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    • 99. 发明授权
    • Inductive element and manufacturing method of the same
    • 感应元件及其制造方法相同
    • US07212095B2
    • 2007-05-01
    • US10773318
    • 2004-02-09
    • Shinichi SatoHitoshi OhkuboToshiaki Kikuchi
    • Shinichi SatoHitoshi OhkuboToshiaki Kikuchi
    • H01F5/00
    • H01F5/00H01F17/0033H01F2017/004
    • Conductor layers 2A and insulating layers 4A are alternately stacked so as to prepare a base material 17. A plurality of grooves 18 having a predetermined width are formed in a surface of the base material 17 in such a manner that these plural grooves 18 are located parallel to each other along a stacking layer direction in order to form a coil inner peripheral portion. Embedding materials 5 are filled into the grooves 18. Surfaces 16 of the base material into which the embedding materials 5 have been filled are flattened by polishing. The conductor layers 2A located adjacent to each other are connected to each other, so that helical coils which constitute inductive elements are constructed. Then, both the front plane and the rear plane of the resultant base material are covered by an insulating layer, which is cut so as to obtain respective chips.
    • 交替层叠导体层2A和绝缘层4A以制备基材17。 为了形成线圈内周部,在基材17的表面上形成多个具有预定宽度的槽18,使得这些多个槽18沿层叠层方向彼此平行地定位。 嵌入材料5被填充到凹槽18中。 嵌入材料5填充到其中的基材的表面16通过抛光而变平。 彼此相邻的导体层2A彼此连接,从而构成构成感应元件的螺旋线圈。 然后,所得基材的前平面和后平面被绝缘层覆盖,绝缘层被切割以获得各自的芯片。