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    • 95. 发明申请
    • CMOS IMAGER PHOTODIODE WITH ENHANCED CAPACITANCE
    • 具有增强电容的CMOS IMAGER光电二极管
    • US20100084690A1
    • 2010-04-08
    • US12634898
    • 2009-12-10
    • James W. AdkissonJohn J. Ellis-MonaghanMark D. JaffeDale J. PearsonDennis L. Rogers
    • James W. AdkissonJohn J. Ellis-MonaghanMark D. JaffeDale J. PearsonDennis L. Rogers
    • H01L27/148H01L31/18
    • H01L27/14643H01L27/1463H01L27/14689H01L31/035281
    • A pixel sensor cell having a semiconductor substrate having a surface; a photosensitive element formed in a substrate having a non-laterally disposed charge collection region entirely isolated from a physical boundary including the substrate surface. The photosensitive element comprises a trench having sidewalls formed in the substrate of a first conductivity type material; a first doped layer of a second conductivity type material formed adjacent to at least one of the sidewalls; and a second doped layer of the first conductivity type material formed between the first doped layer and the at least one trench sidewall and formed at a surface of the substrate, the second doped layer isolating the first doped layer from the at least one trench sidewall and the substrate surface. In a further embodiment, an additional photosensitive element is provided that includes a laterally disposed charge collection region that contacts the non-laterally disposed charge collection region of the photosensitive element and underlies the doped layer formed at the substrate surface.
    • 一种像素传感器单元,具有具有表面的半导体衬底; 形成在具有与包括基板表面的物理边界完全隔离的非横向布置的电荷收集区域的基板中的感光元件。 感光元件包括具有形成在第一导电类型材料的衬底中的侧壁的沟槽; 与所述侧壁中的至少一个相邻形成的第二导电类型材料的第一掺杂层; 以及形成在所述第一掺杂层和所述至少一个沟槽侧壁之间且形成在所述衬底的表面处的所述第一导电类型材料的第二掺杂层,所述第二掺杂层将所述第一掺杂层与所述至少一个沟槽侧壁隔离, 基材表面。 在另一个实施例中,提供附加的光敏元件,其包括横向设置的电荷收集区域,其接触感光元件的非横向设置的电荷收集区域,并且位于在衬底表面形成的掺杂层的下方。
    • 97. 发明授权
    • Pixel sensor having doped isolation structure sidewall
    • 具有掺杂隔离结构侧壁的像素传感器
    • US07491561B2
    • 2009-02-17
    • US11563531
    • 2006-11-27
    • James W. AdkissonMark D. JaffeRobert K. Leidy
    • James W. AdkissonMark D. JaffeRobert K. Leidy
    • H01L21/84
    • H01L27/14603H01L27/1463H01L27/14643H01L27/14683
    • A novel pixel sensor structure formed on a substrate of a first conductivity type includes a photosensitive device of a second conductivity type and a surface pinning layer of the first conductivity type. A trench isolation structure is formed adjacent to the photosensitive device pinning layer. The trench isolation structure includes a dopant region comprising material of the first conductivity type selectively formed along a sidewall of the isolation structure that is adapted to electrically couple the surface pinning layer to the underlying substrate. The corresponding method for forming the dopant region selectively formed along the sidewall of the isolation structure comprises an out-diffusion process whereby dopant materials present in a doped material layer formed along selected portions in the trench are driven into the underlying substrate during an anneal. Alternately, or in conjunction, an angled ion implantation of dopant material in the isolation structure sidewall may be performed by first fabricating a photoresist layer and reducing its size by removing a corner, or a corner portion thereof, which may block the angled implant material.
    • 形成在第一导电类型的衬底上的新型像素传感器结构包括第二导电类型的光敏器件和第一导电类型的表面钉扎层。 在光敏器件钉扎层附近形成沟槽隔离结构。 沟槽隔离结构包括掺杂区域,该掺杂剂区域包括沿着隔离结构的侧壁选择性地形成的第一导电类型的材料,其适于将表面钉扎层电耦合到下面的衬底。 用于形成沿着隔离结构的侧壁选择性地形成的掺杂剂区域的相应方法包括外扩散工艺,由此在退火期间,存在于沿着沟槽中的选定部分形成的掺杂材料层中的掺杂剂材料被驱动到下面的衬底中。 替代地或结合地,隔离结构侧壁中的掺杂剂材料的成角度的离子注入可以通过首先制造光致抗蚀剂层并通过去除可能阻挡成角度的植入材料的角部或其角部来减小其尺寸来执行。
    • 99. 发明授权
    • Masked sidewall implant for image sensor
    • 用于图像传感器的蒙版侧植入物
    • US07098067B2
    • 2006-08-29
    • US10905043
    • 2004-12-13
    • James W. AdkissonMark D. JaffeArthur P. JohnsonRobert K. LeidyJeffrey C. Maling
    • James W. AdkissonMark D. JaffeArthur P. JohnsonRobert K. LeidyJeffrey C. Maling
    • H01L21/00
    • H01L27/14643H01L27/1463H01L27/14687H01L27/14689
    • A novel image sensor structure formed on a substrate of a first conductivity type includes a photosensitive device of a second conductivity type and a surface pinning layer of the first conductivity type. A trench isolation region is formed adjacent to the photosensitive device pinning layer. The structure includes a dopant region comprising material of the first conductivity type formed along a sidewall of the isolation region that is adapted to electrically couple the pinning layer to the substrate. The corresponding method facilitates an angled ion implantation of dopant material in the isolation region sidewall by first fabricating the photoresist layer and reducing its size by removing a corner, or a corner portion thereof, which may block the angled implant material. To facilitate the angled implant to the sidewall edge past resist block masks, two methods are proposed: 1) a spacer type etch of the imaged photoresist; or, 2) a corner sputter process of the imaged photoresist.
    • 形成在第一导电类型的衬底上的新型图像传感器结构包括第二导电类型的光敏器件和第一导电类型的表面钉扎层。 在光敏器件钉扎层附近形成沟槽隔离区。 该结构包括掺杂区域,该掺杂剂区域包括沿着隔离区域的侧壁形成的第一导电类型的材料,其适于将钉扎层电耦合到衬底。 相应的方法通过首先制造光致抗蚀剂层并且通过去除可能阻挡成角度的植入材料的角部或其角部来减小其尺寸来促进掺杂剂材料在隔离区域侧壁中的成角度的离子注入。 为了促进通过抗蚀剂阻挡掩模的侧壁边缘的成角度注入,提出了两种方法:1)成像光致抗蚀剂的间隔物型蚀刻; 或2)成像光致抗蚀剂的角溅射工艺。
    • 100. 发明申请
    • LOW LAG TRANSFER GATE DEVICE
    • LOW LAG传输闸门装置
    • US20090180010A1
    • 2009-07-16
    • US12013826
    • 2008-01-14
    • James W. AdkissonAndres BryantJohn J. Ellis-Monaghan
    • James W. AdkissonAndres BryantJohn J. Ellis-Monaghan
    • H04N3/14H01L31/18
    • H01L31/103H04N5/353H04N5/374H04N5/3745
    • A method of forming a CMOS active pixel sensor (APS) cell structure having at least one transfer gate device and method of operation. A first transfer gate device comprises a diodic or split transfer gate conductor structure having a first doped region of first conductivity type material and a second doped region of a second conductivity type material. A photosensing device is formed adjacent the first doped region for collecting charge carriers in response to light incident thereto, and, a diffusion region of a second conductivity type material is formed at or below the substrate surface adjacent the second doped region of the transfer gate device for receiving charges transferred from the photosensing device while preventing spillback of charges to the photosensing device upon timed voltage bias to the diodic or split transfer gate conductor structure. Alternately, an intermediate charge storage device and second transfer gate device may be provided which may first temporarily receive charge carriers from the photosensing device, and, upon activating the second transfer gate device in a further timed fashion, read out the charge stored at the intermediate charge storage device for transfer to the second transfer gate device while preventing spillback of charges to the photosensing device. The APS cell structure is further adapted for a global shutter mode of operation, and further comprises a light shield element is further provided to ensure no light reaches the photosensing and charge storage devices during charge transfer operation.
    • 一种形成具有至少一个传输栅极器件和操作方法的CMOS有源像素传感器(APS)单元结构的方法。 第一传输栅极器件包括具有第一导电类型材料的第一掺杂区域和第二导电类型材料的第二掺杂区域的二极或分裂传输栅极导体结构。 光敏装置形成在第一掺杂区域附近,用于响应于入射到其上的光而收集电荷载流子,并且第二导电类型材料的扩散区域形成在与传输栅极器件的第二掺杂区域相邻的衬底表面处或下方 用于接收从光敏装置转移的电荷,同时防止在针对二极或分离转移栅极导体结构的定时电压偏压时对光敏装置的电荷溢出。 或者,可以提供中间电荷存储装置和第二传输门装置,其可以首先临时从光敏装置接收电荷载体,并且在以另外的定时方式激活第二传输门装置时,读出存储在中间 电荷存储装置,用于传送到第二传输门装置,同时防止电荷向光感器件溢出。 APS单元结构进一步适用于全局快门操作模式,并且进一步包括遮光元件,以在电荷转移操作期间确保没有光到达光敏和电荷存储装置。