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    • 95. 发明授权
    • Printed circuit board
    • 印刷电路板
    • US08270180B2
    • 2012-09-18
    • US12646888
    • 2009-12-23
    • Chien-Hung LiuShou-Kuo HsuYu-Chang PaiPo-Chuan Hsieh
    • Chien-Hung LiuShou-Kuo HsuYu-Chang PaiPo-Chuan Hsieh
    • H05K1/11H05K7/00H05K1/14
    • H05K1/0251H05K1/0222H05K3/429H05K2201/09309H05K2201/09636
    • A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.
    • 印刷电路板包括多个信号层,多个接地层,第一传输线,第二传输线,第一通孔和第二通孔。 第一个传输位于多个信号层之一上。 第二传输线位于多个信号层的另一个上。 第一和第二通孔穿过印刷电路板。 第一通孔电耦合到第一和第二传输线,并且与接地层的数量隔离。 第二通孔电耦合到多个接地层中的一个或多个,并与多个接地层中的另一个隔离,以增加电感,从而补偿开路短路的电容特性并提高信号完整性。
    • 98. 发明授权
    • Via structure of printed circuit board
    • 通过印刷电路板的结构
    • US08067700B2
    • 2011-11-29
    • US11927710
    • 2007-10-30
    • Yu-Chang PaiShou-Kuo HsuChien-Hung Liu
    • Yu-Chang PaiShou-Kuo HsuChien-Hung Liu
    • H05K1/11
    • H05K1/0251H05K1/116H05K3/429H05K2201/09718
    • A printed circuit board (200) includes at least one via (280) defined therein, the via has an upper cap (220) formed on a top surface of the PCB, and a lower cap (240) formed on a bottom surface of the PCB. A conductive hole (290) is defined in the PCB having a plated sidewall (230) plated on its inner surface, and a first clearance hole (271) is defined in a first inner layer (260) of the PCB around the sidewall. A first transmission line (210) defined on the top surface of the PCB is coupled to the upper cap, a first void (273) extending from a boundary of the first clearance hole being disposed along the layout direction of the first transmission line.
    • 印刷电路板(200)包括限定在其中的至少一个通孔(280),所述通孔具有形成在所述PCB的顶表面上的上盖(220)和形成在所述PCB的底表面上的下盖(240) PCB。 导电孔(290)限定在印刷电路板中,电镀侧壁(230)镀在其内表面上,第一间隙孔限定在PCB的围绕侧壁的第一内层(260)中。 限定在PCB的顶表面上的第一传输线(210)联接到上盖,沿着第一传输线的布置方向布置的从第一间隙孔的边界延伸的第一空隙(273)。