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91. 发明申请

US20090139869A1 EFAB Methods and Apparatus Including Spray Metal or Powder Coating Processes 审中-公开
标题翻译：包括喷涂金属或粉末涂层工艺的EFAB方法和设备
公开(公告)号：US20090139869A1
公开(公告)日：2009-06-04
申请号：US12324135
申请日：2008-11-26
申请人： Michael S. Lockard , Adam L. Cohen , Roger W. Barton
发明人： Michael S. Lockard , Adam L. Cohen , Roger W. Barton
IPC分类号： C25D5/02 , C25D5/10 , C25D5/48
CPC分类号： C23C4/02 , C25D1/00 , C25D1/003
摘要： Various embodiments of the invention present techniques for forming structures via a combined electrochemical fabrication process and a thermal spraying process or powder deposition processes. In a first set of embodiments, selective deposition occurs via masking processes (e.g. a contact masking process or adhered mask process) and thermal spraying or powder deposition is used in blanket deposition processes to fill in voids left by selective deposition processes. In a second set of embodiments, after selective deposition of a first material, a second material is blanket deposited to fill in the voids, the two depositions are planarized to a common level and then a portion of the first or second materials is removed (e.g. by etching) and a third material is sprayed into the voids left by the etching operation. In both embodiments the resulting depositions are planarized to a desired layer thickness in preparation for adding additional layers.
摘要翻译：本发明的各种实施例提出了通过组合的电化学制造工艺和热喷涂工艺或粉末沉积工艺形成结构的技术。在第一组实施例中，通过掩模工艺（例如接触掩模工艺或粘附的掩模工艺）进行选择性沉积，并且在覆盖沉积工艺中使用热喷涂或粉末沉积来填充通过选择性沉积工艺留下的空隙。在第二组实施例中，在选择性沉积第一材料之后，第二材料被覆盖沉积以填充空隙，将两个沉积物平坦化到共同的水平，然后去除第一或第二材料的一部分（例如通过蚀刻），并且通过蚀刻操作将第三材料喷射到留下的空隙中。在两个实施方案中，将所得沉积物平坦化至所需的层厚度，以准备添加另外的层。

92. 发明授权

US07531077B2 Electrochemical fabrication process for forming multilayer multimaterial microprobe structures 有权
标题翻译：用于形成多层多材料微探针结构的电化学制造工艺
公开(公告)号：US07531077B2
公开(公告)日：2009-05-12
申请号：US11029221
申请日：2005-01-03
申请人： Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Ananda H. Kumar , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02
CPC分类号： G01R1/06716 , B33Y10/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/0483 , G01R1/07357 , G01R31/2886
摘要： Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.
摘要翻译：本发明的一些实施方案涉及由芯材料和部分涂覆探针的表面的材料形成的微针的电化学制造。其它实施方案涉及由核心材料形成的微结构的电化学制造，以及完全涂覆形成探针的每个层的表面的材料，包括中间层区域。这些前两组实施例在形成每个层期间都包括芯材料和涂层材料。其他实施例涉及在后层形成涂覆工艺期间由电介质材料部分封装的微探针阵列的电化学制造。在甚至进一步的实施方案中，来自两种或更多种材料的微结构的电化学制造可以通过在结构的每一层周围并入涂层材料而不将涂层材料定位在层间区域中而进行。

93. 发明授权

US07501328B2 Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization 有权
标题翻译：使用粘附的掩模电化学制造结构的方法，包括电介质片，和/或通过平面化部分去除的种子层
公开(公告)号：US07501328B2
公开(公告)日：2009-03-10
申请号：US11139262
申请日：2005-05-26
申请人： Michael S. Lockard , Dennis R. Smalley , Willa M. Larsen , Richard T. Chen
发明人： Michael S. Lockard , Dennis R. Smalley , Willa M. Larsen , Richard T. Chen
IPC分类号： H01L21/326 , H01L21/479
CPC分类号： C25D1/003 , B33Y10/00 , B81C1/00492 , C23C18/1605 , C25D5/022 , C25D5/10 , H01L21/2885 , H01L21/7682 , H01L21/76838 , H01L21/76877 , H01L21/76885 , Y10T156/10 , Y10T156/1041
摘要： Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate sheets of dielectric material and/or wherein seed layer material used to allow electrodeposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device.
摘要翻译：本发明的实施例提供中尺度或微尺寸的三维结构（例如部件，装置等）。实施例涉及以下一个或多个（1）形成这样的结构，其结合了介电材料片和/或其中用于允许通过电介质材料的电沉积的种子层材料通过平面化操作被去除; （2）形成这样的结构，其中用于至少一些选择性图案化操作的掩模通过将掩模材料转移到衬底或先前形成的层的表面获得，和/或（3）形成这样的结构，其中掩模用于形成至少部分一些层的图案直接来自表示掩模配置的数据在构建表面上图案化，例如在一些实施例中，通过经由计算机控制的喷墨喷嘴或阵列或经由计算机控制的挤出装置选择性地分配材料来实现掩模图案化。

94. 发明授权

US07412767B2 Microprobe tips and methods for making 有权
标题翻译：微型笔尖和制作方法
公开(公告)号：US07412767B2
公开(公告)日：2008-08-19
申请号：US11029217
申请日：2005-01-03
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
IPC分类号： H01R43/02 , H01R9/00
CPC分类号： G01R1/0483 , G01R1/06716 , G01R1/07357 , G01R31/2886 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49211 , Y10T29/49213
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

95. 发明授权

US07239219B2 Miniature RF and microwave components and methods for fabricating such components 有权
标题翻译：微型RF和微波组件以及用于制造这些部件的方法
公开(公告)号：US07239219B2
公开(公告)日：2007-07-03
申请号：US10607931
申请日：2003-06-27
申请人： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
发明人： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
IPC分类号： H01P9/00 , H01P3/00 , H01P3/06
CPC分类号： B81C1/00126 , B33Y70/00 , B33Y80/00 , B81B2201/0292 , B81C2201/0109 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H01P11/007 , H01Q3/40 , H01Q21/0006 , H01Q21/065 , H05K3/4647
摘要： RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
摘要翻译：提供RF和微波辐射引导或控制部件，其可以是单片的，其可以由多个电沉积操作和/或从多个沉积的材料层形成，其可以包括开关，电感器，天线，传输线，滤波器，混合耦合器，天线阵列和/或其他主动或无源部件。部件可以包括用于将牺牲材料与结构材料分离的非辐射入口和非辐射出口通道。优选的形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平坦化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。

96. 发明授权

US07195989B2 Electrochemical fabrication methods using transfer plating of masks 有权
标题翻译：使用掩膜转移电镀的电化学制造方法
公开(公告)号：US07195989B2
公开(公告)日：2007-03-27
申请号：US10841383
申请日：2004-05-07
申请人： Michael S. Lockard , Dennis R. Smalley
发明人： Michael S. Lockard , Dennis R. Smalley
IPC分类号： H01L21/326 , H01L21/479
CPC分类号： C25D1/003 , B33Y10/00 , C23C18/1605 , C23C18/1657 , C25D5/022 , C25D5/10 , H01L21/7682 , H01L21/76838
摘要： Three-dimensional structures are electrochemically fabricated by depositing a first material onto previously deposited material through voids in a patterned mask where the patterned mask is at least temporarily adhered to a substrate or previously formed layer of material and is formed and patterned onto the substrate via a transfer tool patterned to enable transfer of a desired pattern of precursor masking material. In some embodiments the precursor material is transformed into masking material after transfer to the substrate while in other embodiments the precursor is transformed during or before transfer. In some embodiments layers are formed one on top of another to build up multi-layer structures. In some embodiments the mask material acts as a build material while in other embodiments the mask material is replaced each layer by a different material which may, for example, be conductive or dielectric.
摘要翻译：三维结构通过在图案化掩模中通过空隙沉积到先前沉积的材料上的电化学制造，其中图案化掩模至少暂时粘附到基底或先前形成的材料层，并且经由转印工具被图案化以能够转移所需的前体掩模材料图案。在一些实施方案中，前体材料在转移到基底之后被转化成掩模材料，而在其它实施方案中，前体在转移期间或之前被转化。在一些实施例中，层之间形成一层，以构建多层结构。在一些实施例中，掩模材料用作构建材料，而在其它实施例中，掩模材料由例如导电或电介质的不同材料替换每层。

97. 发明授权

US07109118B2 Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures 有权
公开(公告)号：US07109118B2
公开(公告)日：2006-09-19
申请号：US10841100
申请日：2004-05-07
申请人： Adam L. Cohen , Dennis R. Smalley , Michael S. Lockard , Qui T. Le
发明人： Adam L. Cohen , Dennis R. Smalley , Michael S. Lockard , Qui T. Le
IPC分类号： H01L21/311
CPC分类号： H01L21/288 , B33Y10/00 , C23C18/1605 , C25D5/022 , C25D5/10 , H01L21/311 , H01L21/7682 , H01L21/76879
摘要： A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e.g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.

98. 发明授权

US06305769B1 Selective deposition modeling system and method 失效
标题翻译：选择性沉积建模系统及方法
公开(公告)号：US06305769B1
公开(公告)日：2001-10-23
申请号：US08876001
申请日：1997-06-13
申请人： Jeffrey S. Thayer , Thomas A. Almquist , Christian M. Merot , Bryan J. L. Bedal , Richard N. Leyden , Keith Denison , John S. Stockwell , Anthony L. Caruso , Michael S. Lockard
发明人： Jeffrey S. Thayer , Thomas A. Almquist , Christian M. Merot , Bryan J. L. Bedal , Richard N. Leyden , Keith Denison , John S. Stockwell , Anthony L. Caruso , Michael S. Lockard
IPC分类号： B41J201
CPC分类号： B29C64/40 , B29C64/112 , B33Y10/00 , B33Y30/00 , B33Y40/00
摘要： A system and associated method for forming three-dimensional objects under computer control and from a material which may be rendered flowable and then dispensed on a layer-by-layer basis. The layers of the material solidify or otherwise physically transform upon being dispensed thereby forming successive cross-sections. The dispensing process is repeated whereby successive layers adhere to each other thereby forming the object.
摘要翻译：一种用于在计算机控制下形成三维物体的系统和相关方法，以及可以使其流动并随后逐层分配的材料。材料层在分配时固化或以其他方式物理转化，从而形成连续的横截面。重复分配过程，由此连续的层彼此粘附从而形成物体。

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