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91. 发明申请

US20160062006A1 MULTI-LAYER LARGE-FORMAT IMPRINTED STRUCTURE 审中-公开
标题翻译：多层大型格式结构
公开(公告)号：US20160062006A1
公开(公告)日：2016-03-03
申请号：US14475917
申请日：2014-09-03
申请人： Ronald Steven Cok
发明人： Ronald Steven Cok
IPC分类号： G02B5/20 , G02B5/00
CPC分类号： H05K1/092 , B29C35/0805 , B29C59/002 , B29C59/022 , B29C59/026 , B29C2035/0827 , B29C2059/023 , B29K2105/24 , B29K2995/0021 , B29L2031/3475 , G02B5/003 , G02B5/201 , G02F1/133514 , G02F1/133516 , G02F2001/133519 , G02F2201/52 , G03F7/0002 , G03F7/0007 , H05K1/111 , H05K2201/0108
摘要： A filled large-format imprinted structure includes a substrate and a first cured layer located over the substrate. One or more first micro-cavities are imprinted in the first cured layer, each first micro-cavity having a first micro-cavity width less than or equal to 20 microns. A second cured layer is located over the first layer and the one or more first micro-cavities. One or more second micro-cavities are imprinted in the second cured layer, each second micro-cavity having a second micro-cavity width less than or equal to 20 microns. A common first cured material is located in the first micro-cavity and in the second micro-cavity, thereby defining a filled large-format imprinted structure.
摘要翻译：填充的大幅面印刷结构包括基板和位于基板上方的第一固化层。一个或多个第一微腔被印在第一固化层中，每个第一微腔具有小于或等于20微米的第一微腔宽度。第二固化层位于第一层和一个或多个第一微孔之上。一个或多个第二微腔被印在第二固化层中，每个第二微腔具有小于或等于20微米的第二微腔宽度。常见的第一固化材料位于第一微腔和第二微腔中，从而限定了填充的大格式压印结构。

92. 发明申请

US20160062005A1 RIBBED LARGE-FORMAT IMPRINTING METHOD 有权
标题翻译： RIBBED大型格式化方法
公开(公告)号：US20160062005A1
公开(公告)日：2016-03-03
申请号：US14475896
申请日：2014-09-03
申请人： Ronald Steven Cok
发明人： Ronald Steven Cok
IPC分类号： G02B5/20 , G02B5/00 , B29C59/02 , B29C35/08 , B29C59/00
CPC分类号： H05K1/092 , B29C35/0805 , B29C59/002 , B29C59/022 , B29C59/026 , B29C2035/0827 , B29C2059/023 , B29K2105/24 , B29K2995/0021 , B29L2031/3475 , G02B5/003 , G02B5/201 , G02F1/133514 , G02F1/133516 , G02F2001/133519 , G02F2201/52 , G03F7/0002 , G03F7/0007 , H05K1/111 , H05K2201/0108
摘要： A method of making a filled large-format imprinted structure includes providing a substrate, locating a curable layer over the substrate, imprinting the curable layer, and curing the curable layer to form a cured layer including a layer surface and one or more imprinted micro-cavities. Each micro-cavity has a micro-cavity depth and a micro-cavity width and one or more ribs extending from the bottom of the micro-cavity toward the top of the micro-cavity. Each rib has a rib width that is less than one half of the micro-cavity width, a rib height that is less than the micro-cavity depth, and each rib separates the micro-cavity into portions, each portion having a portion width less than or equal to 20 microns. A curable material is located in each micro-cavity and cured to form cured material located in each micro-cavity, thereby defining a filled large-format imprinted structure.
摘要翻译：制造填充的大幅面印刷结构的方法包括提供基板，将可固化层定位在基板上，压印可固化层，以及固化可固化层，以形成包括层表面和一个或多个压印微孔结构的固化层，空腔每个微腔具有微腔深度和微腔宽度以及从微腔的底部向微腔的顶部延伸的一个或多个肋。每个肋具有小于微腔宽度的一半的肋宽度，小于微腔深度的肋高度，并且每个肋将微腔分隔成部分，每个部分具有部分宽度较小大于或等于20微米。可固化材料位于每个微腔中并固化以形成位于每个微腔中的固化材料，从而限定填充的大格式印刷结构。

93. 发明授权

US09235298B2 Transparent capacitor with multi-layer grid structure 有权
标题翻译：具有多层网格结构的透明电容
公开(公告)号：US09235298B2
公开(公告)日：2016-01-12
申请号：US13305815
申请日：2011-11-29
申请人： Mitchell Stewart Burberry , Ronald Steven Cok
发明人： Mitchell Stewart Burberry , Ronald Steven Cok
IPC分类号： G06F3/044 , H01G4/008 , H01G4/005 , G02F1/1343 , H05K3/02 , H05K1/16 , H05K3/46
CPC分类号： G06F3/044 , G02F1/13439 , G06F2203/04102 , G06F2203/04103 , G06F2203/04111 , H01G4/005 , H01G4/008 , H05K1/162 , H05K3/027 , H05K3/4626 , H05K3/4673 , H05K2203/107 , H05K2203/1194
摘要： A transparent capacitor apparatus includes a first transparent substrate including a first patterned conductive layer having a first conductive material located over the first transparent substrate; a dielectric layer located over the first patterned conductive layer; a second patterned conductive layer including a second conductive material located over the dielectric layer, wherein the second pattern is different from the first pattern; and a second transparent substrate located over the second patterned conductive layer. Portions of the first conductive material of the first patterned conductive layer overlap portions of the second conductive material of the second patterned conductive layer. The overlapping portions of the first and second conductive materials form matching patterned electrical conductor(s) having spatially matching conducting and non-conductive areas, the non-conductive areas of the first and second patterned conductive layers having encapsulated coalesced conductive material structures.
摘要翻译：透明电容器装置包括：第一透明基板，包括第一图案化导电层，其具有位于第一透明基板上方的第一导电材料; 位于所述第一图案化导电层上方的电介质层; 第二图案化导电层，包括位于所述介电层上的第二导电材料，其中所述第二图案不同于所述第一图案; 以及位于第二图案化导电层上方的第二透明衬底。第一图案化导电层的第一导电材料的部分重叠第二图案化导电层的第二导电材料的部分。第一和第二导电材料的重叠部分形成具有空间匹配导电和非导电区域的匹配图案化电导体，第一和第二图案化导电层的非导电区域具有封装的聚结的导电材料结构。

94. 发明授权

US09229260B2 Imprinted bi-layer micro-structure 有权
标题翻译：印刷双层微结构
公开(公告)号：US09229260B2
公开(公告)日：2016-01-05
申请号：US14012269
申请日：2013-08-28
申请人： Ronald Steven Cok
发明人： Ronald Steven Cok
IPC分类号： H05K1/11 , G02F1/1333 , G06F3/041 , H05K1/02 , H05K3/46 , H01L27/15 , H01L27/32
CPC分类号： G02F1/13338 , G06F3/041 , G06F3/044 , H01L27/15 , H01L27/32 , H01L51/5212 , H05K1/0289 , H05K3/465 , H05K2203/0108 , Y10T428/24777 , Y10T428/24802
摘要： An imprinted micro-structure includes a substrate having an edge area and a central area separate from the edge area. A cured bottom-layer, connecting layer, and top layer are formed over the substrate, each with a corresponding imprinted micro-channel having a cured micro-wire. The bottom micro-wire is in the central area and the edge area. The connecting-layer micro-wire contacts at least a portion of the bottom-layer micro-wire in the edge area. A cured edge micro-wire in the top layer contacts at least a portion of the connecting-layer micro-wire in the edge area. A top-layer micro-wire is located in a top-layer micro-channel and is separate from the edge micro-wire and bottom micro-wire. The bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire.
摘要翻译：印刷微结构包括具有边缘区域和与边缘区域分离的中心区域的基板。固化的底层，连接层和顶层形成在基板上，每个具有相应的具有固化微线的印刷微通道。底部微线在中心区域和边缘区域。连接层微线接触边缘区域中底层微线的至少一部分。顶层中的固化边缘微线与边缘区域中的连接层微线的至少一部分接触。顶层微线位于顶层微通道中，与边缘微线和底部微线分离。中心区域的底层微线电连接到边缘区域中的边缘微线，并与顶层微线电隔离。

95. 发明授权

US09215798B2 Imprinted multi-layer micro-structure method with multi-level stamp 有权
标题翻译：多层印刷多层微结构方法
公开(公告)号：US09215798B2
公开(公告)日：2015-12-15
申请号：US14012173
申请日：2013-08-28
申请人： Ronald Steven Cok
发明人： Ronald Steven Cok
IPC分类号： H01B13/00 , H05K1/02 , H05K3/46 , H05K3/12 , H05K3/00 , H05K1/09
CPC分类号： H05K1/0274 , H05K1/0298 , H05K1/097 , H05K3/0041 , H05K3/12 , H05K3/1258 , H05K3/1275 , H05K3/1283 , H05K3/1291 , H05K3/465 , H05K3/4685 , H05K2201/09209 , H05K2201/09281 , H05K2201/0979 , H05K2201/09845 , H05K2203/0108
摘要： A method of making an imprinted micro-wire structure includes providing a substrate, a first stamp, and a different multi-level second stamp. A curable bottom layer is provided over the substrate. One or more bottom-layer micro-channel(s) are imprinted in the curable bottom layer with the first stamp and a bottom-layer micro-wire formed in each bottom-layer micro-channel. A curable multi-layer is formed adjacent to and in contact with the cured bottom layer. First and second multi-layer micro-channels and a top-layer micro-channel are imprinted in the curable multi-layer with the multi-level second stamp. Either two bottom-layer micro-wires are electrically connected through the first and second multi-layer micro-wires and a top-layer micro-wire or two top-layer micro-wires are electrically connected through the first and second multi-layer micro-wires and a bottom-layer micro-wire.
摘要翻译：制造压印微线结构的方法包括提供衬底，第一印模和不同的多级第二印模。在基板上设置可固化的底层。一个或多个底层微通道被印刷在可固化底层中，第一印模和底层微线形成在每个底层微通道中。在固化的底层附近形成可固化的多层，并且与固化的底层接触。第一和第二多层微通道和顶层微通道用多级第二印记印在可固化多层中。两个底层微电线通过第一和第二多层微线电连接，并且顶层微线或两个顶层微线通过第一和第二多层微电子电连接电线和底层微线。

96. 发明授权

US09213139B2 Imprinted multi-level optical circuit structure method 有权
标题翻译：印刷多级光电路结构方法
公开(公告)号：US09213139B2
公开(公告)日：2015-12-15
申请号：US14097812
申请日：2013-12-05
申请人： Ronald Steven Cok , Todd Mathew Spath
发明人： Ronald Steven Cok , Todd Mathew Spath
IPC分类号： H01L31/12 , H01L31/18 , G02B6/13 , G02B6/122 , H05K3/12 , H01L23/538 , H01L21/768 , G02B6/42 , G06F3/044 , H05K3/32 , G02B6/12
CPC分类号： G02B6/122 , G02B6/13 , G02B6/138 , G02B6/4214 , G02B6/4274 , G02B2006/121 , G02B2006/12104 , G02B2006/12126 , G02B2006/12147 , G06F3/044 , H01L21/76895 , H01L23/5386 , H01L31/12 , H01L31/18 , H01L2924/0002 , H05K1/0274 , H05K3/10 , H05K3/101 , H05K3/1258 , H05K3/32 , H05K2201/0108 , H05K2201/09036 , H05K2201/10356 , H05K2203/0108 , H01L2924/00
摘要： A method of making an imprinted optical micro-channel structure for transmitting light to an optical receiver or receiving light from an optical transmitter includes forming a curable optical layer over a substrate and imprinting one or more optical micro-channels in the optical layer with a first stamp. The curable optical layer is cured to form a cured optical layer having the optical micro-channels imprinted in the cured optical layer. A curable light-transparent material is located in the optical micro-channels and cured to form light-pipes of cured light-transparent material in the optical micro-channels. The optical transmitter located in alignment with a light-pipe for transmitting light through the light-pipe or the optical receiver is located in alignment with a light-pipe for receiving light from the light-pipe.
摘要翻译：一种制造用于将光传输到光接收器或从光发射器接收光的压印光学微通道结构的方法包括在衬底上形成可固化的光学层，并在第一个光学层中将一个或多个光学微通道压印在光学层中邮票。固化光学层被固化以形成固化的光学层，该光学层具有印刷在固化的光学层中的光学微通道。可光固化的透光材料位于光学微通道中并固化，以在光学微通道中形成固化的透光材料的光管。与用于透过光管或光接收器透射光的光管对准的光发射器与用于接收来自光管的光的光管对准。

97. 发明申请

US20150310963A1 MAKING THIN-FILM MULTI-LAYER MICRO-WIRE STRUCTURE 有权
标题翻译：制造薄膜多层微结构
公开(公告)号：US20150310963A1
公开(公告)日：2015-10-29
申请号：US14264545
申请日：2014-04-29
申请人： ROGER G. MARKHAM , Ronald Steven Cok , Yoncai Wang , Mitchell Lawrence Wright
发明人： ROGER G. MARKHAM , Ronald Steven Cok , Yoncai Wang , Mitchell Lawrence Wright
IPC分类号： H01B5/02 , C23C18/48 , H01B19/04 , H01B1/02 , H01B1/22 , C23C18/38 , C23C18/31
CPC分类号： H01B19/04 , H01B1/02 , H01B1/22 , H05K1/097 , H05K3/1258 , H05K3/246 , H05K2203/072
摘要： A method of making a thin-film multi-layer micro-wire structure includes providing a substrate and a layer on the substrate with one or more micro-channels having a width less than or equal to 20 microns. A conductive material including silver nano-particles and having a percent ratio of silver that is greater than or equal to 40% by weight is located in the micro-channels and cured to form an electrically conductive micro-wire. The electrically conductive micro-wire has a width less than or equal to 20 microns and a depth less than or equal to 20 microns. Each micro-wire is electrolessly plated to form a plated layer located at least partially within each micro-channel between the micro-wire and the layer surface in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.
摘要翻译：制造薄膜多层微线结构的方法包括在衬底上提供具有宽度小于或等于20微米的一个或多个微通道的衬底和层。包含银纳米颗粒并且具有大于或等于40重量％的银百分比的导电材料位于微通道中并固化以形成导电微线。导电微线的宽度小于或等于20微米，深度小于或等于20微米。每个微线被无电镀以形成至少部分地位于微线和层表面之间的每个微通道中的电镀层，其与微线电接触。电镀层的厚度小于微线的厚度，使得微线和镀层形成薄膜多层微线。

98. 发明授权

US09161456B1 Making imprinted micro-wire rib structure 有权
标题翻译：制作印刷微线肋结构
公开(公告)号：US09161456B1
公开(公告)日：2015-10-13
申请号：US14476059
申请日：2014-09-03
申请人： Ronald Steven Cok , Mitchell Stewart Burberry
发明人： Ronald Steven Cok , Mitchell Stewart Burberry
IPC分类号： H01L21/4763 , H05K3/12 , H05K3/00
CPC分类号： H05K3/1258 , H05K3/0014 , H05K3/1283 , H05K2201/0108 , H05K2203/0108 , H05K2203/088
摘要： A method of making a micro-wire rib structure includes providing a substrate and locating a curable layer on or over the substrate. The curable layer is imprinted and cured to form a cured layer including a cured-layer surface and a micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A curable conductive material is located in the micro-channel and cured to provide a cured electrical conductor forming a micro-wire in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s), to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.
摘要翻译：制造微线肋结构的方法包括提供衬底并将可固化层定位在衬底上或衬底上。可固化层被印迹固化以形成固化层，该固化层包括固化层表面和具有微通道深度的微通道，微通道底部，第一和第二微通道侧，以及一个或多个肋，其具有相对的肋侧面和肋顶部限定肋高度小于微通道深度。每个肋条位于第一和第二微通道侧之间，并且从微通道底部向固化层表面延伸。可固化导电材料位于微通道中并固化以提供在微通道中形成微线的固化电导体。微线从第一微通道侧，微通道底部，肋侧和肋顶部连续延伸到第二微通道侧，从第一微通道侧形成来自第一微通道侧的连续电导体通道侧到第二微通道侧。

99. 发明授权

US09128572B2 Making touch screens with diamond-patterned micro-wire electrode 有权
标题翻译：用金刚石图案微线电极制作触摸屏
公开(公告)号：US09128572B2
公开(公告)日：2015-09-08
申请号：US13591325
申请日：2012-08-22
申请人： Ronald Steven Cok
发明人： Ronald Steven Cok
IPC分类号： H05B33/10 , G06F3/044 , H01L51/52 , H01L27/32
CPC分类号： G06F3/044 , G06F3/0412 , G06F2203/04112 , H01L27/323 , H01L51/5209 , H01L51/5225 , H01L51/5234
摘要： A method of making a display device includes providing a first substrate having an array of pixels located in correspondence thereto. The pixels are separated by inter-pixel gaps. A first electrode having a length direction is located over the first substrate and extends across at least a portion of the array of pixels, the first electrode including a plurality of electrically connected micro-wires formed in a micro-pattern. The micro-pattern has a first set of parallel micro-wires oriented at a first angle non-orthogonal to the length direction and a second set of parallel micro-wires oriented at a second angle non-orthogonal to the length direction different from the first angle. The micro-wires of the first and second sets intersect to form an array of electrically connected micro-wire intersections. At least every other micro-wire intersection on the micro-wires of the first set is located between the pixels in the inter-pixel gaps.
摘要翻译：制造显示装置的方法包括提供具有与其对应的位置的像素阵列的第一基板。像素间隔由像素间隔分开。具有长度方向的第一电极位于第一衬底之上并延伸穿过像素阵列的至少一部分，第一电极包括以微图案形成的多个电连接的微线。微型图案具有以与长度方向不正交的第一角度定向的第一组平行微细线和第二组平行微细线，其以与第一个不同于第一个长度方向的长度方向非正交的第二角度定向角度。第一组和第二组的微线相交以形成电连接的微线交点的阵列。至少在第一组的微线上的每个其他微线交叉点位于像素间间隙中的像素之间。

100. 发明申请

US20150242025A1 MAKING MICRO-WIRE ELECTRODE STRUCTURE WITH SINGLE-LAYER DUMMY MICRO-WIRES 审中-公开
标题翻译：用单层微型线制造微电线结构
公开(公告)号：US20150242025A1
公开(公告)日：2015-08-27
申请号：US14191484
申请日：2014-02-27
申请人： Ronald Steven Cok
发明人： Ronald Steven Cok
IPC分类号： G06F3/047 , G06F3/044
CPC分类号： G06F3/044 , G06F1/16 , G06F3/0412 , G06F3/0416 , G06F3/042 , G06F3/046 , G06F3/047 , G06F2203/04103 , G06F2203/04107 , G06F2203/04111 , G06F2203/04112 , H05K1/0216 , H05K1/0296 , H05K2201/10204 , Y10T29/49105 , Y10T29/49117
摘要： A method of making a micro-wire electrode structure includes providing a substrate having a surface. A plurality of first micro-wire electrodes spatially separated by first electrode gaps is located in a first layer in relation to the surface, each first micro-wire electrode including a plurality of electrically connected first micro-wires. A plurality of electrically isolated second micro-wire electrodes in a second layer is located in relation to the surface, the second layer at least partially different from the first layer and each second micro-wire electrode including a plurality of electrically connected second micro-wires. A plurality of first gap micro-wires is located in each first electrode gap, at least some of the first gap micro-wires located in a gap layer different from the first layer, the first gap micro-wires electrically isolated from the first micro-wires.
摘要翻译：制造微线电极结构的方法包括提供具有表面的衬底。通过第一电极间隙空间分隔的多个第一微线电极位于相对于表面的第一层中，每个第一微线电极包括多个电连接的第一微线。第二层中的多个电隔离的第二微线电极相对于表面定位，第二层至少部分地不同于第一层，每个第二微线电极包括多个电连接的第二微线。多个第一间隙微细线位于每个第一电极间隙中，至少一些第一间隙微线位于不同于第一层的间隙层中，第一间隙微线与第一微缝隙电绝缘，电线

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