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    • 91. 发明申请
    • CONNECTOR FOR FLUID PRESSURE DEVICES
    • 流体压力装置连接器
    • US20100140921A1
    • 2010-06-10
    • US12598773
    • 2008-03-05
    • Shinichi Ito
    • Shinichi Ito
    • F16L55/00
    • F16L15/08F16L23/032
    • An adapter includes a base body including a pair of coupling members and a connecting plug inserted through a hole in the base body and screw-engaged with a port of the two-way valve. In addition, upon threaded engagement of the connecting plug, the base body is mounted with respect to an attachment surface of the two-way valve. Further, a seal member is installed on an end surface of the base body, such that a sealing function is performed by abutment of the seal member against the attachment surface. Moreover, first and second connecting flanges of a connecting apparatus are engaged with respect to the coupling members of the adapter.
    • 适配器包括基体,其包括一对联接构件和通过基体中的孔插入并与二通阀的端口螺纹接合的连接塞。 此外,在连接插头的螺纹接合时,基体相对于开闭阀的安装面安装。 此外,密封构件安装在基体的端面上,使得通过密封构件抵靠附接表面进行密封功能。 此外,连接装置的第一和第二连接凸缘相对于适配器的联接构件接合。
    • 92. 发明申请
    • Pattern forming method and method of manufacturing semiconductor device
    • 图案形成方法和制造半导体器件的方法
    • US20100099036A1
    • 2010-04-22
    • US12654295
    • 2009-12-16
    • Daisuke KawamuraShinichi Ito
    • Daisuke KawamuraShinichi Ito
    • G03F7/20
    • G03F7/11G03F7/70341G03F7/7065G03F7/70958Y10S430/162
    • A pattern forming method includes forming a resist film on a substrate, coating the resist film with a coating solution which forms a cover film on the resist film to form the cover film on the resist film, transferring a pattern onto the resist film by an immersion lithography method using a liquid immersion fluid to form a latent image on the resist film, removing the cover film after the formation of the latent image, conducting a first inspection to inspect whether or not the cover film has a defect between said forming the latent image and said removing the cover film, performing predetermined processing when the defect is found in the first inspection, and developing the resist film to form a resist pattern on the substrate after said removing the cover film.
    • 图案形成方法包括在基板上形成抗蚀剂膜,在抗蚀剂膜上形成覆盖膜的涂布溶液涂布抗蚀膜,在抗蚀剂膜上形成覆盖膜,通过浸渍将图案转印到抗蚀剂膜上 使用液浸液体在抗蚀剂膜上形成潜像的光刻方法,在形成潜像后去除覆盖膜,进行第一次检查以检查覆盖膜在形成潜像之间是否存在缺陷 并且在所述第一检查中发现所述缺陷时,移除所述覆盖膜,执行预定处理,以及在除去所述覆盖膜之后,在所述基板上显影所述抗蚀剂膜以形成抗蚀剂图案。
    • 95. 发明授权
    • Lithography apparatus, method of forming pattern and method of manufacturing semiconductor device
    • 平版印刷设备,形成图案的方法和制造半导体器件的方法
    • US07477353B2
    • 2009-01-13
    • US11174722
    • 2005-07-06
    • Shinichi ItoTsuyoshi Shibata
    • Shinichi ItoTsuyoshi Shibata
    • G03B27/42G03B27/52G03B27/32G03F7/00
    • G03F7/70991G03F7/70341G03F7/70858G03F7/70916G03F7/70925
    • A lithography apparatus includes a resist processing apparatus to perform a process of applying a resist on a substrate, a process of heating a resist film on the substrate, and a process of developing the resist film on the substrate, an immersion exposure apparatus including a projection optical system which projects an image of a pattern on a photomask onto the resist film and configured to perform exposure through liquid located on an optical path between the projection optical system and resist film, a transporting apparatus connected to the resist processing and immersion exposure apparatuses to perform transportation of the substrate between the resist processing and immersion exposure apparatuses, and a temperature/humidity control apparatus configured to control at least one of temperature and humidity in at least one of the resist processing and transporting apparatuses based on temperature and humidity or the in humidity the immersion exposure apparatus.
    • 光刻设备包括:抗蚀剂处理设备,用于执行在基板上施加抗蚀剂的工艺;加热基板上的抗蚀剂膜的工艺;以及在基板上显影抗蚀剂膜的工艺;浸渍曝光设备,包括:投影 光学系统,其将光掩模上的图案的图像投影到抗蚀剂膜上,并且被配置为通过位于投影光学系统和抗蚀剂膜之间的光路上的液体进行曝光,连接到抗蚀剂处理和浸没曝光装置的传送装置 在抗蚀剂处理和浸没曝光装置之间执行基板的传送,以及温度/湿度控制装置,其被配置为基于温度和湿度控制至少一个抗蚀剂处理和输送装置中的温度和湿度, 湿度浸渍曝光设备。
    • 96. 发明授权
    • Leak diagnosis system and leak diagnosis method
    • 泄漏诊断系统和泄漏诊断方法
    • US07472582B2
    • 2009-01-06
    • US11431651
    • 2006-05-11
    • Shinichi ItoNobuhiro Takano
    • Shinichi ItoNobuhiro Takano
    • G01M3/04
    • F02M25/0809
    • An ECU drives a pump in a first stage at a first pumping capacity. The ECU drives the pump in a second stage after the first stage at a second pumping capacity, which is lower than the first pumping capacity. The second pumping capacity is set such that when at least one leak hole, which forms a predetermined total opening cross sectional area, exists in the purge apparatus, the driving of the pump at the second pumping capacity substantially maintains a predetermined reference pressure in the purge apparatus. The ECU diagnoses whether a leak hole exits in the purge apparatus based on the pressure measured with the pressure sensor in view of the predetermined reference pressure at the time of driving the pump in the second stage at the second pumping capacity.
    • ECU以第一泵送能力在第一级驱动泵。 ECU在第一阶段之后的第二阶段中以比第一泵送能力低的第二泵送能力驱动泵。 第二抽吸能力设定成使得当在净化装置中存在至少一个形成预定总开口横截面面积的泄漏孔时,在第二抽水能力下的泵的驱动基本上保持了吹扫中的预定参考压力 仪器。 考虑到在第二阶段以第二泵送能力驱动泵时的预定参考压力,ECU基于在压力传感器测量的压力下,泄漏孔是否泄漏在净化装置中。