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    • 93. 发明申请
    • Lithography apparatus for manufacture of integrated circuits
    • 用于制造集成电路的光刻设备
    • US20050036184A1
    • 2005-02-17
    • US10826602
    • 2004-04-16
    • Yee-Chia YeoChenming Hu
    • Yee-Chia YeoChenming Hu
    • G03F7/20G02B5/32
    • G03F7/70341
    • An immersion lithographic system 10 comprises an optical surface 51, an immersion fluid 60 contacting at least a portion of the optical surface, and a semiconductor structure 80 having a topmost photoresist layer 70 having a thickness of less than about 5000 angstroms, wherein a portion of the photoresist is in contact with the immersion fluid. Further, a method for illuminating a semiconductor structure 80 having a topmost photoresist layer 70 with a thickness of less than about 5000 angstroms, comprising introducing an immersion fluid 60 into a space between an optical surface 51 and the photoresist layer, and directing light preferably with a wavelength of less than about 450 nm through the immersion fluid and onto the photoresist.
    • 浸没式光刻系统10包括光学表面51,与光学表面的至少一部分接触的浸没流体60和具有小于约5000埃的厚度的最顶层光致抗蚀剂层70的半导体结构80,其中一部分 光致抗蚀剂与浸没流体接触。 此外,一种用于照射具有小于约5000埃的厚度的最上面的光致抗蚀剂层70的半导体结构80的方法,包括将浸没流体60引入到光学表面51和光致抗蚀剂层之间的空间中,并且优选地引导光 波长小于约450nm,通过浸没流体和光致抗蚀剂。