专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明专利

CA2779069A1 BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM 未知
公开(公告)号：CA2779069A1
公开(公告)日：2011-06-03
申请号：CA2779069
申请日：2010-11-30
申请人： MITSUBISHI HEAVY IND LTD
发明人： TSUTSUMI KEIICHIRO , TSUNO TAKESHI , GOTO TAKAYUKI , KINOUCHI MASATO , SUZUKI TAKENORI , IDE KENSUKE
IPC分类号： H01L21/02 , B23K20/00 , B23K20/14 , B23K20/24
摘要： Disclosed is a bonding method which is provided with: an activation step (S2) wherein the second substrate surface of a second substrate and the first substrate surface of a first substrate are activated by irradiating the first substrate surface and the second substrate surface with particles; and a bonding step (S4) wherein the second substrate and the first substrate are bonded to each other by bringing the second substrate surface and the first substrate surface into contact with each other after the difference between the temperature of the first substrate and that of the second substrate is reduced to a prescribed value or less. In the bonding method, warpage generated in the bonded substrates thus obtained is further reduced compared with warpage generated in other bonding methods wherein a first substrate and a second substrate are bonded to each other before the difference between the temperature of the first substrate and that of the second substrate is reduced to the prescribed value or less.

92. 发明专利

CA2739239A1 WAFER BONDING DEVICE AND WAFER BONDING METHOD 未知
公开(公告)号：CA2739239A1
公开(公告)日：2010-04-08
申请号：CA2739239
申请日：2009-02-19
申请人： MITSUBISHI HEAVY IND LTD
发明人： TSUNO TAKESHI , GOTO TAKAYUKI , KINOUCHI MASATO , IDE KENSUKE , SUZUKI TAKENORI
IPC分类号： B23K20/00 , B23K20/02 , H01L21/02 , H01L21/683
摘要： A wafer bonding method is provided with a step of holding a first substrate by an upper holding mechanism (7) by applying a voltage to the upper holding mechanism (7); a step of forming a bonded substrate by bonding the first substrate and a second substrate held by a lower holding mechanism (8); and a step of dechucking the bonded substrate from the upper holding mechanism (7) after applying a voltage, which attenuates while alternating, to the upper holding mechanism (7). Residual attracting force between the bonded substrate and the upper holding mechanism (7) is reduced when the voltage, which attenuates while alternating, is applied to the upper holding mechanism (7), and the bonded substrate can be dechucked from the upper holding mechanism (7) more surely in a shorter time. As a result, a wafer bonding apparatus (1) can bond the first substrate and the second substrate in a shorter time.

93. 发明专利

CA2717076A1 ROOM TEMPERATURE BONDING APPARATUS 未知
公开(公告)号：CA2717076A1
公开(公告)日：2009-09-03
申请号：CA2717076
申请日：2008-03-11
申请人： MITSUBISHI HEAVY IND LTD
发明人： TSUNO TAKESHI , GOTO TAKAYUKI , KINOUCHI MASATO , TAWARA SATOSHI , UTSUMI JUN , TSUMURA YOICHIRO , IDE KENSUKE , SUZUKI TAKENORI
IPC分类号： H01L21/02 , B23K20/00 , B23K20/14
摘要： A cold joining device has an angle adjusting mechanism for supporting a first sample base, which holds a first substrate, on a first stage so that the direction of the first sample base can be changed, a first driving device for driving in the first direction the first stage, a second driving device for driving in the second direction a second sample base for holding a second substrate, and a carriage support base for supporting the second sample base in the first direction when the second substrate is pressed against the first substrate. The cold joining device can apply a large load exceeding the load bearing capacity of the second driving device to the first substrate and the second substrate. Also, the cold joining device can change, by using the angle adjusting mechanism, the direction of the first substrate so that the first substrate and the second substrate are in parallel contact with each other, and thus the large load can be uniformly applied to the joined surfaces between the substrates.

94. 发明专利

CA2782633A1 ROOM-TEMPERATURE BONDING APPARATUS 未知
公开(公告)号：CA2782633A1
公开(公告)日：2008-03-13
申请号：CA2782633
申请日：2007-09-06
申请人： MITSUBISHI HEAVY IND LTD
发明人： GOTO TAKAYUKI , UTSUMI JUN , IDE KENSUKE , TAKAGI HIDEKI , FUNAYAMA MASAHIRO
IPC分类号： B29C65/14
摘要： A room-temperature bonding apparatus is described, which includes a vacuum chamber, an evacuation apparatus evacuating the vacuum chamber, a pair of substrate holders arranged to face each other in the vacuum chamber, a pressure bonding mechanism connected to the substrate holder to bond substrates mounted on the respective substrate holders to each other and a physical sputtering source. The target to be irradiated with ion beams or atom beams emitted from the physical sputtering source is arranged in the vacuum chamber independently of the substrate holders, the pressure bonding mechanism and the physical sputtering source.

95. 发明专利

DE68919908T2 未知
公开(公告)号：DE68919908T2
公开(公告)日：1995-05-18
申请号：DE68919908
申请日：1989-05-24
申请人： NORITAKE CO LTD , MITSUBISHI HEAVY IND LTD
发明人： HENMI YOSHINORI , TANABE AKIRA , SABURI KOUICHI , HAYASHI KANJI , GOTO TAKAYUKI , MATSUSHIMA HISAO
IPC分类号： B21B28/04 , B24B5/04 , B24B5/37 , B24D7/14
摘要： A grinding wheel having a circular outer periphery, and a working front end face for grinding a roll as installed in place on a rolling mill or other equipment, such that the front end face is held in pressed frictionally sliding contact with an outer circumferential surface of the roll. The wheel has an abrasive body containing evenly distributed short fibers. The short fibers preferably consist of bundles of fibers, each of said bundles consisting of a plurality of fibers having a length of 1-10mm, wherein the short fibers are selected from the group consisting of glass fibers, carbon fibers and Al2O3 fibers.

96. 发明专利

CA2660706C ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS 未知
公开(公告)号：CA2660706C
公开(公告)日：2012-10-16
申请号：CA2660706
申请日：2007-09-06
申请人： MITSUBISHI HEAVY IND LTD , NAT INST OF ADVANCED IND SCIEN
发明人： GOTO TAKAYUKI , UTSUMI JUN , IDE KENSUKE , TAKAGI HIDEKI , FUNAYAMA MASAHIRO
IPC分类号： B23K20/00 , B23K20/14 , B23K20/24 , C23C14/34 , H01L21/02
摘要： A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.

97. 发明专利

CA2758157A1 BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD 未知
公开(公告)号：CA2758157A1
公开(公告)日：2011-05-05
申请号：CA2758157
申请日：2010-10-27
申请人： MITSUBISHI HEAVY IND LTD
发明人： KINOUCHI MASATO , GOTO TAKAYUKI , TSUNO TAKESHI , IDE KENSUKE , SUZUKI TAKENORI
IPC分类号： H01L21/02 , B23K20/00 , B23K20/14 , B23K20/24 , B81C3/00 , H01L21/677
摘要： Disclosed is a multilayer bonding method which is provided with: a step of manufacturing a first bonded substrate by bonding together an upper substrate and an intermediate substrate therefor inside of a bonding chamber; a step of carrying a lower substrate for the first bonded substrate into the bonding chamber when the first bonded substrate is disposed inside of the bonding chamber; and a step of manufacturing a second bonded substrate by bonding together the first bonded substrate and the lower substrate therefor inside of the bonding chamber. In the multilayer bonding method, the upper substrate can be bonded to the lower substrate without being taken out from the bonding chamber after the upper substrate is bonded to the intermediate substrate. Therefore, the second bonded substrate can be manufactured at a high speed and low cost.

98. 发明专利

CA2704610A1 DEVICE AND DEVICE MANUFACTURING METHOD 未知
公开(公告)号：CA2704610A1
公开(公告)日：2009-05-14
申请号：CA2704610
申请日：2008-10-14
申请人： NAT INST OF ADVANCED IND SCIEN , MITSUBISHI HEAVY IND LTD
发明人： UTSUMI JUN , GOTO TAKAYUKI , IDE KENSUKE , TAKAGI HIDEKI , FUNAYAMA MASAHIRO
IPC分类号： H01L21/02 , B23K20/00 , H01L23/02 , H01L27/14 , H01L31/02
摘要： A device is provided with a first substrate whose main component is silicon dioxide; a second substrate whose main component is silicon or a compound semiconductor or silicon dioxide or a fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate through the bonding functional intermediate layer by room-temperature bonding wherein a first surface of the first substrate to which sputtering is performed is brought into contact with a second surface of the second substrate to which sputtering is performed. At this time, the material of the bonding functional intermediate layer is different from the main component of the first substrate and that of the second substrate and is selected from among light transmitting materials of an oxide, a fluoride and a nitride.

99. 发明专利

CA2660706A1 ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDINGAPPARATUS 未知
公开(公告)号：CA2660706A1
公开(公告)日：2008-03-13
申请号：CA2660706
申请日：2007-09-06
申请人： MITSUBISHI HEAVY IND LTD , AIST
发明人： GOTO TAKAYUKI , UTSUMI JUN , TAKAGI HIDEKI , IDE KENSUKE , FUNAYAMA MASAHIRO
IPC分类号： B23K20/00 , B23K20/14 , B23K20/24 , C23C14/34 , H01L21/02
摘要： A normal temperature joining method for joining substrates at a normal te mperature through intermediate members comprises a step of forming the inter mediate member on the surfaces to be joined of the substrates by physically sputtering targets and a step of activating the surfaces to be joined with a n ion beams. The target to be physically sputtered is preferably made of a p lurality of kinds of materials. Since the materials of the intermediate memb er are sputtered from the targets placed in various direction viewed from th e surfaces to be joined of the substrates, the intermediate member can be un iformly formed on the surfaces to be joined. Further, since the intermediate member is made of a plurality of kinds of materials, normal temperature joi ning of substrates which are hard to join even if an intermediate member is made of a single kind of material is possible without heating them during jo ining and without excessive press-bonding.

100. 发明专利

DE69213097D1 未知
公开(公告)号：DE69213097D1
公开(公告)日：1996-10-02
申请号：DE69213097
申请日：1992-05-20
申请人： MITSUBISHI HEAVY IND LTD , AGENCY IND SCIENCE TECHN
发明人： OKAZAKI YUICHI , ASANO SHIN , GOTO TAKAYUKI
IPC分类号： B23Q15/22 , G05B19/39 , G05D3/12 , G05D3/14
摘要： A positioning control method and apparatus in which a fine movement mechanism can be always moved without exceeding a movable area so that positioning of a large amount of displacement can be attained with high accuracy and high-speed positioning from a point to a point can be attained with the same control method are disclosed. The positioning control apparatus including a coarse movement mechanism 101 having a large amount of movement and low positioning accuracy and a fine movement mechanism 102 having a small amount of movement and high positioning accuracy supplies to the fine movement mechanism 101 a signal E4 based on a difference signal C4 of a movement command signal A4 and a displacement signal B4 representative of a displacement of an object to be positioned with respect to a fixed position detected by absolute position detecting means 105 and supplies to the coarse movement mechanism 101 a coarse movement command signal M4 produced by adding a signal representative of a relative displacement of the fine movement mechanism 102 with respect to the coarse movement mechanism 101 detected by relative position detecting means 133 to the difference signal C4 to thereby control respective movements.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式