
申请号：US12841286
申请日：2010-07-22
申请人： Akihiro Kojima
发明人： Akihiro Kojima
IPC分类号： H01L29/84
CPC分类号： H01L21/76816 , B81B2207/015 , B81C1/00246 , B81C2203/0735 , H01L2224/11
摘要： According to one embodiment, an electric component includes: a first insulating layer formed on a first wire; a second wire and a functional element formed on the first insulating layer; a second insulating layer formed on the first insulating layer; and a connection wire that connects the second wire and the first wire. In the connection wire, a first via, a second via, and an inter-via wire are integrally formed of the same material. The first via is formed in the second insulating layer. The second via is formed in the first and second insulating layers.
摘要翻译：根据一个实施例，电气部件包括：形成在第一线上的第一绝缘层; 形成在第一绝缘层上的第二线和功能元件; 形成在所述第一绝缘层上的第二绝缘层; 以及连接第二线和第一线的连接线。在连接线中，第一通孔，第二通孔和通孔间导线由相同的材料一体地形成。第一通孔形成在第二绝缘层中。第二通孔形成在第一和第二绝缘层中。

99. 发明申请

US20130285091A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20130285091A1
公开(公告)日：2013-10-31
申请号：US13599892
申请日：2012-08-30
申请人： Yosuke Akimoto , Miyoko Shimada , Akihiro Kojima , Hideyuki Tomizawa , Yoshiaki Sugizaki , Hideto Furuyama
发明人： Yosuke Akimoto , Miyoko Shimada , Akihiro Kojima , Hideyuki Tomizawa , Yoshiaki Sugizaki , Hideto Furuyama
IPC分类号： H01L33/50
CPC分类号： H01L33/44 , H01L33/005 , H01L33/0079 , H01L33/46 , H01L33/505 , H01L2933/0016
摘要： According to an embodiment, a method for manufacturing a semiconductor light emitting device includes steps for forming a fluorescent substance layer on a first face of a semiconductor layer and forming a light shielding film on the side face of the fluorescent substance layer. The fluorescent substance layer includes a resin and fluorescent substances dispersed in the resin, and have a light emitting face on a side opposite to the first face of the semiconductor layer and a side face connecting to the light emitting face with an angle of 90 degree or more between the light emitting face and the side face. The light shielding film shields a light emitted from a light emitting layer included in the semiconductor layer and a light radiated from the fluorescent substances.
摘要翻译：根据实施例，半导体发光器件的制造方法包括在半导体层的第一面上形成荧光体层并在荧光物质层的侧面形成遮光膜的工序。荧光物质层包括分散在树脂中的树脂和荧光物质，并且在与半导体层的第一面相反的一侧具有发光面，以及以90度的角连接到发光面的侧面，更多地在发光面和侧面之间。遮光膜屏蔽从半导体层中包含的发光层发射的光和从荧光物质辐射的光。

100. 发明申请

US20130170669A1 STRAIN AND PRESSURE SENSING DEVICE, MICROPHONE, METHOD FOR MANUFACTURING STRAIN AND PRESSURE SENSING DEVICE, AND METHOD FOR MANUFACTURING MICROPHONE 有权
公开(公告)号：US20130170669A1
公开(公告)日：2013-07-04
申请号：US13536002
申请日：2012-06-28
申请人： Hideaki FUKUZAWA , Tatsuya Ohguro , Akihiro Kojima , Yoshiaki Sugizaki , Mariko Takayanagi , Yoshihiko Fuji , Akio Hori , Michiko Hara
发明人： Hideaki FUKUZAWA , Tatsuya Ohguro , Akihiro Kojima , Yoshiaki Sugizaki , Mariko Takayanagi , Yoshihiko Fuji , Akio Hori , Michiko Hara
IPC分类号： G01L9/00 , B81C1/00 , H04R1/08
CPC分类号： B81C1/00158 , B81B2201/0264 , B81C1/00246 , B81C2203/0771 , G01L9/0042 , H04R1/08 , H04R19/005 , H04R19/04 , H04R31/00
摘要： According to one embodiment, a strain and pressure sensing device includes a semiconductor circuit unit and a sensing unit. The semiconductor circuit unit includes a semiconductor substrate and a transistor. The transistor is provided on a semiconductor substrate. The sensing unit is provided on the semiconductor circuit unit, and has space and non-space portions. The non-space portion is juxtaposed with the space portion. The sensing unit further includes a movable beam, a strain sensing element unit, and first and second buried interconnects. The movable beam has fixed and movable portions, and includes first and second interconnect layers. The fixed portion is fixed to the non-space portion. The movable portion is separated from the transistor and extends from the fixed portion into the space portion. The strain sensing element unit is fixed to the movable portion. The first and second buried interconnects are provided in the non-space portion.

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