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    • 96. 发明授权
    • Apparatus for measuring a three-dimensional shape
    • 用于测量三维形状的装置
    • US07166839B2
    • 2007-01-23
    • US11320752
    • 2005-12-30
    • Maki TanakaChie ShishidoYuji Takagi
    • Maki TanakaChie ShishidoYuji Takagi
    • G21K7/00
    • G01N23/225G01N23/2251H01J37/244H01J37/3171H01J2237/2814H01L21/32137H01L22/10H01L2924/0002H01L2924/00
    • Conventionally, there is no method for quantitatively evaluating the three-dimensional shape of an etched pattern in a non-destructive manner and it takes much time and costs to determine etching conditions. With the conventional length measuring method only, it has been impossible to detect an abnormality in the three-dimensional shape and also difficult to control the etching process. According to the present invention, variations in signal amounts of an SEM image are utilized to compute three-dimensional shape data on the pattern associated with the etching process steps, whereby the three-dimensional shape is quantitatively evaluated. Besides, determination of etching process conditions and process control are performed based on the three-dimensional shape data obtained. The present invention makes it is possible to quantitatively evaluate the three-dimensional shape of the etched pattern in a non-destructive manner. Further, the efficiency of determining the etching process conditions and a stable etching process can be realized.
    • 通常,没有以非破坏性的方式定量地评价蚀刻图案的三维形状的方法,并且确定蚀刻条件需要花费大量时间和成本。 仅使用常规的长度测量方法,就不可能检测到三维形状的异常,并且也难以控制蚀刻工艺。 根据本发明,利用SEM图像的信号量的变化来计算与蚀刻工艺步骤相关联的图案上的三维形状数据,从而定量评估三维形状。 此外,基于获得的三维形状数据进行蚀刻工艺条件和工艺控制的确定。 本发明能够以非破坏性的方式对蚀刻图案的三维形状进行定量评价。 此外,可以实现确定蚀刻工艺条件的效率和稳定的蚀刻工艺。
    • 99. 发明授权
    • Transmission electron microscope system and method of inspecting a specimen using the same
    • 透射电子显微镜系统及使用其的检查方法
    • US07034299B2
    • 2006-04-25
    • US10918340
    • 2004-08-16
    • Ryo NakagakiYuji TakagiHirohito OkudaHiroshi Kakibayashi
    • Ryo NakagakiYuji TakagiHirohito OkudaHiroshi Kakibayashi
    • H01J37/26G01N23/04
    • H01J37/222G01N23/04G06T7/0012H01J2237/26
    • It is possible to reliably and efficiently determine whether a specimen contains viruses, bacteria, etc. and, if it does, identify their types, regardless of the observer. Furthermore, even a newly-discovered bacterium can be quickly identified by utilizing a database at a remote location. A transmission microscope system has a microscope for observing a specimen and a database which stores, for each microscopic thing (such as a virus), a name, a specimen pretreatment method and an imaging condition used when the microscopic thing is observed, captured image data, etc. An image of the specimen is captured according to a specimen pretreatment method and an imaging condition retrieved from the database using the name of a target microscopic thing as a key, and the captured image is compared with images stored in the database to identify microscopic things present in the specimen.
    • 无论观察者如何,都可以可靠而有效地确定样本是否含有病毒,细菌等,如果有,则可以识别其类型。 此外,甚至可以通过利用远程位置的数据库来快速识别新发现的细菌。 透射显微镜系统具有用于观察标本的显微镜和存储针对每个微观事物(例如病毒)的名称,样本预处理方法和观察微观事物时使用的成像条件的数据库,捕获的图像数据 等等。根据样本预处理方法和使用目标微观事物的名称作为关键从数据库检索的成像条件来捕获样本的图像,并将捕获的图像与存储在数据库中的图像进行比较以识别 样品中存在微观物质。
    • 100. 发明授权
    • Method for determining etching process conditions and controlling etching process
    • 用于确定蚀刻工艺条件和控制蚀刻工艺的方法
    • US06984589B2
    • 2006-01-10
    • US10460217
    • 2003-06-13
    • Maki TanakaChie ShishidoYuji Takagi
    • Maki TanakaChie ShishidoYuji Takagi
    • H01L21/306
    • G01N23/225G01N23/2251H01J37/244H01J37/3171H01J2237/2814H01L21/32137H01L22/10H01L2924/0002H01L2924/00
    • Conventionally, there is no method for quantitatively evaluating the three-dimensional shape of an etched pattern in a non-destructive manner and it takes much time and costs to determine etching conditions. With the conventional length measuring method only, it has been impossible to detect an abnormality in the three-dimensional shape and also difficult to control the etching process.According to the present invention, variations in signal amounts of an SEM image are utilized to compute three-dimensional shape data on the pattern associated with the etching process steps, whereby the three-dimensional shape is quantitatively evaluated. Besides, determination of etching process conditions and process control are performed based on the three-dimensional shape data obtained.The present invention makes it is possible to quantitatively evaluate the three-dimensional shape of the etched pattern in a non-destructive manner. Further, the efficiency of determining the etching process conditions and a stable etching process can be realized.
    • 通常,没有以非破坏性的方式定量地评价蚀刻图案的三维形状的方法,并且确定蚀刻条件需要花费大量时间和成本。 仅使用常规的长度测量方法,就不可能检测到三维形状的异常,并且也难以控制蚀刻工艺。 根据本发明,利用SEM图像的信号量的变化来计算与蚀刻工艺步骤相关联的图案上的三维形状数据,从而定量评估三维形状。 此外,基于获得的三维形状数据进行蚀刻工艺条件和工艺控制的确定。 本发明能够以非破坏性的方式对蚀刻图案的三维形状进行定量评价。 此外,可以实现确定蚀刻工艺条件的效率和稳定的蚀刻工艺。