专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明申请

US20080017975A1 Capillary underflow integral heat spreader 有权
标题翻译：毛细管下溢一体式散热器
公开(公告)号：US20080017975A1
公开(公告)日：2008-01-24
申请号：US11479577
申请日：2006-06-30
申请人： Carl Deppisch , Tom Fitzgerald , Fay Hua , Wei Shi , Mike Gasparek
发明人： Carl Deppisch , Tom Fitzgerald , Fay Hua , Wei Shi , Mike Gasparek
IPC分类号： H01L23/34 , H01L23/10
CPC分类号： H01L23/42 , H01L21/563 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/16152 , H01L2924/1617
摘要： A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component.A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point. The solder material is maintained in a molten state until it has flowed into and substantially filled a bond line gap between the mating surface of the cooling device and the mating surface of the thermal component, and then cooled below its melting point, physically and/or thermally coupling the cooling device and the thermal component.
摘要翻译：一种冷却装置，包括具有第一配合表面的导热体，在第一配合表面的一部分处以图案设置的第一焊料可润湿材料，以及设置在第一配合表面处的可回流焊料。焊料材料的一部分被构造成能够接触相邻设置的第二配合表面，并且当熔化时，通过冷却装置的第一配合表面和第二配合表面之间的接合线间隙形成单个流动前沿，例如，热成分。冷却装置的配合表面邻近热部件的配合表面定位，焊料材料至少加热至其熔点。焊料材料保持在熔融状态，直到其流入并基本上填充冷却装置的配合表面与热部件的配合表面之间的接合线间隙，然后冷却到其熔点以下物理和/或热耦合冷却装置和热部件。

92. 发明申请

US20070284730A1 METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE MATERIAL IN INTEGRATED CIRCUIT PACKAGES 审中-公开
标题翻译：集成电路封装薄膜热绝缘材料的方法，装置和系统
公开(公告)号：US20070284730A1
公开(公告)日：2007-12-13
申请号：US11423551
申请日：2006-06-12
申请人： Wei Shi , Daoqiang Lu , Edward A. Zarbock
发明人： Wei Shi , Daoqiang Lu , Edward A. Zarbock
IPC分类号： H02K9/20
CPC分类号： H01L21/50 , H01L23/3735 , H01L23/3736 , H01L2224/16225 , H01L2224/73253 , Y10T29/49144
摘要： Some embodiments of the invention include a thermal interface between a heat spreader and a die. The thermal interface may include a main layer of a single material or a combination of multiple materials. The thermal interface may include one or more additional layers covering one or more surfaces of the main layer. The thermal interface may be bonded to the die and the heat spreader at a low temperature, with flux or without flux. Other embodiments are described and claimed.
摘要翻译：本发明的一些实施例包括散热器和模具之间的热界面。热界面可以包括单一材料的主层或多种材料的组合。热界面可以包括覆盖主层的一个或多个表面的一个或多个附加层。热界面可以在低温下与焊剂和散热器结合，焊剂或无焊剂。描述和要求保护其他实施例。

93. 发明申请

US20070228112A1 Method and arrangement for forming a microelectronic package 审中-公开
标题翻译：用于形成微电子封装的方法和装置
公开(公告)号：US20070228112A1
公开(公告)日：2007-10-04
申请号：US11394928
申请日：2006-03-31
申请人： Wei Shi , Thomas Fitzgerald , Steve Mayer , Carl Deppisch , Daoqiang Lu
发明人： Wei Shi , Thomas Fitzgerald , Steve Mayer , Carl Deppisch , Daoqiang Lu
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , H01L21/6835 , H01L23/3675 , H01L24/27 , H01L24/743 , H01L24/83 , H01L2224/27334 , H01L2224/29109 , H01L2224/73253 , H01L2224/7565 , H01L2224/83011 , H01L2224/83101 , H01L2224/83191 , H01L2224/83801 , H01L2924/0001 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01049 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/16152 , H05K3/3478 , H05K2203/0338 , H05K2203/0415 , H01L2924/01047 , H01L2924/0105 , H01L2924/00015 , H01L2224/29099 , H01L2224/83205
摘要： A method of forming a microelectronic package, and an arrangement to attach a solder preform onto a microelectronic die in order to form the package. The method comprises: providing a reinforced solder preform including a solder preform and a backing layer attached to a backside of the solder preform; placing the reinforced solder preform on a surface of a first microelectronic component adapted to be soldered; attaching the solder preform to the surface of the first microelectronic component after placing the reinforced solder preform; removing the backing layer from the solder preform after placing the reinforced solder preform; placing a second microelectronic component to be soldered onto the solder preform after removing the backing layer; and soldering the second microelectronic component to the first microelectronic component to form the package.
摘要翻译：一种形成微电子封装的方法，以及将焊料预制件附着到微电子管芯上以形成封装的装置。该方法包括：提供加强的焊料预制件，其包括焊料预制件和附接到焊料预制件的背面的背衬层; 将加强的焊料预制件放置在适于被焊接的第一微电子部件的表面上; 在放置加强的焊料预制件之后，将焊料预制件附接到第一微电子部件的表面; 在放置加强焊料预制件之后从焊料预制件上去除背衬层; 在移除背衬层之后放置要焊接到焊料预制件上的第二微电子部件; 以及将所述第二微电子部件焊接到所述第一微电子部件以形成所述封装。

94. 发明申请

US20070155198A1 Substrate with raised edge pads 有权
标题翻译：基片与凸起的边缘垫
公开(公告)号：US20070155198A1
公开(公告)日：2007-07-05
申请号：US11315854
申请日：2005-12-22
申请人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
发明人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
IPC分类号： H01R12/00
CPC分类号： H05K7/1061 , Y10T29/49117
摘要： A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.
摘要翻译：可分离的电连接可以在待连接的两个电气部件之一上设置有陆侧焊盘。侧面垫可以由两部分组成，包括平坦部分和形成在平坦部分上的凸起边缘。在一些实施例中，凸起边缘可以具有闭合的几何形状。然后，通过凸起边缘防止接合平坦部分和凸起边缘之间的连接处的插座触点从边缘垫片滑出。此外，可以在陆侧衬垫的平坦部分和凸起边缘以及插座上的相应形状的一对部分之间建立双重电连接区域。这增加了连接的电效率及其安全性。

95. 发明申请

US20070152321A1 Fluxless heat spreader bonding with cold form solder 审中-公开
标题翻译：无焊散热器与冷成型焊料接合
公开(公告)号：US20070152321A1
公开(公告)日：2007-07-05
申请号：US11323904
申请日：2005-12-29
申请人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
发明人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
IPC分类号： H01L23/12 , H01L21/50
CPC分类号： H01L21/4871 , H01L25/0655 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/01327 , H01L2924/16152 , H01L2924/00
摘要： The formation of electronic assemblies including a heat spreader coupled to at least one die is described. One embodiment relates to a method including positioning a solder on a heat spreader. The method also includes forming a solid state diffusion bond between the solder and the heat spreader. The solid state diffusion bonded solder and heat spreader are positioned on a die and heated to a temperature sufficient to melt the solder and form a bond between the solder and the die, in the absence of a flux. Other embodiments are described and claimed.
摘要翻译：描述了包括耦合到至少一个管芯的散热器的电子组件的形成。一个实施例涉及一种包括将焊料定位在散热器上的方法。该方法还包括在焊料和散热器之间形成固态扩散接合。固态扩散焊接和散热器位于模具上并加热至足以熔化焊料的温度，并在不存在焊剂的情况下在焊料和管芯之间形成结合。描述和要求保护其他实施例。

96. 发明申请

US20070138647A1 Integrated circuit package to provide high-bandwidth communication among multiple dice 有权
标题翻译：集成电路封装，提供多个骰子之间的高带宽通信
公开(公告)号：US20070138647A1
公开(公告)日：2007-06-21
申请号：US11314459
申请日：2005-12-21
申请人： Qing Zhou , Wei Shi , Jiangqi He , Daoqiang Lu
发明人： Qing Zhou , Wei Shi , Jiangqi He , Daoqiang Lu
IPC分类号： H01L23/52
CPC分类号： H01L25/0652 , H01L25/18 , H01L2224/16 , H01L2924/15311 , H01L2924/15312
摘要： A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some embodiments, the integrated circuit package substrate defines a first cavity, and the die is disposed at least partially within the first cavity.
摘要翻译：系统可以包括微处理器管芯，集成电路封装衬底和设置在微处理器管芯和集成电路封装衬底之间的管芯。在一些实施例中，集成电路封装衬底限定第一空腔，并且裸片至少部分地设置在第一空腔内。

97. 发明申请

US20070126103A1 Microelectronic 3-D package defining thermal through vias and method of making same 审中-公开
标题翻译：微电子3-D封装通过通孔定义热和其制造方法
公开(公告)号：US20070126103A1
公开(公告)日：2007-06-07
申请号：US11292608
申请日：2005-12-01
申请人： Wei Shi
发明人： Wei Shi
IPC分类号： H01L23/02
CPC分类号： H01L21/6835 , H01L23/473 , H01L25/0657 , H01L25/18 , H01L2221/6834 , H01L2221/68354 , H01L2224/16 , H01L2224/32145 , H01L2224/83102 , H01L2224/92125 , H01L2225/06551 , H01L2225/06589 , H01L2924/19041 , H01L2924/30105
摘要： An IC chip, a three dimensional microelectronic package including the IC chip, a system including the microelectronic package, and a method of forming the package. The microelectronic package comprises: a bonding substrate comprising external circuitry; a plurality of IC chips secured in a stack, the plurality comprising a bottom IC chip electrically interconnected to the bonding substrate; the stack further defining a passage therein having a passage inlet and a passage outlet and at least one via configured to guide cooling fluid from one surface of at least one of the IC chips to an opposing surface of the at least one of the IC chips, the passage further being configured to guide a cooling fluid from the passage inlet to the passage outlet. The package further includes electrical interconnects electrically interconnecting respective ones of the IC chips.
摘要翻译： IC芯片，包括IC芯片的三维微电子封装，包括微电子封装的系统以及形成封装的方法。微电子封装包括：包括外部电路的接合衬底; 固定在堆叠中的多个IC芯片，所述多个IC芯片包括与所述接合基板电连接的底部IC芯片; 所述堆叠进一步限定其中具有通道入口和通道出口的通道，以及至少一个通孔，该至少一个通孔构造成将冷却流体从至少一个所述IC芯片的一个表面引导到所述至少一个所述IC芯片的相对表面，该通道还被构造成将冷却流体从通道入口引导到通道出口。该封装还包括将互连IC芯片中的相应IC芯片电连接的电互连。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式