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91. 发明申请

US20120008553A1 Wireless access system 有权
标题翻译：无线接入系统
公开(公告)号：US20120008553A1
公开(公告)日：2012-01-12
申请号：US13067440
申请日：2011-06-01
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： H04W4/00
CPC分类号： H04W4/18 , H04W72/046 , H04W74/04
摘要： A wireless access system, including plural wireless control stations; a wireless terminal device to transmit and receive data to and from the plural wireless control stations, wherein the wireless control stations adjust with each other to reserve data transmission periods so as not to overlap with those of the other wireless control stations and transmit data in the reserved periods, and the wireless terminal device transmits data to at least one of the wireless control stations through space-division multiple access communication.
摘要翻译：一种无线接入系统，包括多个无线控制站; 无线终端装置，用于向多个无线控制站发送数据和从多个无线控制站接收数据，其中无线控制站相互调整以保留数据传输周期，以便不与其他无线控制站的数据重叠，并在保留时段，无线终端装置通过空分多址通信向至少一个无线控制站发送数据。

92. 发明授权

US07985294B2 Optical device and method of manufacturing the same 有权
标题翻译：光学装置及其制造方法
公开(公告)号：US07985294B2
公开(公告)日：2011-07-26
申请号：US11367261
申请日：2006-03-03
申请人： Futoshi Yamamoto , Katsutoshi Kondou , Junichiro Ichikawa , Masaru Nakamura , Sunao Kurimura , Shunji Takekawa , Kenji Kitamura
发明人： Futoshi Yamamoto , Katsutoshi Kondou , Junichiro Ichikawa , Masaru Nakamura , Sunao Kurimura , Shunji Takekawa , Kenji Kitamura
IPC分类号： C30B29/30
CPC分类号： G02B6/1342
摘要： An optical device and a method of manufacturing the optical device, with the method including the steps of forming a dopant layer on a stoichiometric lithium niobate single crystal substrate with Li to Nb mole composition ratio of 49.5% to 50.5%, and diffusing a dopant in the dopant layer into at least a portion of the stoichiometric lithium niobate single crystal substrate. The stoichiometric lithium niobate single crystal substrate includes 0.5 to 5 mol % of Mg. In the diffusing step, a heat treatment is performed at a diffusion temperature of 1000° C. to 1200° C. for a diffusion time of 3 hours to 24 hours in a dry atmosphere of at least one of O2, N2, Ar and He gas having a dew-point temperature of −35° C. or less.
摘要翻译：一种光学器件和光学器件的制造方法，其特征在于包括以下步骤：在化学计量比的铌酸锂单晶衬底上形成掺杂剂层，其中Li与Nb的摩尔组成比为49.5％至50.5％，并将掺杂剂扩散到该掺杂剂层至少部分化学计量的铌酸锂单晶衬底。化学计量的铌酸锂单晶衬底包含0.5-5mol％的Mg。在扩散步骤中，在O2，N2，Ar和He中的至少一种的干燥气氛中，在1000℃至1200℃的扩散温度下进行3小时至24小时的扩散时间的热处理露点温度为-35℃以下的气体。

93. 发明申请

US20110077081A1 GAME SYSTEM AND COMPUTER READABLE MEDIUM 有权
标题翻译：游戏系统和计算机可读介质
公开(公告)号：US20110077081A1
公开(公告)日：2011-03-31
申请号：US12893544
申请日：2010-09-29
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： A63F13/00 , A63F9/24
CPC分类号： A63F13/44 , A63F13/5375 , A63F13/54 , A63F13/814
摘要： There is provided a game system in which areas where operation instruction markers of each player influence each other. The game system 1 determines a division position DP of lane L where an operation instruction marker IM is displayed each time when a predetermined condition is satisfied during a game, and a size of display area DA of the lane of each player based on the determined division position DP. The game system 1 also determines the position of operation instruction marker IM corresponding to each operation timing 20 described in sequence data SD so that the position changes with the progress of music being reproduced, and displays a game image GI where the operation instruction markers IM corresponding to each players P are arranged in the display area DA corresponding to the player P.
摘要翻译：提供了一种游戏系统，其中每个玩家的操作指示标记的区域彼此影响。游戏系统1确定在每次游戏期间满足预定条件时每次显示操作指示标记IM的通道L的分割位置DP，以及基于所确定的分区的每个玩家的车道的显示区域DA的大小位置DP。游戏系统1还确定与顺序数据SD中描述的每个操作定时20相对应的操作指令标记IM的位置，使得位置随着正在再现的音乐的进行而改变，并且显示游戏图像GI，其中操作指令标记IM对应每个玩家P被布置在对应于玩家P的显示区域DA中。

94. 发明授权

US07910459B2 Method of manufacturing device having a UV-curable adhesive 有权
标题翻译：具有UV固化粘合剂的装置的制造方法
公开(公告)号：US07910459B2
公开(公告)日：2011-03-22
申请号：US12038224
申请日：2008-02-27
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/60 , B23K2103/42 , B23K2103/50 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/00
摘要： A method of manufacturing a device, including the steps of forming dividing grooves with a predetermined depth along planned dividing lines of a wafer, then grinding the back-side surface of the wafer to expose the dividing grooves on the back side, dividing the wafer into individual devices, attaching a UV-curable adhesive film to the backside surface of the wafer divided into the individual devices, adhering the adhesive film side of the wafer to a dicing tape attached to an annular frame, radiating UV rays from the face side of the wafer to cure those regions of the adhesive film which correspond to the dividing grooves, radiating a laser beam along the dividing grooves to divide the cured adhesive film on a device basis, and releasing the devices from the dicing tape, thereby picking up the devices.
摘要翻译：一种制造装置的方法，包括以下步骤：沿着晶片的分划线形成具有预定深度的分隔槽，然后研磨晶片的背面以暴露背侧的分隔槽，将晶片分成单独的装置，将可UV固化的粘合剂膜附着到分成各个装置的晶片的背面，将晶片的粘合剂膜侧粘附到附接到环形框架上的切割带，从其表面侧辐射紫外线晶片，以固化对应于分隔槽的粘合膜的那些区域，沿着分隔槽辐射激光束，以便在设备的基础上分割固化的粘合剂膜，并且从切割带释放装置，从而拾取装置。

95. 发明授权

US07858902B2 Wafer dividing method and laser beam processing machine 有权
标题翻译：晶圆分割法和激光束加工机
公开(公告)号：US07858902B2
公开(公告)日：2010-12-28
申请号：US12068334
申请日：2008-02-05
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： B23K26/36 , B23K26/40 , H01L21/301
CPC分类号： H01L21/78 , B23K26/042 , B23K26/40 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B28D5/0052
摘要： A method of dividing a wafer, comprising the steps of forming a deteriorated layer along streets in the inside of the wafer; affixing an adhesive film to the rear surface of the wafer; affixing the adhesive film side of the wafer to a dicing tape mounted on an annular frame; dividing the wafer into individual devices along the streets where the deteriorated layer has been formed by expanding the dicing tape; forming a dividing groove along the outer periphery of each individual device in the adhesive film by applying a laser beam through the spaces between adjacent devices while the dicing tape is expanded by carrying out the first tape expanding step; and dividing the adhesive film along the dividing grooves by further expanding the dicing tape from the state in which the first tape expanding step has been carried out.
摘要翻译：一种分割晶片的方法，包括以下步骤：沿晶片内部的街道形成劣化层; 将粘合剂膜粘附到晶片的后表面; 将晶片的粘合膜侧固定到安装在环形框架上的切割带; 通过扩大切割胶带，将晶圆分割成已形成劣化层的街道上的各个装置; 通过施加激光束穿过相邻装置之间的空间，沿着每个单独装置的外周形成分隔槽，同时通过执行第一带扩展步骤来扩大切割带; 并且通过从已经进行第一带扩展步骤的状态进一步扩大切割带，沿着分割槽分割粘合剂膜。

96. 发明授权

US07806768B2 Game system and method for controlling game system, game server device therefor, and game device therefor 有权
标题翻译：用于控制游戏系统的游戏系统和方法，游戏服务器装置及其游戏装置
公开(公告)号：US07806768B2
公开(公告)日：2010-10-05
申请号：US11667775
申请日：2005-10-24
申请人： Kenji Kobayashi , Masaru Nakamura , Ryuta Tamura
发明人： Kenji Kobayashi , Masaru Nakamura , Ryuta Tamura
IPC分类号： A63F13/00
CPC分类号： A63F13/87 , A63F13/12 , A63F13/34 , A63F13/79 , A63F2300/201 , A63F2300/5546 , A63F2300/572
摘要： A game server device (3) stores message information representing contents of a message sent by a player and a card ID identifying each of a plurality of players in association with each other. Each of plural game devices (1) reads from a card (2) a card ID for transmission to the game server device (3), receives individual information corresponding to the card ID for storage, and transmits the individual information to an opponent participant's game device (1) so that the information is stored therein. Each game device (1), in a case in which an event is detected, displays a message represented by individual information that has been stored and requests an opponent participant's game device (1) to display the message. Furthermore, each game device (1), in a case in which the display of a message is requested from an opponent participant's game device (1), displays a message represented by individual information that has been stored.
摘要翻译：游戏服务器装置（3）存储表示由玩家发送的消息的内容的消息信息和识别多个玩家的每个玩家的卡ID。多个游戏装置（1）中的每一个从卡（2）读取用于发送给游戏服务器装置（3）的卡ID，接收与卡ID相对应的个人信息进行存储，并将该个人信息发送给对方参与者的游戏设备（1），使得信息被存储在其中。每个游戏装置（1）在检测到事件的情况下显示由存储的个人信息表示的消息，并请求对方参与者的游戏装置（1）显示消息。此外，在从对方参与者的游戏装置（1）请求显示消息的情况下，每个游戏装置（1）显示由存储的个人信息表示的消息。

97. 发明申请

US20100039912A1 OPTICAL INFORMATION RECORDING/REPRODUCING UNIT AND METHOD OF MEASURING RECORDED-MARK QUALITY 审中-公开
标题翻译：光学信息记录/再现单元和测量记录质量的方法
公开(公告)号：US20100039912A1
公开(公告)日：2010-02-18
申请号：US12439894
申请日：2007-09-11
申请人： Masaki Nakano , Masatsugu Ogawa , Masaru Nakamura
发明人： Masaki Nakano , Masatsugu Ogawa , Masaru Nakamura
IPC分类号： G11B27/36
CPC分类号： G11B20/10009 , G11B20/10046 , G11B20/10055 , G11B20/1012 , G11B20/10296 , G11B2220/2537
摘要： An equalizer (22) performs a PR equalization of a reproduced signal waveform output from an A/D converter (21). A reference-waveform generation unit (42) generates a reference reproduced-waveform based on a recording data train estimated from the reproduced signal waveform by a recognition unit (30). An equalization-error calculation unit (43) calculates an equalization error between the reference reproduced-waveform and the reproduced signal waveform. A transient equalization-error detector (44) extracts equalization error information, as a transient equalization error, at the time instant at which the reference reproduced-waveform assumes a specific level, and at which the specific level-value and a level-value of the reference reproduced-waveform at one channel clock before or after the time instant satisfy therebetween a specific relative relationship. The extracted transient equalization error is used as an index showing the quality of the recorded mark.
摘要翻译：均衡器（22）执行从A / D转换器（21）输出的再现信号波形的PR均衡。参考波形生成单元（42）基于由再现信号波形由识别单元（30）估计的记录数据序列，生成基准再现波形。均衡误差计算单元（43）计算参考再现波形和再现信号波形之间的均衡误差。瞬时均衡误差检测器（44）在参考再现波形呈现特定电平的时刻提取作为瞬态均衡误差的均衡误差信息，并且在该均衡误差信息中，特定电平值和电平值在时间之前或之后的一个通道时钟的参考再生波形满足其特定的相对关系。提取的瞬态均衡误差用作显示记录标记质量的指标。

98. 发明授权

US07622366B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07622366B2
公开(公告)日：2009-11-24
申请号：US12248441
申请日：2008-10-09
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , B23K26/009 , B23K26/364 , B23K26/40 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H01L21/67132 , H01L21/6835 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/0635 , H01L2924/00 , H01L2924/3512
摘要： A method of manufacturing a semiconductor device by which a wafer with devices formed in a plurality of regions demarcated by a plurality of streets formed in a grid pattern in the face-side surface of the wafer is divided along the streets into individual devices, and an adhesive film for die bonding is attached to the back-side surface of each of the devices. The adhesive film is attached to the back-side surface of the wafer divided into individual devices by exposing cut grooves formed along the streets by a dicing-before-grinding method, and thereafter the adhesive film is irradiated with a laser beam along the cut grooves through the cut grooves from the side of a protective tape adhered to the face-side surface of the wafer, so as to fusion-cut the adhesive film along the cut grooves.
摘要翻译：一种制造半导体器件的方法，通过该半导体器件，将形成在通过在晶片的面侧表面中形成为格栅图案的多个街道所划分的多个区域中的器件的晶片沿着街道划分为单独的器件，用于管芯接合的粘合膜附着到每个器件的背面。通过用切割前研磨方法露出沿着街道形成的切割槽，将粘合膜附着到分离成各个装置的晶片的背面，然后沿切割槽照射激光束通过从粘附到晶片的表面侧的保护带侧的切割槽，沿着切割槽对粘合膜进行熔融切割。

99. 发明申请

US20090280894A1 Game System, Server Apparatus, Terminal, And Computer Program Product 审中-公开
标题翻译：游戏系统，服务器设备，终端和计算机程序产品
公开(公告)号：US20090280894A1
公开(公告)日：2009-11-12
申请号：US12065897
申请日：2006-08-31
申请人： Kenji Kobayashi , Yukizumi Terao , Yukihiro Sato , Masaru Nakamura
发明人： Kenji Kobayashi , Yukizumi Terao , Yukihiro Sato , Masaru Nakamura
IPC分类号： A63F13/12 , A63F9/24
CPC分类号： A63F13/795 , A63F13/12 , A63F13/332 , A63F13/35 , A63F13/71 , A63F13/95 , A63F2300/206 , A63F2300/208 , A63F2300/406 , A63F2300/50 , A63F2300/556 , A63F2300/572
摘要： In a game system, a server apparatus (3) that communicates with a plurality of game devices (1) receives a play data element and a card ID of a card (2) whenever a player plays using any of the game devices (1) using the card (2), and generates terminal-provided play data elements indicating the skill of the player in the game on the basis thereof. The server apparatus (3) stores the terminal-provided play data element, the card ID, and a date data item indicating the current date in such a manner that they are mutually associated. The server apparatus (3) transmits, to a mobile terminal (4), which is owned by a second player who designates a first player as the second player's friend, various pieces of information. The information includes date data items indicating dates on which the first player played within a first period, other date data items indicating dates on which the first player played within a second period, and terminal-provided play data elements of the first player which correspond to the other date data items.
摘要翻译：在游戏系统中，无论何时游戏玩家使用游戏装置（1）进行游戏，与多个游戏装置（1）通信的服务器装置（3）接收卡（2）的播放数据元素和卡片ID，使用卡（2），并且基于此，生成指示游戏者的技能的终端提供的播放数据元素。服务器装置（3）以与它们相互关联的方式存储终端提供的播放数据元素，卡片ID和表示当前日期的日期数据项目。服务器装置（3）向作为第二玩家的朋友指定第一玩家的第二玩家拥有的移动终端（4）发送各种信息。信息包括指示第一玩家在第一时段内玩的日期的日期数据项，指示第一玩家在第二时段内玩的日期的其他日期数据项，以及对应于第一玩家的终端提供的玩家数据元素其他日期数据项。

100. 发明申请

US20090215245A1 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US20090215245A1
公开(公告)日：2009-08-27
申请号：US12379523
申请日：2009-02-24
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： H01L21/78
CPC分类号： B28D5/0011 , B23K26/032 , B23K26/40 , B23K26/53 , B23K2103/50 , H01L21/78 , Y10S438/94
摘要： A method of dividing a wafer having a plurality of streets, which are formed in a lattice pattern on the front surface, and having devices, which are formed in a plurality of areas sectioned by the plurality of streets, into individual devices along the streets, comprising: a protective member-affixing step for affixing a protective member for protecting devices onto the front surface of the wafer; a deteriorated layer-forming step for applying a laser beam of a wavelength having permeability for the wafer from the rear surface side of the wafer along the streets to form a deteriorated layer along the streets in an area where it does not reach the final thickness of each device from the front surface of the wafer and the rear surface of the wafer in the inside of the wafer; a groove-forming step for cutting areas corresponding to the streets from the rear surface side of the wafer where the deteriorated layer has been formed along the streets to form a groove reaching the deteriorated layer; a dividing the wafer into individual devices along the streets where the deteriorated layer and the groove have been formed by exerting external force to the wafer; and a grinding the rear surface of the wafer which has been divided into individual devices until the final thickness of each device is achieved.
摘要翻译：一种分割具有多个街道的晶片的方法，所述多个街道在前表面上形成为格子图案，并且具有形成在由多个街道划分的多个区域中的装置沿着街道形成单独的装置，包括：保护构件固定步骤，用于将用于保护装置的保护构件固定在晶片的前表面上; 劣化的层形成步骤，用于沿着街道从晶片的后表面侧施加具有晶片渗透率的波长的激光束，以在其未达到最终厚度的区域沿街道形成劣化层每个器件从晶片的前表面和晶片的后表面在晶片的内部; 槽形成步骤，用于沿着街道从已经形成有劣化层的晶片的背面侧切割与街道相对应的区域，以形成到达劣化层的槽; 通过向晶片施加外力，将晶片分成沿着街道的各种装置，其中形成了劣化层和凹槽; 以及研磨已经被分成各个装置的晶片的后表面，直到实现每个装置的最终厚度。

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