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    • 93. 发明申请
    • Optoelectronic Component
    • 光电元件
    • US20100327307A1
    • 2010-12-30
    • US12879130
    • 2010-09-10
    • Marcus RuhnauBert BraunePatrick KromotisGeorg Bogner
    • Marcus RuhnauBert BraunePatrick KromotisGeorg Bogner
    • H01L33/60
    • H01L33/486H01L31/0203H01L33/60H01L2224/48091H01L2224/48247H01L2924/00014
    • An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.
    • 具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片,特别是辐射发射或接收半导体芯片。 为了提高光电子部件的效率,在半导体芯片周围的区域的空腔内设置反射体。 这些反射体是由于填充化合物至少部分地填充到空腔中而形成的,填充化合物的材料和数量被选择为使得填充化合物由于 填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式,并且填充化合物的锥形内部区域用作反射器。
    • 95. 发明申请
    • LED ARRAY
    • LED阵列
    • US20090103297A1
    • 2009-04-23
    • US11816951
    • 2006-02-06
    • Georg BognerMoritz EnglStefan GrotschPatrick KromotisJorg Erich Sorg
    • Georg BognerMoritz EnglStefan GrotschPatrick KromotisJorg Erich Sorg
    • F21V33/00
    • H01L33/62H01L25/0753H01L33/42H01L33/505H01L33/507H01L2924/0002H01L2924/00
    • In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.
    • 在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中,由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合,以及对所发射的辐射透明的盖体, 透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线,并且半导体芯片各自包括在辐射输出耦合表面 ,至少一个电触点,其连接到所述导电迹线或所述多个导电迹线中的至少一个。 至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。
    • 96. 发明申请
    • Optoelectronic Component
    • 光电元件
    • US20090026482A1
    • 2009-01-29
    • US12242170
    • 2008-09-30
    • Marcus RUHNAUBert BraunePatrick KromotisGeorg Bogner
    • Marcus RUHNAUBert BraunePatrick KromotisGeorg Bogner
    • H01L33/00
    • H01L33/486H01L31/0203H01L33/60H01L2224/48091H01L2224/48247H01L2924/00014
    • An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.
    • 具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片,特别是辐射发射或接收半导体芯片。 为了提高光电子部件的效率,在半导体芯片周围的区域的空腔内设置反射体。 这些反射体是由于填充化合物至少部分地填充到空腔中而形成的,填充化合物的材料和数量被选择为使得填充化合物由于 填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式,并且填充化合物的锥形内部区域用作反射器。
    • 97. 发明授权
    • Light source
    • 光源
    • US07467885B2
    • 2008-12-23
    • US10834761
    • 2004-04-28
    • Stefan GrötschGeorg Bogner
    • Stefan GrötschGeorg Bogner
    • F21V7/04
    • H01L33/58G03B21/2033G03B21/208H04N9/3152H04N9/3164
    • A light source, such as for a projection system, having a plurality of semiconductor chips and at least two different, electromagnetic-radiation-emitting chip types with different emission spectra, each semiconductor chip having a chip coupling-out area through which radiation is coupled out. Furthermore, the light source has a plurality of primary optical elements, each semiconductor chip being assigned a primary optical element, which in each case has a light input and a light output and reduces the divergence of at least part of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips with the primary optical elements are arranged in at least two groups that are spatially separate from one another, with the result that the groups emit separate light cones during operation of the semiconductor chips. The separate light cones of the groups are superposed by means of a secondary optical arrangement to form a common light cone.
    • 诸如用于投影系统的光源,具有多个半导体芯片和具有不同发射光谱的至少两种不同的电磁辐射发射芯片类型,每个半导体芯片具有芯片耦合输出区域,辐射被耦合到该区域 出来 此外,光源具有多个主要光学元件,每个半导体芯片被分配一个主要光学元件,其在每种情况下具有光输入和光输出,并且减少半导体发射的辐射的至少一部分的发散度 芯片。 具有主要光学元件的半导体芯片被布置成在空间上彼此分离的至少两组,结果是在半导体芯片的操作期间这些组发射单独的光锥。 通过次级光学装置将组的分开的光锥叠加以形成公共的光锥。