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    • 100. 发明申请
    • Inductor integrated chip and fabrication method thereof
    • 电感集成芯片及其制造方法
    • US20070138594A1
    • 2007-06-21
    • US11473079
    • 2006-06-23
    • Joo-ho LeeHae-seok ParkByeoung-ju HaSeog-woo HongHyung ChoiIn-sang Song
    • Joo-ho LeeHae-seok ParkByeoung-ju HaSeog-woo HongHyung ChoiIn-sang Song
    • H01L29/00
    • H03H9/0542H03H9/105
    • An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.
    • 提供一种电感器集成芯片及其制造方法。 电感器集成芯片包括晶片; 结合在晶片表面上的电感器; 电路元件,其形成在所述晶片的表面上并且耦合到所述电感器的第一端; 连接到晶片表面并封装电感器和电路元件的封装晶片; 以及形成在封装晶片上并连接到电感器的第二端的连接电极。 该方法包括在晶片的表面上形成电感器和电路元件,其中电路元件耦合到电感器的第一端; 在封装晶片上形成连接电极; 并且通过接合晶片和封装晶片来封装电感器和电路元件,以将连接电极与电感器的第二端连接。