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    • 93. 发明申请
    • MANAGING THE CARBON FOOTPRINT OF A STRUCTURE
    • 管理结构的碳含量
    • US20130116803A1
    • 2013-05-09
    • US13288669
    • 2011-11-03
    • Daniel J. GmachTahir CaderCullen E. BashAmip J. ShahRatnesh K. Sharma
    • Daniel J. GmachTahir CaderCullen E. BashAmip J. ShahRatnesh K. Sharma
    • G05B13/02
    • G05B19/042
    • Carbon footprint management for structures is disclosed. In an example, a method includes determining a value of a first carbon footprint of the structure when operated at an existing demand for a first time period, and comparing the value of the first carbon footprint to a value of a prorated carbon cap of the structure for the first time period. If the first carbon footprint is less than or equal to the prorated carbon cap, the structure is operated for a second time period according to the existing demand or other demand that keeps a second carbon footprint of the structure below a prorated carbon cap for the second time period. Otherwise, the demand is adjusted to bring the second carbon footprint to approximate the prorated carbon cap for the second time period, and the structure is operated according to the adjusted demand for the second time period.
    • 披露了结构的碳足迹管理。 在一个示例中,一种方法包括当在第一时间段的现有需求下操作时确定结构的第一碳足迹的值,以及将第一碳足迹的值与该结构的分配碳帽的值进行比较 第一次。 如果第一个碳足迹小于或等于按比例分配的碳盖,则结构根据现有需求或其他需求运行第二个时间段,这将使结构的第二个碳足迹保持在比例分配的碳帽下面 时间段。 否则,调整需求,使第二次碳足迹在第二时间段内达到按比例分配的碳上限,结构按照第二次调整后的需求进行运行。
    • 100. 发明授权
    • Small form factor air jet cooling system
    • 小型空气喷射冷却系统
    • US07361081B2
    • 2008-04-22
    • US10898736
    • 2004-07-23
    • Abdlmonem H. BeitelmalChandrakant D. PatelCullen E. Bash
    • Abdlmonem H. BeitelmalChandrakant D. PatelCullen E. Bash
    • H05K5/02
    • H05K7/20727
    • An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cooling system is formed by a plenum pressurized by a blower. The plenum defines a plurality of configurable orifices in the chassis, each directing pressurized air toward a component. The plenum includes adjustable valves to controllably limit airflow through the orifices, and a controller to control the air pressure within the plenum and the orifice flow rates through the valves.
    • 外壳形成在纵向尺寸上垂直堆叠的多个层。 每个层是1U模块化计算机系统,其具有配置成安装在多层支持中的计算机机箱以及需要在计算机机箱内进行冷却的计算机组件。 冷却系统由通过鼓风机加压的增压室形成。 气室在底盘中限定了多个可配置的孔,每个将加压空气朝向组件。 气室包括可调节的阀门,以可控地限制通过孔口的气流,以及控制器来控制气室内的空气压力和通过阀门的孔口流量。