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91. 发明申请

US20090032998A1 MOLDING APPARATUS AND MOLDING METHOD 有权
公开(公告)号：US20090032998A1
公开(公告)日：2009-02-05
申请号：US12238617
申请日：2008-09-26
申请人： Junichi Seki
发明人： Junichi Seki
IPC分类号： B28B11/08
CPC分类号： B29C43/222 , B29C43/003 , B29C43/28 , B29C2043/025 , B29C2043/463 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： A molding apparatus for patterning a workpiece includes a first support member for supporting the mold, a second support member arranged opposite to the first support member, and a pressing mechanism for pressing the mold and the work together using the support members to pattern the workpiece. In this structure, either the surface of the first support member for supporting the mold or the surface of the second support member for supporting the workpiece is smaller in area than both surfaces of the mold and the workpiece.

92. 发明申请

US20090004321A1 MOLDING APPARATUS AND MOLDING METHOD 有权
标题翻译：成型设备和成型方法
公开(公告)号：US20090004321A1
公开(公告)日：2009-01-01
申请号：US12201143
申请日：2008-08-29
申请人： Junichi Seki
发明人： Junichi Seki
IPC分类号： B29C59/02
CPC分类号： B29C43/222 , B29C43/003 , B29C43/28 , B29C2043/025 , B29C2043/463 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： A molding apparatus for patterning a workpiece includes a first support member for supporting the mold, a second support member arranged opposite to the first support member, and a pressing mechanism for pressing the mold and the work together using the support members to pattern the workpiece. In this structure, either the surface of the first support member for supporting the mold or the surface of the second support member for supporting the workpiece is smaller in area than both surfaces of the mold and the workpiece.
摘要翻译：用于图案化工件的成型装置包括用于支撑模具的第一支撑构件，与第一支撑构件相对设置的第二支撑构件，以及使用支撑构件对模具进行加压并将工件图案化的加压机构。在该结构中，用于支撑模具的第一支撑构件的表面或用于支撑工件的第二支撑构件的表面的面积比模具和工件的两个表面小。

93. 发明授权

US07442028B2 Molding apparatus and molding method 有权
标题翻译：成型设备及成型方法
公开(公告)号：US07442028B2
公开(公告)日：2008-10-28
申请号：US11059330
申请日：2005-02-17
申请人： Junichi Seki
发明人： Junichi Seki
IPC分类号： B29C59/00
CPC分类号： B29C43/222 , B29C43/003 , B29C43/28 , B29C2043/025 , B29C2043/463 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： A molding apparatus for patterning a workpiece includes a first support member for supporting the mold, a second support member arranged opposite to the first support member, and a pressing mechanism for pressing the mold and the work together using the support members to pattern the workpiece. In this structure, either the surface of the first support member for supporting the mold or the surface of the second support member for supporting the workpiece is smaller in area than both surfaces of the mold and the workpiece.
摘要翻译：用于图案化工件的成型装置包括用于支撑模具的第一支撑构件，与第一支撑构件相对设置的第二支撑构件，以及使用支撑构件对模具进行加压并将工件图案化的加压机构。在该结构中，用于支撑模具的第一支撑构件的表面或用于支撑工件的第二支撑构件的表面的面积比模具和工件的两个表面小。

94. 发明授权

US07422981B2 Method for manufacturing semiconductor device by using dual damascene process and method for manufacturing article having communicating hole 有权
标题翻译：通过使用双镶嵌工艺制造半导体器件的方法和用于制造具有连通孔的制品的方法
公开(公告)号：US07422981B2
公开(公告)日：2008-09-09
申请号：US11606874
申请日：2006-12-01
申请人： Atsunori Terasaki , Junichi Seki , Ichiro Tanaka
发明人： Atsunori Terasaki , Junichi Seki , Ichiro Tanaka
IPC分类号： H01L21/44
CPC分类号： H01L21/76835 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L21/76807 , H01L21/76808 , H01L21/76817
摘要： A method for manufacturing a semiconductor device is provided, in which the lengths of a wiring trench and a via hole in a depth direction are easily controlled. A component having a first insulating film is prepared on a substrate, and a layer is disposed on the above-described first insulating film. A mold having a pattern is imprinted on the above-described layer so as to form a second insulating film having a wiring trench and a first via, the pattern corresponding to the wiring trench and the first via. Thereafter, the above-described first insulating film is etched by using the above-described second insulating film as a mask so as to form a second via, which is connected to the first via, in the first insulating film.
摘要翻译：提供一种制造半导体器件的方法，其中容易控制布线沟槽和通孔在深度方向上的长度。在基板上制备具有第一绝缘膜的部件，在上述第一绝缘膜上设置有层。具有图案的模具被印刷在上述层上，以形成具有布线沟槽和第一通孔的第二绝缘膜，该图案对应于布线沟槽和第一通孔。此后，通过使用上述第二绝缘膜作为掩模来蚀刻上述第一绝缘膜，以便在第一绝缘膜中形成连接到第一通孔的第二通孔。

95. 发明申请

US20080131550A1 Mold and Molding Apparatus Using the Same 失效
公开(公告)号：US20080131550A1
公开(公告)日：2008-06-05
申请号：US12024338
申请日：2008-02-01
申请人： Junichi Seki , Tohru Den
发明人： Junichi Seki , Tohru Den
IPC分类号： B28B11/10
CPC分类号： G03F7/0002 , B29C35/02 , B29C43/003 , B29C43/021 , B29C59/002 , B29C59/022 , B29C2043/025 , B29C2043/3634 , B29C2059/023 , B81C99/0085 , B81C2201/034 , B82Y10/00 , B82Y40/00
摘要： A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first support member, for supporting the workpiece. A pressing mechanism brings the first and second support members close to each other and presses the mold and the workpiece together so as to transfer, to the workpiece, the pattern on the mold. Recessed portions are provided on at least one of a surface of the mold on the first support member side, a region of the first support member, and a region of the second support member. The recessed portions correspond to recesses in the pattern of the mold.

96. 发明申请

US20070158559A1 SCANNING PROBE APPARATUS 失效
标题翻译：扫描探测器
公开(公告)号：US20070158559A1
公开(公告)日：2007-07-12
申请号：US11612104
申请日：2006-12-18
申请人： Takao KUSAKA , Nobuki YOSHIMATSU , Susumu YASUDA , Junichi Seki
发明人： Takao KUSAKA , Nobuki YOSHIMATSU , Susumu YASUDA , Junichi Seki
IPC分类号： G21K7/00
CPC分类号： G01Q70/04 , G01Q10/04 , Y10S977/849 , Y10S977/85 , Y10S977/851
摘要： In a scanning probe apparatus capable of always effectively canceling an inertial force to suppress vibration even in repetitive use while replacing a sample holding table or a probe, a stage for a sample or the probe includes a drive element for moving the sample holding table and movable portions movable in a direction in which an inertial force generated during movement of the sample holding table. The stage is configured so that the drive element, the movable portions, and the sample holding table or the probe are integrally detachably mountable to a main assembly of the scanning probe apparatus.
摘要翻译：在替代样品保持台或探针的同时能够始终有效地抵消惯性力以抑制振动的扫描探针装置中，用于样品或探针的载物台包括用于移动样品保持台并可移动的驱动元件可在样品保持台移动期间产生的惯性力的方向移动的部分。台架构造为使得驱动元件，可移动部分和样品保持台或探针可整体地可拆卸地安装在扫描探针装置的主组件上。

97. 发明申请

US20070054097A1 MOLD, IMPRINT APPARATUS, AND PROCESS FOR PRODUCING STRUCTURE 有权
标题翻译：模具，印刷装置和生产结构的过程
公开(公告)号：US20070054097A1
公开(公告)日：2007-03-08
申请号：US11468870
申请日：2006-08-31
申请人： Nobuhito Suehira , Junichi Seki
发明人： Nobuhito Suehira , Junichi Seki
IPC分类号： B41M5/00
CPC分类号： B29C35/0894 , B29C59/022 , B29C2035/0827 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002 , Y10T428/24802
摘要： In order to alleviate or suppress curing of a photocurable resin material in an area in which the curing of the photocurable resin material is not intended, exposure of the photocurable resin material to light is suppressed through a non-pattern portion at which a light-blocking member is provided by means of a mold having an imprint pattern portion and the non-pattern portion or is suppressed by disposing a light-blocking member so as not to irradiate the photocurable resin material with light not via the mold.
摘要翻译：为了减轻或抑制光固化树脂材料在不需要光固化树脂材料的固化的区域中的固化，可光固化树脂材料对光的曝光通过遮光的非图案部分被抑制构件通过具有压印图案部分和非图案部分的模具提供，或者通过设置遮光构件来抑制，以便不通过模具照射光可光固化树脂材料。

98. 发明申请

US20060290256A1 Panel 审中-公开
标题翻译：面板
公开(公告)号：US20060290256A1
公开(公告)日：2006-12-28
申请号：US11342660
申请日：2006-01-31
申请人： Junichi Seki , Yukihiro Azuma
发明人： Junichi Seki , Yukihiro Azuma
IPC分类号： H01J29/10
CPC分类号： H05B33/145
摘要： A panel comprises a substrate; a sealing plate opposing the substrate; a light-emitting device provided on a face opposing the sealing plate in the substrate; a plurality of spacers provided between the substrate and sealing plate so as to be in contact therewith and arranged about the light-emitting device; and a sealant layer, arranged between the substrate and sealing plate so as to bond the substrate and seating plate to each other, including the light-emitting device and spacers therewithin.
摘要翻译：面板包括基底; 与基板相对的密封板; 设置在与所述基板中的所述密封板相对的面上的发光装置; 设置在所述基板和密封板之间以与所述发光装置接触并且布置在所述发光装置周围的多个间隔件; 以及密封剂层，其布置在所述基板和密封板之间，以将所述基板和所述座板彼此结合，包括所述发光装置和间隔件。

99. 发明授权

US08361336B2 Imprint method for imprinting a pattern of a mold onto a resin material of a substrate and related substrate processing method 有权
标题翻译：用于将模具图案压印到基板的树脂材料上的印刷方法和相关的基板处理方法
公开(公告)号：US08361336B2
公开(公告)日：2013-01-29
申请号：US12282454
申请日：2008-08-01
申请人： Shingo Okushima , Junichi Seki , Haruhito Ono , Nao Nakatsuji , Atsunori Terasaki
发明人： Shingo Okushima , Junichi Seki , Haruhito Ono , Nao Nakatsuji , Atsunori Terasaki
IPC分类号： B44C1/22
CPC分类号： G03F7/0002 , B29C33/424 , B82Y10/00 , B82Y40/00
摘要： An imprint method for imprinting a pattern of a mold onto a resin material on a substrate. The imprint method includes a step of forming a processed area in which an imprint pattern corresponding to the pattern of the mold is formed, and an outside area formed of a periphery of the processed area, by bringing the mold into contact with the resin material formed on the substrate, so that a portion of the resin material is extruded from the processed area into the outside area, a step of forming a protection layer for protecting the processed area, and a step of removing a layer of the resin material in the outside area, while the imprint pattern formed on a layer of the resin material in the processed area, is protected by the protection layer, so as not to be removed.
摘要翻译：用于将模具图案压印在基板上的树脂材料上的压印方法。压印方法包括通过使模具与形成的树脂材料接触来形成其中形成与模具的图案相对应的压印图案的处理区域和由处理区域的周边形成的外部区域的步骤在基板上，使得一部分树脂材料从处理区域挤出到外部区域中，形成用于保护加工区域的保护层的步骤，以及在外部去除树脂材料层的步骤区域，而在处理区域中形成在树脂材料层上的印模图案被保护层保护，以便不被去除。

100. 发明授权

US08246887B2 Imprint method and process for producing a chip that change a relative position between a member to be processed and a support portion 有权
标题翻译：用于制造改变要处理的构件和支撑部分之间的相对位置的芯片的压印方法和工艺
公开(公告)号：US08246887B2
公开(公告)日：2012-08-21
申请号：US11876058
申请日：2007-10-22
申请人： Junichi Seki , Masao Majima , Nobuhito Suehira
发明人： Junichi Seki , Masao Majima , Nobuhito Suehira
IPC分类号： B28B5/02 , B28B11/08 , B29C59/00 , B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： An imprint method includes (i) holding a mold by a first holding portion, (ii) holding, by a second holding portion, a member to be processed so that the member to be processed is capable of bending by its own weight, (iii) supporting, by a support portion, a back surface of the member to be processed in a first area so that an amount of the bending is decreased, (iv) pressing a pattern of the mold against a front surface of the member to be processed, which is supported by the support portion in the first area, (v) supporting, by the support portion, the back surface of the member to be processed in a second area different from the first area, so that the amount of the bending is decreased, by changing a relative position between the member to be processed and the support portion, and (vi) pressing the pattern of the mold against the front surface of the member to be processed, which is supported by the support portion in the second area.
摘要翻译：压印方法包括：（i）通过第一保持部分保持模具，（ii）通过第二保持部分保持待加工的部件，使得待加工的部件能够通过其自重来弯曲，（iii ）通过支撑部分在第一区域中支撑待加工构件的后表面，使得弯曲量减少，（iv）将模具的图案压靠在待处理构件的前表面上，其由所述第一区域中的支撑部支撑，（v）由所述支撑部分在与所述第一区域不同的第二区域中支撑待加工构件的后表面，使得弯曲量为通过改变要处理的构件与支撑部之间的相对位置来减小，以及（vi）将模具的图案压靠在被处理构件的前表面上，该构件由第二区域中的支撑部分支撑。

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