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    • 94. 发明公开
    • SHAPING DEVICE AND SHAPING METHOD
    • 成形装置和成形方法
    • EP3219411A1
    • 2017-09-20
    • EP14905892.7
    • 2014-11-14
    • Nikon Corporation
    • SHIBAZAKI, Yuichi
    • B22F3/105
    • This shaping apparatus is equipped with: a movement system which moves a target surface (TAS) ; a measurement system for acquiring position information of the target surface (TAS) in a state movable by the movement system, a beam shaping system (500) that has a beam irradiation section (520) and a material processing section (530) which supplies a shaping material irradiated by a beam (LB) from beam irradiation section (520) ; and a controller. On the basis of 3D data of a three-dimensional shaped object to be formed on a target surface and position information of the target surface (TAS) acquired using the measurement system, the controller controls the movement system and the beam shaping system (500) such that a target portion (TA) on the target surface (TAS) is shaped by supplying the shaping material while moving the target surface (TAS) and the beam (LB) from beam irradiation section (520) relative to each other.
    • 该成形装置具备:移动目标面(TAS)的移动系统; 测量系统,该测量系统用于获取处于可由移动系统移动的状态下的目标表面(TAS)的位置信息;光束整形系统(500),其具有光束照射部分(520);以及材料处理部分(530) 使来自光束照射部(520)的光束(LB)照射的成形材料; 和一个控制器。 控制器基于将要形成在目标表面上的三维成形物体的3D数据和使用测量系统获取的目标表面(TAS)的位置信息,控制移动系统和光束整形系统(500) 使得通过在使来自射束照射部520的目标表面TAS和射束LB相对于彼此移动的同时供应成形材料来对目标表面TAS上的目标部分TA进行成形。
    • 97. 发明公开
    • MOBILE BODY APPARATUS, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD
    • MOBILEKÖRPERVORRICHTUNG,BELICHTUNGSVORRICHTUNG UND VORRICHTUNGSHERSTELLUNGSVERFAHREN
    • EP3038137A1
    • 2016-06-29
    • EP14816681.2
    • 2014-06-26
    • Nikon Corporation
    • SHIBAZAKI, Yuichi
    • H01L21/027G03F7/20H01L21/68
    • A supporting member (25) on which a wafer table (WTB) is mounted is substantially kinematically supported, via six rod members (23 1 to 23 3 , 24 1 to 24 3 ) placed on a slider (22). Further, coupling members (29) are placed facing in a non-contact manner via a predetermined gap, thin plate-shaped edges (25c) provided at both ends in the Y-axis direction of the supporting member (25). By this arrangement, vibration-damping is performed by the coupling members (29) (squeeze dampers) facing the edges (25c), on vibration of the supporting member (25) mounted on the wafer table (WTB). Further, because the supporting member (25) is kinematically supported via the plurality of rod members, it becomes possible to reduce deformation of the wafer table (WTB) that accompanies deformation of the slider (22).
    • 通过放置在滑块(22)上的六个杆构件(23 1至23 3,24 1至24 3),安装有晶片台(WTB)的支撑构件(25)基本上被运动支撑。 此外,联接构件(29)经由预定间隙以非接触方式放置,设置在支撑构件(25)的Y轴方向上的两端的薄板状边缘(25c)。 通过这种布置,通过安装在晶片台(WTB)上的支撑构件(25)的振动,通过面对边缘(25c)的联接构件(挤压阻尼器)进行减振。 此外,由于支撑构件(25)经由多个杆构件被运动支撑,所以可以减少伴随滑块(22)的变形的晶片台(WTB)的变形。