专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明专利

FR2453225A1 未知
公开(公告)号：FR2453225A1
公开(公告)日：1980-10-31
申请号：FR7921713
申请日：1979-08-29
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , KURODA HITOSHI , SHIMIZU NOBUYOSHI , INUI TSUNEO
IPC分类号： B65D8/04 , C25D3/04 , C25D11/38 , C25D11/34

92. 发明公开

EP1193755A4 CLAD PLATE FOR FORMING INTERPOSER FOR SEMICONDUCTOR DEVICE, INTERPOSER FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THEM 有权
标题翻译： COATED片之间的轨道半导体器件中，中间件FOR永远半导体器件及其生产方法生产
公开(公告)号：EP1193755A4
公开(公告)日：2007-07-11
申请号：EP00937200
申请日：2000-06-09
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OKAMOTO HIROAKI , OHSAWA SHINJI
IPC分类号： H01L23/31 , H01L23/495 , H01L23/498 , H05K3/06 , H05K3/28 , H05K3/40 , H01L23/12 , B23K20/00
CPC分类号： H01L23/3114 , H01L23/3107 , H01L23/49582 , H01L23/49861 , H01L2224/16 , H01L2924/07811 , H05K3/062 , H05K3/28 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/10378 , H05K2203/0384 , H05K2203/1572 , Y10T29/30 , Y10T29/301 , Y10T29/302 , Y10T29/49002 , Y10T428/1291 , H01L2924/00
摘要： A clad plate for forming an interposer for a semiconductor device which can be manufactured at low cost and has good characteristics, an interposer for a semiconductor device, and a method of manufacturing them. Copper foil materials (19, 24, 33) forming conductive layers (10, 17, 18) and nickel plating (20, 21) forming etching stopper layers (11, 12) are formed and pressed to form a clad plate (34) for forming an interposer for a semiconductor device. Thus, a clad plate (34) for forming an interposer for a semiconductor device is manufactured. The clad plate (34) is selectively etched to form a columnar conductor (17), and an insulating layer (13) is formed on the copper foil material forming a wiring layer (10). A bump (18) for connection of a semiconductor chip and the wiring layer (10) are formed on the opposite side to the side on which the columnar conductor (17) is formed. Thus, an interposer for a semiconductor device is manufactured.

93. 发明公开

EP1119048A4 CLAD PLATE FOR LEAD FRAMES, LEAD FRAME USING THE SAME, AND METHOD OF MANUFACTURING THE LEAD FRAME 有权
标题翻译：镀说明书印刷画框，镜框的为这类雷尔框架，片材及方法HEAD
公开(公告)号：EP1119048A4
公开(公告)日：2007-07-04
申请号：EP99944820
申请日：1999-09-24
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OHSAWA SINJI
IPC分类号： H01L23/50 , B23K20/04 , B23K20/233 , H01L21/48 , H01L23/495 , H05K3/06 , H05K3/20 , H05K3/40
CPC分类号： H01L21/4842 , B23K20/04 , B23K20/233 , B23K2201/34 , B23K2203/10 , B23K2203/12 , B23K2203/18 , B23K2203/26 , H01L23/49582 , H01L24/45 , H01L2224/45144 , H01L2924/00014 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H05K3/062 , H05K3/202 , H05K3/4007 , H05K2201/0367 , H05K2203/0384 , Y10T29/49204 , Y10T428/12438 , Y10T428/1275 , Y10T428/1291 , H01L2224/48
摘要： A clad plate for lead frames, capable of being manufactured at a low cost and having excellent characteristics; a lead frame using the same; and a method of manufacturing the lead frame, the clad plate for lead frames being manufactured by pressure-welding a copper foil material and a nickel foil material to each other at a draft of 0.1-3 %, or by pressure-welding a copper foil material plated at one or both surfaces thereof with nickel and other copper foil material to each other at a draft of 0.1-3 %, or by pressure-welding an aluminum foil material and a nickel foil material to each other at a draft of 0.1-3 %, or by pressure-welding a copper foil material plated at one surface thereof with nickel and an aluminum foil material other than the aluminum foil material mentioned above to each other at a draft of 0.1-3 %, the clad plate having a structure of three layers of copper, nickel and copper, or copper, nickel and aluminum.

94. 发明公开

EP1049181A4 ENCLOSED CELL AND SEALER 审中-公开
标题翻译：闭孔和封闭
公开(公告)号：EP1049181A4
公开(公告)日：2004-07-14
申请号：EP99900305
申请日：1999-01-14
申请人： TOYO KOHAN CO LTD
发明人： SUGIMOTO YOSHIYUKI , SAIJO KINJI , KAWAMURA HIROAKI , OKAMOTO HIROAKI , ISOBE YOSHIHIKO
IPC分类号： H01M2/12 , H01M2/34 , H01M6/10
CPC分类号： H01M2/345 , H01M2/1241 , H01M2/34 , H01M6/10
摘要： A completely-enclosed cell wherein if the internal pressure in the cell rises because of shortcircuit, overcharging, or reverse charging, temperature rise and explosion of the cell is effectively prevented, the current is cut off, and the internal pressure is simultaneously and quickly released to ensure the safety and reliability of the cell. The cell includes a sealer comprising a valve body (5) composed of a metal substrate (1) having through holes (3) made at narrow intervals in the endless periphery and a metal foil (2) formed on the inside surface of the metal substrate (1) to cover the through holes (3) and has a structure in which a narrow gap portion of a metal plate deformable even by a weak force of when the internal pressure increases elongates and the portion surrounded by the through holes (3) projects. The sealer is fitted and supported to the inner periphery of an opening section of a cell case (30) containing an electrode assembly (32) having a positive plate (32a), a negative plate (32c), and a separator (32b) and an elctrolyte to close the opening section.

95. 发明公开

EP0881697A4 CLADDING MATERIAL 失效
标题翻译：涂层材料
公开(公告)号：EP0881697A4
公开(公告)日：2000-02-02
申请号：EP97902680
申请日：1997-02-14
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , YOSHIMOTO NOBUYUKI , ISOBE YOSHIHIKO
IPC分类号： B23K20/04 , H01M2/12 , B23K20/00
CPC分类号： B23K20/04 , H01M2/1235 , H01M2/1241 , Y10T137/1714 , Y10T428/1234 , Y10T428/12438 , Y10T428/12493 , Y10T428/12646 , Y10T428/1275 , Y10T428/12757 , Y10T428/12778 , Y10T428/12882 , Y10T428/12917 , Y10T428/12937 , Y10T428/12944 , Y10T428/12986 , Y10T428/24331
摘要： To provide a cladding material which accurately bursts at a predetermined pressure to release an inner pressure, and is easy to manufacture and used for safety valves. The cladding material (19) comprises a metallic substrate (20A) formed with a multiplicity of through holes (C) and a metallic foil (20B) laminated on the metallic substrate (20A) so as to close the through holes (C).

96. 发明公开

EP1830611A4 PRINTED WIRING BOARD AND PRODUCTION METHOD OF PRINTED WIRING BORAD 审中-公开
标题翻译：电路板及其制造方法的电路板
公开(公告)号：EP1830611A4
公开(公告)日：2009-06-24
申请号：EP05807092
申请日：2005-11-18
申请人： MULTI INC , TOYO KOHAN CO LTD
发明人： WATANABE MITSUHIRO , SAIJO KINJI , OHSAWA SHINJI , YOSHIDA KAZUO , NANBU KOJI
IPC分类号： H05K1/02 , H05K1/09 , H05K3/06 , H05K3/38 , H05K3/46
CPC分类号： H05K3/427 , H05K1/0265 , H05K1/116 , H05K3/062 , H05K3/20 , H05K3/4658 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0376 , H05K2201/09509 , H05K2201/09736 , H05K2203/0361 , H05K2203/0384 , H05K2203/1476 , Y10T156/10
摘要： A printed wiring board which can equalize as much as possible the circuit widths of a signal transmission circuit and a power supplying circuit or the like that have required designs of circuit widths to be different significantly and which can be substantially downsized, and a production method therefor, wherein the printed wiring board can be obtained by etching a metal clad laminate plate containing a conductive layer and an insulation layer, and the printed wiring board, where a first circuit and a second circuit formed on the same reference flat surface and being different in thickness coexist, is used. The printed wiring board is characterized in that the first circuit or the second circuit, whichever is thicker, has a clad form where three layers, a first copper layer/a metal-of-different-kind layer/a second copper layer, are sequentially laminated one upon another. The production method for the printed wiring board is characterized by using as a starting material a clad composite material in which three layers, a first copper layer/a metal-of-different-kind layer/a second copper layer, are sequentially laminated one upon another, and by effectively using etching characteristics selecting between the metal-of-different-kind layer and a copper layer.

97. 发明公开

EP1111975A4 CLAD BOARD FOR PRINTED-CIRCUIT BOARD, MULTILAYERED PRINTED-CIRCUIT BOARD, AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译： KASHIERTE板电路板更多滑雪的术语电路板和方法及其
公开(公告)号：EP1111975A4
公开(公告)日：2005-10-26
申请号：EP99931469
申请日：1999-07-22
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OHSAWA SHINJI
IPC分类号： H05K3/06 , H05K3/20 , H05K3/44 , H05K3/46
CPC分类号： H05K3/062 , H05K3/20 , H05K3/44 , H05K3/4647 , H05K2201/0355 , H05K2201/0361 , H05K2201/09554 , H05K2203/0384 , H05K2203/0733 , Y10S428/901 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/24917
摘要： A method of manufacturing a multilayered printed-circuit board and a low-cost clad board. Copper foil layers (19, 24, 33) for forming conductor layers (10, 17, 18) and nickel plating layers (20, 21) for forming etch stop layers (11, 12) are alternately stacked and compressed to form a clad board (34) for a printed-circuit board. The clad board (34) for the printed-circuit board is selectively etched to manufacture a base. External conductor layers (15, 16) are formed on the surface of the base and patterned. The conductor layers (10, 15, 16) are interconnected electrically through conductors blocks (17, 18) formed by etching the copper foil layers (19, 24, 33) and the nickel plating layers (20, 21) to complete the manufacture of multilayered printed-circuit board.
摘要翻译：在本发明中，其产生用于多层印刷电路板能够被经济地制造，并具有优良性能的包覆板，使用它们的多层印刷电路板及其制造方法，多层印刷电路板是通过形成包层板制造为通过层叠铜箔19，24，33将被形成为导体层10，17，18和镀镍20，21，它们将被蚀刻停止层，并同时压接二者的多层印刷电路板34，通过选择性地蚀刻用于多层印刷电路板34包层板，所述基体的表面上形成外导体层15,16，同时使这种图案化和电通过插入柱状导体17之间的导体层10，15，16连接产生一个基通过蚀刻铜箔19，24，33和镀镍20 18形成，21

98. 发明公开

EP1332867A4 FILM WITH MULTILAYERED METAL AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：与生产该多层金属和方法FILM
公开(公告)号：EP1332867A4
公开(公告)日：2004-06-23
申请号：EP01972689
申请日：2001-10-04
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , OKAMOTO HIROAKI , OHSAWA SHINJI
IPC分类号： B32B15/08 , B32B37/20 , H05K3/00 , H05K3/02 , H05K3/38 , B32B31/14
CPC分类号： H05K3/388 , B32B15/08 , B32B37/20 , B32B38/0008 , B32B38/162 , B32B2037/0092 , B32B2038/0092 , B32B2309/68 , B32B2311/00 , B32B2367/00 , B32B2379/08 , B32B2398/00 , B32B2457/08 , H05K3/025 , H05K2201/0355 , Y10T428/31681
摘要： A film which has a multilayered metal and is obtained by bonding a polymer film having a thin metal film formed on a surface thereof to a metal foil having a given thickness without using an adhesive. It has a given thickness and is adhesive-free. The film having a multilayered metal is obtained by preparing a polymer film having a thin metal film superposed on a surface thereof, activating both the surface of the thin metal film and a surface of a metal foil, and press-bonding the activated thin-metal film surface to the activated metal foil surface.

99. 发明公开

EP0918343A4 SAFETY VALVE ELEMENT FOR CAPACITOR AND CAPACITOR CASE LID WITH SAFETY VALVE 失效
标题翻译： SICHERHEITSVENTILELEMENTFÜRKONDENSATOR UNDKONDENSATORGEHÄUSEDECKELMIT SICHERHEITSVENTIL
公开(公告)号：EP0918343A4
公开(公告)日：1999-11-17
申请号：EP97933911
申请日：1997-08-05
申请人： TOYO KOHAN CO LTD
发明人： SAIJO KINJI , YOSHIDA KAZUO , YOSHIMOTO NOBUYUKI , ISOBE YOSHIHIKO
IPC分类号： H01G9/04 , H01G9/12
CPC分类号： H01G9/12 , Y10T137/1714
摘要： A safety valve element for capacitor which can stably and accurately release its internal pressure by bursting at a predetermined low pressure and can be manufactured easily, and a capacitor case lid incorporating the safety valve element. The safety valve element is composed of a metallic substrate (A) having a through hole (C) drilled through the substrate (A) and metallic foil (B) which is laminated on the substrate (A) so as to close the hole (C).
摘要翻译：本发明提供一种电容器用安全阀元件及安全阀元件的电容器壳体盖，该安全阀元件能够通过以规定的低压爆裂而稳定且准确地释放内压并且容易制造。安全阀元件由具有穿过基板（A）钻出的通孔（C）的金属基板（A）和层叠在基板（A）上以封闭孔（C）的金属箔（B））。

100. 发明专利

JP2010004064A Method of manufacturing semiconductor package unit 有权
标题翻译：制造半导体封装单元的方法
公开(公告)号：JP2010004064A
公开(公告)日：2010-01-07
申请号：JP2009192171
申请日：2009-08-21
申请人： Toyo Kohan Co Ltd , 東洋鋼鈑株式会社
发明人： SAIJO KINJI , YOSHIDA KAZUO , OKAMOTO HIROAKI , OSAWA SHINJI
IPC分类号： H01L23/12 , H01L21/48 , H01L23/14 , H01L23/32 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L23/498 , H01L21/4846 , H01L23/49575 , H01L2924/0002 , H01L2924/15192 , H01L2924/15311 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method with which the chip capacity in a semiconductor package having a plurality of chips stacked is increased.
SOLUTION: The method of manufacturing the semiconductor package unit by processing a five-layer clad plate 34 comprising a copper layer 24, an nickel layer 20, a copper layer 19, a nickel layer 21, and a copper layer 33 in order includes: selectively etching the copper layer 24 and removing the nickel layer 20 by selective etching while leaving a columnar conductor 18; forming an insulating resin layer 39; selectively etching the copper layer 33 provided as a back layer of the clad plate; selectively etching the copper layer 33 while leaving the columnar conductor 17 to remove the nickel layer 21; selectively etching the copper layer 19 to form a wiring layer; forming an insulating resin layer 39; removing a photoresist film 37 left such that the head of the columnar conductor 17 is exposed from a surface; connecting semiconductor chips 1 and 2 to both surfaces of the wiring layer with conductive adhesives to obtain a mounting substrate 40; and mounting the mounting substrate on a printed circuit board 41.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造方法，其具有堆叠的多个芯片的半导体封装中的芯片容量增加。解决方案：通过按顺序处理包括铜层24，镍层20，铜层19，镍层21和铜层33的五层复合板34来制造半导体封装单元的方法包括：选择性地蚀刻铜层24并通过选择性蚀刻除去镍层20而留下柱状导体18; 形成绝缘树脂层39; 选择性地蚀刻作为复合板的背层设置的铜层33; 选择性地蚀刻铜层33同时离开柱状导体17以除去镍层21; 选择性地蚀刻铜层19以形成布线层; 形成绝缘树脂层39; 去除光致抗蚀剂膜37，使得柱状导体17的头部从表面露出; 用导电粘合剂将半导体芯片1和2连接到布线层的两个表面，以获得安装基板40; 并将安装基板安装在印刷电路板41上。版权所有（C）2010，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式