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    • 91. 发明申请
    • SOLID-STATE IMAGING DEVICE, MEMBERS FOR THE SAME, AND IMAGING SYSTEM
    • 固态成像装置,相同的成员和成像系统
    • US20130099098A1
    • 2013-04-25
    • US13807142
    • 2011-06-21
    • Masahiro Kobayashi
    • Masahiro Kobayashi
    • H01L27/146
    • H01L27/14636H01L23/481H01L27/14609H01L27/14632H01L27/14634H01L27/14638H01L27/1464H01L27/1469H01L2924/0002H01L2924/00
    • The present invention provides a solid-state imaging device including a pad capable of reducing inferior connection with an external terminal. The solid-state imaging device includes a first substrate provided, on its front face, with photoelectric conversion elements, a first wiring structure, a second substrate provided, on its front face, with at least a part of peripheral circuits, and a second wiring structure. The first substrate, the first wiring structure, the second wiring structure, and the second substrate are provided in this order. The first wiring structure includes a wiring layer including wirings made mainly of copper. The second wiring structure includes a wiring layer including wirings made mainly of copper. Wirings made mainly of copper in the wiring layer in the first wiring structure are bonded with wirings made mainly of copper in the wiring layer in the second wiring structure. The solid-state imaging device includes a pad formed of a conductive element made mainly of aluminum.
    • 本发明提供了一种固态成像装置,其包括能够减少与外部端子的不良连接的焊盘。 固态成像装置包括:第一基板,其表面上设置有光电转换元件,第一布线结构,在其正面上设置有至少一部分外围电路的第二基板和第二布线 结构体。 第一基板,第一布线结构,第二布线结构和第二基板依次设置。 第一布线结构包括布线层,包括主要由铜制成的布线。 第二布线结构包括布线层,该布线层包括主要由铜制成的布线。 在第一布线结构中的布线层中主要由铜制成的布线在第二布线结构中的布线层中以主要由铜制成的布线结合。 固态成像装置包括由主要由铝制成的导电元件形成的焊盘。
    • 95. 发明授权
    • Solid-state imaging apparatus
    • 固态成像装置
    • US08174604B2
    • 2012-05-08
    • US13238434
    • 2011-09-21
    • Masanori ShibataMasahiro KobayashiShin KikuchiHiroki Hiyama
    • Masanori ShibataMasahiro KobayashiShin KikuchiHiroki Hiyama
    • H04N5/335
    • H04N5/37455
    • A solid-state imaging apparatus comprises first accumulation units, of which number is n, holding a digital value of n-bits output from a counter, second accumulation units, of which number is n, holding the digital value of n-bits transferred from the first accumulation units, of which number is n, and an A/D converter writing the digital value of n-bits from the counter based on an image signal generated by pixels into the first accumulation units, of which number is n, wherein correspondingly to each column of the pixels, the first accumulation unit of m-th bit (1≦m≦n) and the second accumulation unit of m-th bit (1≦m≦n) are arranged and paired, and the pairs of which number is n are arranged in a direction along the column of pixels.
    • 固态成像装置包括数量为n的第一累加单元,其保存从计数器输出的n位的数字值,第二累积单元,其数量为n,保持n位转移的数字值 其数量为n的第一累积单元和A / D转换器根据由像素产生的图像信号将来自计数器的n位的数字值写入数量为n的第一累积单元,其中相应地 对于每个像素列,第m位(1& nlE; m≦̸ n)的第一累积单元和第m位(1& nlE; m≦̸ n)的第二累积单元被布置和配对,并且其对 数字n沿着像素列的方向排列。
    • 98. 发明申请
    • SOLID-STATE IMAGING APPARATUS
    • 固态成像装置
    • US20110168872A1
    • 2011-07-14
    • US13045761
    • 2011-03-11
    • Masahiro KobayashiYuichiro Yamashita
    • Masahiro KobayashiYuichiro Yamashita
    • H01L27/146
    • H01L31/0224H01L27/14603H01L27/14609H01L27/1463H04N5/37452
    • A solid-state imaging apparatus, controlling a potential on a semiconductor substrate for an electronic shutter operation, includes: a first semiconductor region of the first conductivity type for forming a photoelectric conversion region; a second semiconductor region of the first conductivity type, formed separately from the photoelectric conversion region, for accumulating carriers; a third semiconductor region of a second conductivity type arranged under the second semiconductor region, for operating as a potential barrier; a fourth semiconductor region of the second conductivity type extending between the first semiconductor region and the semiconductor substrate, and between the third semiconductor region and the semiconductor substrate; and a first voltage supply portion for supplying a voltage to the third semiconductor region; wherein the first voltage supply portion includes a fifth semiconductor region of the second conductivity type arranged in the pixel region, and a first electrode connected to the fifth semiconductor region.
    • 控制用于电子快门操作的半导体衬底上的电位的固态成像装置包括:用于形成光电转换区域的第一导电类型的第一半导体区域; 第一导电类型的第二半导体区域,与光电转换区域分开形成,用于累积载流子; 布置在第二半导体区域下方的第二导电类型的第三半导体区域,用作势垒; 在所述第一半导体区域和所述半导体衬底之间以及所述第三半导体区域和所述半导体衬底之间延伸的所述第二导电类型的第四半导体区域; 以及用于向第三半导体区域提供电压的第一电压供应部分; 其中所述第一电压供应部分包括布置在所述像素区域中的所述第二导电类型的第五半导体区域,以及连接到所述第五半导体区域的第一电极。
    • 100. 发明授权
    • Shake reduction apparatus
    • 减震装置
    • US07778535B2
    • 2010-08-17
    • US12069111
    • 2008-02-07
    • Masahiro Kobayashi
    • Masahiro Kobayashi
    • G03B17/00G03B27/64H04N5/228
    • G02B27/646
    • A shake reduction apparatus comprising a movable-side unit having a movable-side frame provided with a camera unit including a lens and an image sensor, and a movable-side shaft having a spherical surface as an extremity surface thereof; a stationary-side unit having a stationary-side frame provided with a stationary-side shaft having an extremity formed as a spherical surface coming into contact with the extremity of the movable-side shaft, to which the movable-side unit is attached; linear actuators disposed between the movable-side frame and the stationary-side frame to drive the movable-side unit to rotate about two orthogonal axes; a movement detection unit for detecting a movement of a camera about the two orthogonal axes; and a controller for controlling the linear actuators to cause the movable-side unit to move so as to cancel the movement of the camera when the movement detection unit detects the movement of the camera.
    • 一种减震装置,包括具有可动侧框架的可动侧单元,所述可动侧框架设置有包括透镜和图像传感器的相机单元,以及具有作为其表面的球形表面的可动侧轴; 固定侧单元,其具有固定侧框架,该固定侧框架具有固定侧轴,所述固定侧轴具有形成为与可动侧轴的末端接触的球面的端部,所述可动侧单元被附接到所述末端; 设置在可动侧框架和固定侧框架之间的线性致动器,以驱动可动侧单元围绕两个正交轴旋转; 移动检测单元,用于检测摄像机围绕两个正交轴的移动; 以及控制器,用于控制线性致动器,以使可动侧单元移动,以便当移动检测单元检测到相机的移动时,消除照相机的移动。