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    • 91. 发明专利
    • VINYL CHLORIDE RESIN MOLDING
    • JPS60245644A
    • 1985-12-05
    • JP10193884
    • 1984-05-21
    • SHINETSU CHEM IND CO
    • KITAMURA HAJIMEUENO SUSUMUNOMURA HIROKAZU
    • C08J7/00B29C71/04B29K27/06
    • PURPOSE:The titled molding free of plasticizer migration to the surface, coloration and deterioration of the mechanical properties, having excellent heat resistance, hydrophilic properties, etc., obtained by the short-time pulse irradiation of the surface of a vinyl chloride resin molding with an ultraviolet laser of a specified wave range. CONSTITUTION:The surface of a non-rigid vinyl chloride resin molding (e.g. a film of a non-rigid vinyl chloride resin), made by molding a vinyl chloride resin with a plasticizer, a stabilizer, a filler, a modifying additive rubber, etc. incorporated therein, is treated by short-time pulse irradiatioi with an ultraviolet laser having a wave range of 95-200nm, under conditions of average power output of several to tens of W and a repetition frequency of 1-100Hz. This treatment will easily form an extremely thin barrier layer on the surface of the molding without disadvantages such as coloration and deterioration of the physical properties, thus giving the titled molding having a plasticizer extraction by n-hexane of 0.5mg/cm or less.
    • 94. 发明专利
    • COMPOUND MOLDED BODY FOR GAS SEPARATION
    • JPS60122026A
    • 1985-06-29
    • JP22799683
    • 1983-12-02
    • SHINETSU CHEM IND CO
    • UENO SUSUMUNOMURA HIROKAZUKITAMURA HAJIME
    • B01D53/22B01D67/00B01D71/44B01D71/70
    • PURPOSE:To obtain a compound molded body for gas separation having high permeability of oxygen and large separation factor for nitrogen from oxygen by forming a polymerized film of a gaseous org. compd. using low temp. plasma on the surface of a molded product of polymer of an org. unsatd. compd. contg. Si. CONSTITUTION:An org. unsatd. compd. as expressed by the formula is polymerized by an appropriate method. (In the formula, R is 1-8C univalent hydrocarbon group; R and R are same or different groups selected from 1-8C univalent hydrocarbon group and 1-8C univalent hydrocarbon group and 1-8C alkoxy group; R is a group selected from 1-8C univalent hydrocarbon group, 1-8C alkoxy group, and triorganosilyl alkylene group). Preferred degree of polymn. is >=1,000. The polymer can be formed to a film, but an appropriate support may be used also. A low-temp. plasma polymerized film is formed on said molded polymer body. For this stage, a gaseous org. compd. such as organosilicon compd., organofluorine compd. etc. is introduced into a low temp. plasma generator; coexistence of inert gas such as N2, O2, etc. may be permitted. Suitable film thickness is 0.005-1mu.