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91. 发明申请

US20060126302A1 Apparatus for supporting cooling device 失效
标题翻译：用于支撑冷却装置的装置
公开(公告)号：US20060126302A1
公开(公告)日：2006-06-15
申请号：US11135745
申请日：2005-05-24
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Ping-An Yang , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Ping-An Yang , Meng Fu
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).
摘要翻译：一种用于在其上支撑冷却装置（30）的装置（1）包括托架（10）和在其上承载冷却装置（30）的鞍座（20）。支架（10）限定了两个相对的轨道（12），（13）和沿轨道（12），（13）延伸的方向延伸的洗衣板状构件（14）。所述鞍座（20）包括定位构件（26），所述定位构件（26）接合在所述盥洗板状构件（14）中，以将所述鞍座（20）定位到所述支架（10）以及可在所述轨道（12）上滑动的两个块（24），在定位构件（26）与盥洗板状构件（14）分离的条件下，支架（10）的底面（13）是13。

92. 发明授权

US07047640B2 Method of manufacturing a heat dissipating device 失效
标题翻译：制造散热装置的方法
公开(公告)号：US07047640B2
公开(公告)日：2006-05-23
申请号：US11069743
申请日：2005-03-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： B21D53/06 , B23P15/26
CPC分类号： B23K1/0012 , B23K2101/06 , B23K2101/14 , B23P2700/10 , F28D15/0275 , H01L21/4882 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49368 , Y10T29/49369 , Y10T29/49373 , Y10T29/49377 , Y10T29/49378 , Y10T29/49393 , H01L2924/00
摘要： A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.
摘要翻译：一种制造散热装置的方法，所述方法包括以下步骤：a）提供热管，固体焊料条和散热片，其中所述散热器包括在其一侧限定凹槽的基座; b）将焊条和热管依次放入散热器的槽中; c）加热熔化焊料条并同时按压热管以使热管的外表面与限定槽的所述一侧共面; 和d）冷却以实现散热装置，其中焊条均匀分布在热管和基座之间。

93. 发明申请

US20060059684A1 Method of manufacturing a heat dissipating device 失效
公开(公告)号：US20060059684A1
公开(公告)日：2006-03-23
申请号：US11069743
申请日：2005-03-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： B23P15/26 , B21D53/06
CPC分类号： B23K1/0012 , B23K2101/06 , B23K2101/14 , B23P2700/10 , F28D15/0275 , H01L21/4882 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49368 , Y10T29/49369 , Y10T29/49373 , Y10T29/49377 , Y10T29/49378 , Y10T29/49393 , H01L2924/00
摘要： A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

94. 发明申请

US20050201064A1 Locking device for heat dissipating device 失效
标题翻译：散热装置锁紧装置
公开(公告)号：US20050201064A1
公开(公告)日：2005-09-15
申请号：US10930550
申请日：2004-08-31
申请人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
发明人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
IPC分类号： H01L23/32 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/42 , Y10T24/44026 , H01L2924/00
摘要： A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a first locking member extending the heat sink and the circuit board and having a block for pressing the heat sink, an operating member pivotably connected to the first locking member, a second locking member extending the heat sink and the circuit board and pivotably connected to the operating member, and an actuating structure formed between the first and second locking members. The first and second locking members each includes a hook located below the circuit board. The operating member is pivotable about the first locking member to drive the second locking member to move upwardly and to cause the actuating structure to simultaneously drive the first and second locking members to move away from each other, whereby the hooks engage below the circuit board.
摘要翻译：一种用于将散热器安装到安装在印刷电路板上的CPU的锁定装置，包括延伸散热器和电路板并具有用于按压散热器的块的第一锁定构件，可枢转地连接到第一锁定件的操作构件构件，延伸所述散热器和所述电路板并可枢转地连接到所述操作构件的第二锁定构件，以及形成在所述第一和第二锁定构件之间的致动结构。第一和第二锁定构件各自包括位于电路板下方的钩。操作构件可围绕第一锁定构件枢转以驱动第二锁定构件向上移动，并且使致动构件同时驱动第一和第二锁定构件以彼此远离地移动，由此钩接合在电路板下方。

95. 发明申请

US20050135064A1 Locking device for heat dissipating device 失效
标题翻译：散热装置锁紧装置
公开(公告)号：US20050135064A1
公开(公告)日：2005-06-23
申请号：US10892796
申请日：2004-07-16
申请人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
发明人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
IPC分类号： H01L23/34 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/42 , H01L2924/00
摘要： A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and having a plurality of fasteners extending upwardly beyond the circuit board, and a plurality of retainers. Each retainer includes an operating member resting on a heat sink, a locking member extending through the operating member, and a pushing member extending through the locking member. The locking member includes a locking structure extending through the heat sink to engage with one of the fasteners. The pushing member includes a taper bottom portion. The pushing member is downward movable to cause the taper bottom portion to disengage the locking structure from the one of the fasteners.
摘要翻译：用于将散热器安装到安装在印刷电路板上的CPU的锁定装置包括安装在电路板下方并具有向上延伸超过电路板的多个紧固件的背板和多个保持器。每个保持器包括搁置在散热器上的操作构件，延伸穿过操作构件的锁定构件和延伸穿过锁定构件的推动构件。锁定构件包括延伸穿过散热器以与其中一个紧固件接合的锁定结构。推动构件包括锥形底部。推动构件向下移动以使得锥形底部部分将锁定结构与其中一个紧固件分离。

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